Reactant Contains Three Or More Carboxylic Acid Groups Or Is Derivative Thereof Patents (Class 528/188)
  • Patent number: 10662555
    Abstract: The method for producing a polyimide fiber includes a coagulation step of forming a polyimide precursor fiber by extruding a polyimide precursor solution containing a polyimide precursor and a compound having an acid dissociation constant (pKa) of a conjugate acid in water at 25° C. of 6.0 to 10 inclusive and an octanol-water partition coefficient (Log P) at 25° C. of ?0.75 to 0.75 inclusive into a poor solvent or nonsolvent for the polyimide precursor; and a heat drawing step of forming the polyimide fiber by drawing the polyimide precursor fiber while heating same. The polyimide fiber of the present disclosure has a physical property such that the coefficient of thermal expansion thereof is in the range of ?15 ppm/K to 0 ppm/K inclusive.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: May 26, 2020
    Assignee: I.S.T. CORPORATION
    Inventors: Ryuta Nakagaki, Katsuki Morishima, Koji Moriuchi
  • Patent number: 9873767
    Abstract: A polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being 20 mol % or more and less than 40 mol %, and the polyimide resin satisfying predetermined conditions: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: January 23, 2018
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventor: Yuuki Sato
  • Patent number: 9617669
    Abstract: A polyimide fiber assembly of the present invention includes polyimide fibers having curved shapes with an average fiber diameter falling within a range of greater than 1 ?m to not greater than 100 ?m, the polyimide fiber assembly having a bulk density falling within a range of not less than 1 kg/m3 to not greater than 30 kg/m3. This makes it possible to realize a polyimide fiber assembly that is both excellent in thermal insulation performance and sound absorbency and light in weight.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: April 11, 2017
    Assignee: KANEKA CORPORATION
    Inventor: Kan Fujihara
  • Patent number: 9321017
    Abstract: A novel gas separation membrane having excellent gas permeability and gas separation performance, particularly carbon dioxide (CO2) permeability and excellent separation performance of carbon dioxide to methane (CH4) is provided. Moreover, a novel gas separation membrane having excellent heat resistance, chemical resistance and strength etc. is preferably provided. A gas separation membrane comprising a resin comprising a branched polybenzoxazole has excellent gas permeability and gas separation performance, particularly excellent carbon dioxide (CO2) permeability and excellent separation performance of carbon dioxide to methane (CH4). The resin comprising a branched polybenzoxazole preferably has a cross-linked structure. Furthermore, the resin comprising a branched polybenzoxazole is preferably a hybrid with silica.
    Type: Grant
    Filed: January 22, 2013
    Date of Patent: April 26, 2016
    Assignee: NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTE
    Inventors: Yasuharu Yamada, Mikako Takenaka, Tomoyuki Suzuki, Masako Miki
  • Patent number: 9200116
    Abstract: A water soluble binder composition for preparing an electrode of a rechargeable battery includes a binder and a conductive agent, the binder including a water soluble polyamic acid having an acid equivalent of about 300 to about 600 g/eq.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: December 1, 2015
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Hyesun Jeong, Beomwook Lee, Hyeran Lee
  • Patent number: 9161440
    Abstract: An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4?-oxydiphthalic anhydride, 3,3?-oxydiphthalic anhydride, 4,4?-oxydiphthalic anhydride, and combinations thereof, and a diamine component. The polyetherimide has a glass transition temperature that is at least 190° C. The film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight. The film has less than 15 molar % of a member selected from the group consisting of biphenyltetracarboxylic acid, dianhydrides of biphenyltetracarboxylic acid, esters of biphenyltetracarboxylic acid, and combinations thereof.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: October 13, 2015
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Kwok Pong Chan, Erik Hagberg, Tara J. Mullen, Roy Ray Odle
  • Patent number: 9023976
    Abstract: The Michael reaction is employed, for example, to condense methyl acrylate with diethyl malonate to prepare the corresponding tetra-ester. Subsequent reaction with primary amines followed by thermal condensation results in spiroimides. A similar series of reaction steps can be performed starting with malonamides.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: May 5, 2015
    Inventor: Robert Bernard Login
  • Patent number: 8975365
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: March 10, 2015
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Publication number: 20150045502
    Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), ? represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
    Type: Application
    Filed: March 28, 2013
    Publication date: February 12, 2015
    Applicant: TORAY Industries, Inc.
    Inventors: Daichi Miyazaki, Masao Tomikawa
  • Patent number: 8927678
    Abstract: A thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (2) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70% by mol: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 12 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: January 6, 2015
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Yuuki Sato, Jun Mitadera
  • Publication number: 20140296362
    Abstract: The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.
    Type: Application
    Filed: May 3, 2013
    Publication date: October 2, 2014
    Applicant: LG CHEM, LTD.
    Inventors: Jung-Hak Kim, You-Jin Kyung, Hee-Jung Kim, Kwang-Joo Lee
  • Publication number: 20140200325
    Abstract: A thermoplastic polyimide resin containing a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of formula (1) with respect to the total of the repeating structural unit of formula (1) and the repeating structural unit of formula (2) being from 40 to 70% by mol: wherein R1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R2 represents a divalent chain aliphatic group having from 5 to 12 carbon atoms; and X1 and X2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring.
    Type: Application
    Filed: February 5, 2013
    Publication date: July 17, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuuki Sato, Jun Mitadera
  • Publication number: 20140144325
    Abstract: A gas separation membrane having a polyimide structure.
    Type: Application
    Filed: April 23, 2013
    Publication date: May 29, 2014
    Inventor: Central Glass Company, Limited
  • Publication number: 20140114027
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Application
    Filed: December 31, 2013
    Publication date: April 24, 2014
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Publication number: 20140093715
    Abstract: Objects of the present invention are: to obtain a polyimide that is excellent in heat resistance, transparency, and optical isotropy and is soluble in an organic solvent; to provide, by using either a polyimide or a polyamic acid which is a precursor or the polyimide, a product or a member that is highly required to have heat resistance and transparency; and particularly to provide a product and a member both of which are obtained by applying a polyamic acid solution and a polyimide solution of the present invention to the surface of an inorganic substance such as glass, metal, metal oxide, or a single crystal silicon. These objects can be attained by a polyimide acid and a polyimide which are each prepared from an alicyclic tetracarboxylic dianhydride and a monomer having a fluorene structure.
    Type: Application
    Filed: June 12, 2012
    Publication date: April 3, 2014
    Applicant: KANEKA CORPORATION
    Inventors: Mari Fujii, Shinji Ozawa
  • Patent number: 8658743
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 25, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Publication number: 20120108759
    Abstract: A cage 1,2,3,4-cyclopentanetetracarboxylic acid (1,3:2,4)-dianhydride compound represented by formula [1], and a polyimide obtained by condensing the compound with a diamine. With the compound, it is possible to provide a polyimide which shows no absorption in the ultraviolet region and is highly transparent to light, has high insulating properties, has improved heat resistance and processability, and has excellent solubility in organic solvents. (In formula [1], R1 and R2 each independently represents a hydrogen atom, a halogen atom, or a C1-10 alkyl.
    Type: Application
    Filed: April 6, 2010
    Publication date: May 3, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Hideo Suzuki, Takahiro Noda
  • Publication number: 20120012366
    Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: LG CHEM, LTD.
    Inventors: Kwang-Joo LEE, You-Jin Kyung, Joo-Eun Ko, Heon-Sik Song, Jung-Jin Shim, Hee-Jung Kim
  • Publication number: 20120016076
    Abstract: In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.
    Type: Application
    Filed: July 13, 2011
    Publication date: January 19, 2012
    Applicant: LG CHEM. LTD.
    Inventors: Sang Woo KIM, Se Jin SHIN, Dong Hyun OH, Kyung Jun KIM
  • Patent number: 8030437
    Abstract: A method for forming a polyimide composite article utilizes a polyimide resin system including at least a first prepolymer component and a second prepolymer component. A preform structure is tackified with the first prepolymer component. Using resin infusion or resin transfer molding techniques, the tackified preform structure is contacted with the second prepolymer component. The polyimide resin system is cured under suitable cure conditions so that the first and second prepolymer components mix and react to produce the polyimide composite structure.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 4, 2011
    Assignee: General Electric Company
    Inventors: Stephen Mark Whiteker, Lisa Vinciguerra Shafer, Warren Rosal Ronk
  • Publication number: 20110230605
    Abstract: Disclosed herein are polymer compounds and a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.
    Type: Application
    Filed: May 20, 2011
    Publication date: September 22, 2011
    Applicant: Industry-University Cooperation Foundation, HANYANG UNIVERSITY
    Inventors: Young-Moo Lee, Ho-Bum Park, Chul-Ho Jung, Sang-Hoon Han
  • Patent number: 7989578
    Abstract: The present invention relates to a negative photosensitive polyimide polymer having a repeating unit of formula (1) as a polymerized unit: wherein G, Q and P* are as defined in the specification. The polyimide polymer of the present invention is developable in an aqueous alkaline solution, and has the properties associated with an insulating layer and photoresist.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: August 2, 2011
    Assignee: Eternal Chemical Co., Ltd.
    Inventor: Chung-Jen Wu
  • Patent number: 7964698
    Abstract: The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: June 21, 2011
    Assignee: United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Erik S. Weiser, Theodorus J. Dingemans, Terry L. St. Clair, Jeffrey A. Hinkley
  • Publication number: 20110136061
    Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.
    Type: Application
    Filed: December 6, 2010
    Publication date: June 9, 2011
    Inventor: Hiroshi ITATANI
  • Patent number: 7825211
    Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: November 2, 2010
    Assignee: The Boeing Company
    Inventors: Hyman Ralph Lubowitz, Thomas Karl Tsotsis
  • Patent number: 7669720
    Abstract: Membranes comprising functional polyarylether having structural units of formula I are useful for hemodialysis and hemofiltration: wherein X is selected from Br, NR4R5, OOCR6, OR7, NR4CONR5R6, NR4COOR5R6 and combinations thereof; R1, R2 and R3 are independently at each occurrence CH2X, H, halo, cyano, nitro, a C1-C12aliphatic radical, a C3-C12cycloaliphatic radical, a C3-C12aromatic radical or a combination thereof; R4 and R5 are independently H, a C1-10 aliphatic radical, a C3-C12cycloaliphatic radical, a C3-C12 aromatic radical, or a combination thereof; R6 is H, a C2-10 aliphatic radical, a C3-C12 cycloaliphatic radical, a C3-C12 aromatic radical or a combination thereof; R7 is OCH2CH2(OCH2CH2)nOH or OOCCH2(OCH2CH2)nCH3; Z is a direct bond, O, S, SO, SO2, CO, phenylphospinyl oxide, alkenyl, alkynyl, a C1-C12aliphatic radical, a C3-C12cycloaliphatic radical, a C3-C12 aromatic radical or a combination thereof; a, b, and c are independently 1 or 2; and m, n and p are independently 0 or 1.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: March 2, 2010
    Assignee: General Electric Company
    Inventors: Yanshi Zhang, Daniel Steiger, Joseph Anthony Suriano, Gary William Yeager
  • Patent number: 7459518
    Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: December 2, 2008
    Assignee: Industrial Technology Research Institute
    Inventors: Shu-Chu Shih, Charng-Shing Lu, Jinn-Shing King
  • Publication number: 20080142443
    Abstract: Membranes for use in methods and apparatuses for hemodialysis and hemofiltration are composed of at least one membrane comprising a polyarylethernitrile having structural units of formula 1, 2, 3 and 4 wherein Z is a direct bond, O, S, CH2, SO, SO2, CO, RPO, CH2, alkenyl, alkynyl, a C1-C12aliphatic radical, a C3-C12cycloaliphatic radical, a C3-C12aromatic radical or a combination thereof; R is a C6-12aromatic radical or a C1-12aliphatic radical; R1 and R2 are independently H, halo, nitro, a C1-C12aliphatic radical, a C3-C12cycloaliphatic radical, a C3-C12aromatic radical, or a combination thereof; a is 0, 1, 2 or 3; b is 0, 1, 2, 3 or 4; m and n are independently 0 or 1; and Q and Z are different.
    Type: Application
    Filed: December 15, 2006
    Publication date: June 19, 2008
    Applicant: GENERAL ELECTRIC
    Inventors: Daniel Steiger, Gary William Yeager, Yanshi Zhang
  • Patent number: 7361727
    Abstract: A polymerization process to derive a thermal-stabilized poly(1,4-dioxan-2-one) and cyclic ester monomer copolymer using a coordination-insertion catalyst/initiator. 1,4-dioxan-2-one and cyclic ester monomer, each containing less than 100-ppm water and having an acid value less than 0.5 mg KOH/g, and preferably less than 0.2 mg KOH/g, are copolymerized. Preferably the cyclic ester monomer is ?-caprolactone and the reaction is in an extruder.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: April 22, 2008
    Assignee: Board of Trustees of Michigan State University
    Inventors: Ramani Narayan, Jean-Marie Raquez, Sunder Balakrishnan, Philippe Dubois, Philippe Degee
  • Patent number: 7186454
    Abstract: A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hydrocarbon group or R4; R1, R2, R3 and R4 and are each independently a protected or unprotected carboxyl group, etc.; and Y1, Y2, Y3 and Y4 are each independently a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine derivative represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R5, R6, R7 and R8 are each a substituent bound to Ring Z and are each independently a protected or unprotected amino group, etc., dissolved in the organic solvent.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: March 6, 2007
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Shinya Nagano, Jiichiro Hashimoto, Kiyoharu Tsutsumi, Yoshinori Funaki
  • Patent number: 7169878
    Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: January 30, 2007
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata
  • Patent number: 7129318
    Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Patent number: 7105211
    Abstract: A liquid crystal alignment treating agent for optical alignment treatment, whereby it is possible to obtain a liquid crystal alignment film which presents a high and stable tilt angle of liquid crystal and which is excellent in an accumulated charge property by a DC voltage, is provided.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: September 12, 2006
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Tetsuya Imamura, Hideyuki Nawata, Hideyuki Endo
  • Patent number: 7090925
    Abstract: A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 and Y4 are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R1 and R2 are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: August 15, 2006
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Shinya Nagano, Jiichiro Hashimoto, Kiyoharu Tsutsumi, Yoshinori Funaki
  • Patent number: 7090900
    Abstract: A liquid crystal alignment treating agent containing a polyamic acid which is represented by the following formula (I) and exhibits a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methyl-2-pyrrolidone at 30° C. at a concentration of 0.5 g/dl) or a polyimide obtained by cyclodehydration thereof: wherein R1 represents a tetravalent organic group, at least 20 mol % of which has a fused alicyclic structure composed of two to five rings, and all of the carbonyl groups are directly bonded to the alicyclic structure and that any two carbonyl groups are not bonded to adjacent carbon atoms of the alicyclic structure; R2 is a bivalent organic group, from 20 to 100 mol % of which has in the side-chain structure at least one structural unit selected from the group consisting of C5-20 long-chain alkyl, C5-20 fluoroalkyl, alicyclic structures and aromatic ring structures; and L is a positive integer.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: August 15, 2006
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Go Ono, Kio Mizuno, Hideyuki Endo
  • Patent number: 7074882
    Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 11, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
  • Patent number: 7074880
    Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: July 11, 2006
    Assignee: Aspen Aerogels, Inc.
    Inventors: Wendell Rhine, Jing Wang, Redouane Begag
  • Patent number: 7071282
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: July 4, 2006
    Assignee: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 7053168
    Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: May 30, 2006
    Assignee: General Electric Company
    Inventors: Norberto Silvi, Mark Howard Giammattei, Paul Edward Howson, Farid Fouad Khouri
  • Patent number: 7041778
    Abstract: A novel polyimide resin consisting essentially of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,4,3?,4?-biphenyltetracarboxylic dianhydride (BPDA), 2,2 bis (3?,4?-dicarboxy phenyl) hexafluoro propane dianhydride (6FDA), 2-(3,4-dicarboxyphenyl)-1-phenylacetylene anhydride (4-PEPA) and an aromatic diamine.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: May 9, 2006
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: David B. Curliss, Jason E. Lincoln, Katie E. Thorp
  • Patent number: 7041773
    Abstract: Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group concentration of less than about 120 milliequivalents/kilogram resin. The resins have high heat capability and good melt stability. Methods to prepare the said resins and articles made from the resins are also provided.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: May 9, 2006
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle
  • Patent number: 7026436
    Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 11, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Patent number: 7022809
    Abstract: The present invention relates to novel polyimides derived from 6FDA and from 3,3-dihydroxy-4,4?-diaminobiphenyl and novel polyimides derived from PMDA and from Bis-AP-AF, having alkyl, arylalkyl, heteroarylalkyl, (cycloalkyl)alkyl, fluoroalkyl or siloxane side groups. The present invention also relates to a method of producing nematic liquid-crystal devices, which comprises the steps consisting in: depositing one of the polyimides according to the invention on a substrate; annealing the polyimide in one or more steps; and defining an azimuthal orientation of the polyimide coating.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: April 4, 2006
    Assignee: Nemoptic
    Inventors: Sandrine Lamarque, Jean-Claude Dubois, Didier Gallaire
  • Patent number: 7019103
    Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: March 28, 2006
    Assignees: JSR Corporation, Ube Industries, Ltd.
    Inventors: Rikio Yokota, Kohei Goto, Hideki Ozawa
  • Patent number: 7015304
    Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1–60 poise at 260–280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100–500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232–280° C. (450–535° F.) without any solvent.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: March 21, 2006
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6998464
    Abstract: The present invention relates to a method of preparing a solution of a polymer comprising recurring azole units, which comprises dissolving a sufficiently dried polymer comprising recurring azole units of the formula where the radicals Ar, Ar1 and Ar2 are tetravalent, divalent or trivalent aromatic or heteroaromatic groups and the radicals X, which are identical within a repeating unit, are each an oxygen atom, a sulfur atom or an amino group bearing a hydrogen atom, a group having 1–20 carbon atoms, preferably a branched or unbranched alkyl or alkoxy group, or an aryl group as further radical, in N,N-dimethylacetamide having a sufficiently low water content at a temperature above room temperature under an inert gas atmosphere, wherein a sufficiently dried polymer comprising recurring azole units of the formula (1) or (2) of which 90% by weight based on the total weight of the polymer comprising recurring azole units has a particle size of less than 1 mm is used.
    Type: Grant
    Filed: October 20, 2001
    Date of Patent: February 14, 2006
    Assignee: PEMEAS GmbH
    Inventors: Thomas Guth, Jürgen Pawlik, Reiner Tiefenstädter, Peter Brendel, Frauke Jordt
  • Patent number: 6984714
    Abstract: This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: January 10, 2006
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Kiwamu Tokuhisa, Hongyuan Wang
  • Patent number: 6979721
    Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: December 27, 2005
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Aryeh A. Frimer
  • Patent number: 6949619
    Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: September 27, 2005
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Nobuhiro Ichiroku, Masachika Yoshino, Hideki Akiba, Toshio Shiobara
  • Patent number: RE43880
    Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280° C. (450-535° F.) without any solvent.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: December 25, 2012
    Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang