Abstract: An adhesive copolyamide composition having a dry powder DSC melting point of at least 100.degree. C., a glass transition temperature above 60.degree. C., a dry powder softening point of at least 100.degree. C., preferably a water content after storage in water of more than 20% by weight, and a wet softening point of less than 100.degree.. Such compositions exhibit softening points and heat resistances in excess of 100.degree. C. and can be processed and set at substantially lower temperatures. No low molecular weight additives are required nor are any solvents necessary. The compositions are comparable in their heat-resistance, softening points, and bond strength to conventional high performance hot melt adhesives.

Abstract: A copolyamide resin containing a dimerized fatty acid as a copolymer component, which has (1) at least 25 equivalent %, based on the total number of terminal groups, of hydrocarbon groups having from 6 to 22 carbon atoms at its terminals, (2) a content of a dimerized fatty acid of from 0.1 to 40% by weight based on the total amount of the resin, and (3) a melt viscosity as measured at 240.degree. C. of from 2,000 to 15,000 poise.

Abstract: Polyamides having improved solubility and processing characteristics are provided having incorporated into the polymeric chain a novel aromatic diamine compound, 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoropropane (3-4'-6F Diamine). The polyamides are prepared by reacting the 3,4'-6F Diamine with an aliphatic or aromatic di-acid or acid halide. It has been found that the polyamides of this invention have improved solubility characteristics, low dielectric constants and improved thermal flow properties as a consequence of the meta/para positioning of the amino groups on the daimine, which renders these polymers more readily melt spinnable for the production of fibers. The polymers may also be compression molded and fabricated into composites at moderate temperatures and pressures.

Abstract: Thermoplastic polyamide resins with improved low-temperature flexibility and improved bonding properties consisting essentially of polycondensates of the following components:(a) 10 to 50 mol-% of a dimer fatty acid or mixture of such acids,(b) 5 to 45 mol-% of polyoxyalkylene urea diamine,(c) 0 to 25 mol-% of an aliphatic C.sub.6 -C.sub.22 dicarboxylic acid or mixture of such acids,(d) 0 to 45 mol-% of an aliphatic, aromatic or cyclic C.sub.2 -C.sub.40 diamine or a mixture of such diamines selected from the group comprising diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms at the nitrogen atom, and heterocyclic diamines capable of double amide formation.Preferred resins are base-terminated resins having amine values of up to 50 and acid-terminated resins having acid values of up to 20 and a molecular weight within the range from 5000 to 20,000 and preferably from 8000 to 15,000.

Abstract: A gas-barrier multilayered structure comprising (A) at least one layer of a copolyamide composed of (a) a dicarboxylic acid component composed of 55 to 70 mole % of an aliphatic dicarboxylic acid component and 45 to 30 mole % of an aromatic dicarboxylic acid component consisting substantially of 20 to 30 mole % of isophthalic acid and 5 to 20 mole % of terephthalic acid, and (b) a diamine component composed substantially of a m-xylylenediamine component, and (B) at least one layer of a thermoplastic resin other than the copolyamide.

Abstract: A transparent polyamide containing terephthalic acid radicals or radicals of the mixture of terephthalic and isophthalic acids and a cycloaliphatic diamine radical and having the chain formations: ##STR1## in which: y.sub.1 +y.sub.2 is between 10 and 200 with y.sub.1 /(y.sub.1 +y.sub.2)>0.5;m, p, m' and p' are whole numbers equal to or greater than zero, such that: ##EQU1## is between 0.5 and 10, taken statistically over the marcomolecule; Z and Z' are the same or different and are either a polymethylene segment --(CH.sub.2)--.sub.

Abstract: Polyamide hot-melt adhesives are prepared from condensation of a mixture of polymeric fatty acids and 1,18-octadecane-dicarboxylic acid or 1,16-hexadecanedicarboxylic acid and a substantially equivalent proportion of a polyamine.

Abstract: A polymer has a linear recurring unit in which a first organic group (R.sub.1) having at least two carbon atoms and a valence of at least three and a second organic group (R.sub.2) having at least two carbon atoms and a valence of at least two are bonded together alternatively through a divalent connecting group, and containing at least one hydrocarbon group (R.sub.3) having 10 to 30 carbon atoms which is linked to the recurring unit by an ionic bond and which may be substituted.

Abstract: The invention relates to a novel grade of copolymides of tetramethyleneadipamide (nylon 4.6) and tetramethyleneterephthalamide (nylon 4.T) containing a mole fraction nylon 4.T of 0.1 to 0.6 and having such a degree of orientation that the melting temperature shows little dependence on the composition of the copolyamide and remains relatively low and which copolyamides have good mechanical properties.

Abstract: Polyphthalamides which, when filled, have heat deflection temperatures of at least about 240.degree. C. are prepared from compounds of terephthalic acid and isophthalic acid in a ratio of about 70:30 to about 99:1 in combination with a diamine which comprises hexamethylene diamine.

Abstract: Hot melt polyamide adhesive compositions are disclosed which exhibit long open assembly times. The polyamides are the condensation products of an acid component consisting essentially of a polymeric fatty acid and a dicarboxylic acid, and an amine component consisting essentially of a cyclic diamine, a non-cyclic aliphatic diamine and, optionally, additional organic diamines.

Abstract: The invention relates to a copolyamide for application in films with improved barrier properties. The copolyamide containing tetramethyleneadipamide and tetramethylene-isophtalamide in a ratio between 9:1 and 1:9 and a relative viscosity of at least 2.0, and a process for the production of the copolyamide. Preferably the copolyamide contains a small amount of a compound that induces the formation of networks between the polyamide chains.

Abstract: Transparent copolyamides with very good processibility, very good mechanical properties, excellent transparency and hydrolysis stability in boiling water, and alloyability with other polyamides, are obtained through polycondensation of alkyl derivatives of dicycane and additional polyamide-forming components, together with isophthalic acid and an .omega.-aminocarboxylic acid or its lactam with more than 8 C-atoms, or salts thereof, or a stoichiometric mixture of an aliphatic dicarboxylic acid and an aliphatic diamine.The copolyamides of the invention are excellently suitable for the production of molded articles, thanks to their low processing viscosity.

Abstract: A process for preparing condensation polymers comprises forming a dispersion of a reaction mixture in a continuous vapor phase, maintaining the dispersion while passing it through a reaction zone, heating the dispersion in the reaction zone to polymerize reactants in the reaction mixture and form a polycondensate.

Abstract: Water soluble polyamide resins are produced from an excess aromatic dicarboxylic acid and a diamine. The resin can be used in inks.

Abstract: A heat-resistant polyamide having a repeating unit represented by the formula (I):--X--NH--Y--NH--(I)wherein X represents the structure (A): ##STR1## or the structure (A) and the structure (B) --C.sub.m H.sub.2m -- wherein R represents hydrogen, methyl, or ethyl and m is an integer of 2 to 8; and Y represents the structure (C) ##STR2## and the structure (D) --CO--C.sub.n H.sub.2n --CO-- wherein n is 2 to 6, provided that Y may be the structure (C) when X is the structures (A) and (B), said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.25 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide.

Abstract: Disclosed herein is a transparent copolyamide which comprises constitutional units derived from a diamine component comprising (a) bis(3-methyl-4-aminocyclohexyl)methane and (b) hexamethylenediamine and a dicarboxylic acid component comprising (c) isophthalic acid and (d) terephthalic acid, the molar ratio of said components simultaneously satisfying the following two formulas:(a):(b)=3:97 to 18:82(c):(d)=60:40 to 90:10and relative viscosity of said copolyamide being 1.9 to 2.5 as measured at 25.degree. C. and a concentration of 1 g/dl in 98% concentrated sulfuric acid.The transparent copolyamide according to the present invention shows a sufficient resistance to alcohols, a sufficient resistance to boiling water and high moldability, therefore, is useful as the material for molded articles such as parts in automobiles, electronic and electric appliances and machines.

Abstract: Polyamides containing carboxyl groups which, after neutralization with a base, are dilutable with water and which are the products of condensing (1) an amine mixture comprising trifunctional and difunctional amines with (2) an excess of an acid mixture consisting of isophthalic acid and a dimerzied fatty acid and/or a C.sub.6 -C.sub.12 aliphatic dicarboxylic acid.

Abstract: The present invention relates to a class of compounds which have superior soil release properties over heretofore known soil release polymers. The compounds are prepared by the reaction of an aromatic hydroxy containing polyester soil release agent with trimellitic anhydride under acid catalysis to produce an aromatic terminal capped carbonyloxy soil release polymer.

Abstract: Process for the preparation of copolyamides from adipic acid, terephthalic acid and hexamethylene diamine containing 25-48% by weight of units of hexamethylene terephthalamide, by precondensing the monomers at a temperature of at least 250.degree. C. and a pressure of at least 35 bar and completing the polycondensation in the usual manner.

Abstract: A polyamide composition comprising a polycondensate of 60 to 100 mole % of terephthalic acid component units and 40 to 0 mole % of units of an aromatic carboxylic acid other than terephthalic acid with an aliphatic alkylene-diamine having 6 to 18 carbon atoms and having a gel proportion of 6 to 90% as measured at 50.degree. C. in concentrated sulfuric acid.

Abstract: Novel, homogeneous and flexible block copolyetheramides, having a melting point of at least 150.degree. C., a glass transition temperature not exceeding -5.degree. C. and a melt viscosity of at least 100 poises, are preferably prepared by prepolymerizing a mixture of a salt of a short-chain aliphatic dicarboxylic acid and a short-chain aliphatic diamine with a fatty acid(s) dimer or amino derivative thereof, and then polycondensing the prepolymer in the presence of a strong organic or inorganic oxyacid, with a polyoxyalkylenediamine or a polyoxyalkylenedicarboxylic acid having a number-average molecular weight ranging from 300 to 1200.

Abstract: Transparent copolyamides with very good processibility, very good mechanical properties, excellent transparency and hydrolysis stability in boiling water, and alloyability with other polyamides, are obtained through polycondensation of alkyl derivatives of dicycane and additional polyamide-forming components, together with isophthalic acid and an .omega.-aminocarboxylic acid or its lactam with more than 8 C-atoms, or salts thereof, or a stoichiometric mixture of an aliphatic dicarboxylic acid and an aliphatic diamine.The copolyamides of the invention are excellently suitable for the production of molded articles, thanks to their low processing viscosity.

Abstract: Polyamide resins are prepared from aromatic dicarboxylic acids and which are substantially free of dimeric or higher polymeric fat acids. The resins generally have improved alkaline water solubility or dispersibility having substantially lower solution viscosities than prior polyamide resins. The harder resins with their water solubility find particular utility as ink binders. The softer resins find utility as a film layer bonding two flexible substrates.

Abstract: Process for the preparation of polyamides from 1,4-diaminobutane and adipic acid, wherein a 40 to 70% strength aqueous solution of the monomers is heated at 280.degree.-320.degree. C., preferably 290.degree.-310.degree. C., for a period of 5 to 30 minutes under a pressure of less than 8 bar, to give a precondensate having a relative viscosity of 1.05 to 2.0, and solid phase after-condensation at 180.degree.-260.degree. C.

Abstract: Yarns of copoly(p-phenylene terephthalamide/2,6-naphthalamide) are disclosed which exhibit toughness and tenacity greater than the toughness and tenacity of yarns of poly(p-phenylene terephthalamide) having the same dimensions and made by the same process.

Abstract: Polyamide resins useful as binders in flexographic/gravure inks are provided which are essentially free of polyeric fat acids. These polyamide resins exhibit improved water solubility, yet still retain the other many desirable properties of polyamide resins based on polymeric fat acids. The resins are acid terminated having acid values greater than 30 and are prepared from medium chain (12-26 carbons) dicarboxylic acids such as the C.sub.21 acid, 2-n-hexyl-5-(7-carboxyl-n-heptyl)-cyclohex-3-ene carboxylic acid, and aliphatic diamines having from 2-12 carbon atoms.

Abstract: A process for the production of copolyamides from aromatic dicarboxylic acids, adipic acid, and hexamethylene diamine having from 30 to 51.5% by weight of units of the hexamethylene adipic acid amide, the monomers being precondensed at at least 250.degree. C. and under a pressure of at least 35 bars and the polycondensation being conducted in a conventional manner to completion.

Abstract: A method for making an electrical inductive device for use in hermetic atmospheres which incorporate refrigerants such as halogenated methane compositions, for example refrigerant R-22, monochlorodifluoromethane. The device may be a wound coil device formed of magnet wire, the enamel coating of which has resistance to blistering when exposed to refrigerants under saturated conditions at temperatures up to about 200.degree. or 210.degree. C. and above. The enamel coating composition or wire enamel is formed as the reaction product of 1,2,3,4-butanetetracarboxylic dianhydride, optionally with an aromatic dianhydride, and a diamine such as p,p'-methylenedianiline or p,p'-oxydianiline, in an organic solvent such as N-methyl-2-pyrrolidone.

Abstract: The present invention provides polyamide resins useful for forming containers having improved resistance to gas permeability. The containers are formed from a polyamide resin which comprises the reaction product of a diamine containing 2 to about 10 carbon atoms and a diacid component which comprises about 25 to 95 mole percent of a first diacid selected from 1,4-phenylenedioxy diacetic acid, 1,3-phenylenedioxy diacetic acid, 1,2-phenylenedioxy diacetic acid, and mixtures thereof, and about 5 to about 75 mole percent of a naphthalene dicarboxylic acid. The polyamide resin has an inherent viscosity of about 0.5 to 1.5. The containers which are provided by the present invention may be in the form of sheet, film, molded articles, such as bottles, and other such structures.

Abstract: Aromatic polythioetheramide polymers having a repeating unit represented by the formulae as shown below and a process for the production thereof are described. These polymers have excellent moldability, flame retardance, heat resistance, and chemical resistance, and are suitable for use as engineering plastics: ##STR1## wherein all the symbols are the same as defined in the specification and claims.

Abstract: A crystalline polyamide which has improved tensile strength and which has a heat deflection temperature in excess of 240.degree. C. when filled is formed from dicarboxylic acid compounds comprising compounds of terephthalic acid and isophthalic acid in a molar ratio of at least 80:20 to about 99:1 and diamines comprising hexamethylene diamine and trimethylhexamethylene diamine in a molar ratio of about 98:2 to about 60:40.

Abstract: An essentially linear resin having a plurality of amide, imide and ester groups therein comprising the condensation product of at least one polycarboxylic acid five member ring-forming reactant, at least one ethylenically unsaturated polycarboxylic acid five or six member ring lactam-forming reactant, at least one polyfunctional hydroxy compound, at least one difunctional amino five or six member ring forming reactant, at least one polycarboxylic acid reactant having no more than two carboxylic acid ester forming radicals, and at least one polycarboxylic acid reactant having two or more carboxylic acid ester forming radicals with at least two of the radicals in the 1,2 position relative to each other. The method of forming a solution of a prepolymer having a plurality of amide, imide and ester groups therein in cresylic acid or glycol ether solvents and reacting the same with at least one ethylenically unsaturated polycarboxylic acid five or six member ring forming reactant at elevated temperatures.

Abstract: Novel crystalline polyamides having high heat deflection temperatures when filled are prepared from aliphatic diamines and either mixtures of terephthalic acid and adipic acid or mixtures of terephthalic acid, isophthalic acid and adipic acid. The mole ratio of aliphatic diamine to terephthalic acid, isophthalic acid, and adipic acid is in the range of about 100:65-95:25-0:35-5. The polyamides can be filled with about 10 to about 60 parts by weight of a filler. The mechanical properties of these polyamides are largely unaffected by absorbed water.

Abstract: A process for the manufacture of polyamides, polyamide-imides and polyimides which process comprises preparing a salt of an aliphatic or aromatic diamine or a mixture of these and di, tri or tetracarboxylic acid or mixture of these or their corresponding anhydride by reacting both feedstocks at a temperature of about 300.degree. to 500.degree. F. in a solvent medium provided the water content of the resulting solution is below 25% water by weight the resulting salt solution is subjected to a pressure of about 1500-3000 psig and is then passed through a preheat zone where the temperature is increased to about 625.degree. F., the total residence time is kept at about 25 to about 50 seconds. The reactants are flashed through a control valve or nozzle to give an aerosol mist at a pressure of about 0-400 psig, the polymerization is further carried out in a flash reactor with a high heat flux and with wall temperatures of about 600.degree. F. to about 1000.degree. F. and melt temperatures of about 500.degree. F.

Abstract: There is disclosed a group of poly(ester-amide) compositions which possess unexpectedly good low temperature adhesive properties with respect to vinyl based substrates. These poly(ester-amide) compositions are the reaction product of a polymeric fatty acid, with an organic diamine, dicarboxylic acid and an alkanolamine having the general formula: ##STR1## wherein R.sub.2 represents alkylene of 2 to 8 carbons, and R.sub.1 is selected from the group consisting of hydrogen and a monovalent moiety of the formula:R.sub.3 --CH.sub.2 --CH.sub.2 -- (II)wherein R.sub.3 is selected from hydroxyl and amino groups.The term "alkylene of 2 to 8 carbons" as used throughout the specification and claims means a divalent moiety of the formula:--CH.sub.2 --CH.sub.2).sub.n CH.sub.2 -- (III)wherein n is an integer of from 0 to 6. N-(2-hydroxyethyl)-piperazine is a preferred compound of the alkanolamine group.

Abstract: The invention relates to laminated films and articles of manufacture based on such films and having improved resistance to heat treatment, wherein said films comprise a heat sealing layer of copolyamide obtained by random copolymerization of precursor monomers of at least two different polyamides. Said laminated films, or the articles of manufacture formed therefrom, such as bags or preformed containers, are useful for packaging applications, particularly in connection with food products.

Abstract: Melt-processable polyamides are prepared smoothly and rapidly by interchange of diesters of dicarboxylic acids with diamines in a solventless melt phase process.

Abstract: A process for producing an aromatic polyamide film, which comprises drawing an undrawn aromatic polyamide film biaxially at a draw ratio of at least 1.5 in a solvent mixture consisting of (a) 5% to 75% by weight of a good solvent of the aromatic polyamide and (b) 25% to 95% by weight of a non-solvent of the aromatic polyamide, and heat treating the drawn film, which contains at least 1% by weight, based on the weight of the film, of a good solvent of said aromatic polyamide, at a temperature of not lower than 150.degree. C.An m-phenyleneisophthalamide polymer film having extremely excellent dimensional stability under moist conditions, which film has a density d of from 1.35 to 1.41 g/cm.sup.3 and principal refractive indices n.sub..alpha., n.sub..beta. and n.sub..gamma. (n.sub..alpha. >n.sub..beta. >n.sub..gamma.

Abstract: The invention includes novel dicarboxylic acids derived from alkylene or arylene diaminetetraacetec acid corresponding to the formula ##STR1## These dicarboxylic acids derived from alkylene or arylene diaminetetraacetic acid are useful in the preparation of polyamides.Another aspect of the invention is a polymer prepared from between about 1 and 100 mole percent of the diamine salt of the compound represented by formula (I) ##STR2## These polymers are useful in preparing molded articles.

Abstract: A biaxially-oriented amorphous polyamide film and the preparation thereof are described. The film exhibits good physical and optical properties. In a specific embodiment, the amorphous polyamide is a product of the polymerization of 2,2-bis(4-aminocyclohexyl)propane with a mixture of adipic acid and azelaic acid. The polymer is extruded as a sheet and biaxially oriented under described conditions to produce a clear film having a high glass transition temperature and improved elongation properties.

Abstract: Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acids and one or two aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester-imide, or polyamide-imide.

Abstract: Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamide-imide.

Abstract: This invention describes a process for preparing polyamides comprising contacting a dinitrile, a diamine and water in the presence of a dicarboxylic acid. In one embodiment, nylon-6,6 is prepared by contacting adiponitrile, hexamethylene diamine and water in the presence of adipic acid.

Abstract: In the batch melt polymerization process for preparing 6TA/6IA copolymer having a high 6TA content, i.e., greater than 45%, successive batches of copolymer can be prepared without cleaning out the autoclave between successive batches by conducting the preparation of each batch in the presence of a small amount of a base, for example, sodium hydroxide.

Abstract: Crystalline copolyamides from terephthalic acid and mixtures of hexamethylenediamine and trimethylhexamethylenediamine and filled molding compositions prepared therefrom are disclosed. The injection moldable crystalline copolyamides in molded form are useful in engineering resin applications such as the hood of an automobile, a shroud for a lawn mower, chain saw guard, etc.

Abstract: Novel crystalline copolymers having heat deflection temperatures in excess of 305.degree. C. and prepared from hexamethylene diamine, trimethylhexamethylene diamine and either mixtures of terephthalic acid and adipic acid or mixtures of terephthalic acid, isophthalic acid and adipic acid. The high heat deflection of these polyamides enables them to be used in applications such as a hood for an automobile, a shroud for a lawn mower, chain saw guards and in electrical connection applications.

Abstract: A copolyamide comprised of undecamethylenehexahydroterephthalamide units and hexamethylenehexahydroterephthalamide units having a trans isomer ratio of hexahydroterephthalic acid residues of 57 to 83 percent is provided. The copolyamide is suitable for injection and extrusion molding. The copolyamide is prepared by a process comprising heating an equimolar salt of undecamethylenediamine and hexahydroterephthalic acid and an equimolar salt of hexamethylenediamine and hexahydroterephthalic acid at a maximum temperature of about 280 to 360.degree. C. to stably melt-polymerize the copolyamide. A copolyamide molding composition comprised of the copolyamide and an inorganic reinforcing agent can be formed into various molded articles having excellent properties.

Abstract: Novel crosslinkable transparent polyamides are described which are obtained by the condensation of diamines of the formula ##STR1## with aromatic and/or aliphatic dicarboxylic acids or amide-forming derivatives thereof, preferably in the presence of an inorganic or organic phosphorus compound as an accelerator. In the formula, R.sub.1 to R.sub.4 are defined as in patent claim 1. The novel polyamides are suitable for the production of solvent-resistant coatings on various substrates, for the production of images under the action of light, in particular when mixed with polythiols and photoinitiators or photosensitizers, or for the production of transparent mouldings.

Abstract: A process for preparing a polyamide is provided. The polyamide is prepared by causing a dicarboxylic acid and a diamine to polycondensate directly under an atmosphere of an inert gas at atmospheric pressure. The polycondensation reaction is mainly carried out in two diamine component-adding steps, one step comprising adding part of the diamine to the molten dicarboxylic acid until the molar ratio of the diamine to the dicarboxylic acid is brought to within the range of from 0.900 to 0.990 while raising continuously the temperature of the reaction mixture to a temperature not exceeding about 5.degree. C. above the melting point of the object polyamide and the other step comprising adding the remainder of the diamine to the reaction mixture maintained at a temperature higher than about 10.degree. C., but not exceeding about 35.degree. C. above the melting point of the object polyamide until the overall molar ratio of the diamine to the dicarboxylic acid is brought to within the range of from 0.995 to 1.005.