Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Abstract: Hydroxy-functional polyethers having a "cardo" diphenylene group in their backbones are prepared by contacting at least one dinucleophilic monomer with at least one dtglycidyl ether of a cardo bisphenol, such as bis(hydroxyphenyl)fluorene, phenolphthalein, or phenolphthalimidine or a substituted cardo bisphenol, such as a substituted bis(hydroxyphenyl)fluorene, a substituted phenolphthalein or a substituted phenolphthalimidine, under conditions sufficient to cause the nucleophillo moieties of the dinucleophilic monomer to react with epoxy moieties to form a polymer backbone containing pendant hydroxy moieties and ether, imino, amino, sulfonamido or ester linkages. These polyethers possess a combination of high barrier to oxygen transmission (i.e., oxygen transmission rate less than 10.0 cm.sup.3 -mil/100 in.sup.2 -atm-day to oxygen) and high heat resistance (i.e., Tg above 120.degree. C.).

Abstract: Provided is a curable composition comprising (A) a phenolic compound having a carbon-carbon double bond, (B) a compound having an SiH group, and (C) a foaming agent. The composition can be foamed and cured at room temperature or under heat at relatively low temperatures, and is poorly corrodable and poorly toxic.

Abstract: A chiral biphenyl compound includes a hindered 2,2'-substituted-1,1'-biphenyl subunit and has the following formula: ##STR1## The chiral biphenyl compounds have been shown to be useful as catalysts in asymmetric reactions. For example, an organozinc species can be formed by reacting the chiral biphenyl compound with an organozinc compound, R.sup.14 R.sup.15 Zn and then used as a catalyst for the asymmetric alkylation of an aldehyde by an organozinc compound.

Abstract: A thermoplastic composite is prepared by applying a hydroxy-phenoxyether polymer onto the surface of reinforcing fibers or by the in-situ polymerization of mixtures of diepoxides and difunctional species in the presence of reinforcing fibers. The composites can be molded into shaped articles useful for structural materials and parts by conventional thermoforming or other fabrication techniques.

Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Abstract: A laminate structure comprises one or more layers of an organic polymer and one or more layers of a hydroxy-functionalized polyetheramine, wherein the hydroxy-functionalized polyetheramine layer is adhered directly to a contiguous organic polymer layer without an adhesive layer therebetween. The hydroxy-functionalized polyetheramine is prepared by reacting (1) a difunctional amine with (2) a diglycidyl ether or a diepoxy-functionalized poly(alkylene oxide) under conditions sufficient to cause the amine moieties to react with the epoxy moieties to form a polymer backbone having amine linkages, ether linkages and pendant hydroxyl moieties and then treating the reaction product with a monofunctional nucleophile which is not a primary or secondary amine.

Abstract: A hardener for epoxy resins is disclosed the use of which imparts improved resistance in the resins to aging on exposure to ultraviolet radiation. The hardener comprises (a) at least one amine selected from the group consisting of trimethylhexamethylenediamine and isophoronediamine and (b) at least one inorganic salt which contains nitrate ion.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.

Abstract: Methods for preparing low free resorcinol resins are disclosed. These methods generally comprise reacting a resin with an aromatic olefinic compound; suitable resins include one or more resins selected from the group consisting of a dihydric phenol, a polyhydric phenol, a dihydric phenolic novolak resin and a polyhydric phenolic novolak resin; the addition product of at least one of these resins and at least one compound selected from the group consisting of a monooxirane compound and a polyoxirane compound; and a phenol or alkyl or aralkyl substituted mono- or dihydric phenol modified form of these resins. The resins produced by this method are also disclosed, as are rubber compositions utilizing the resin produced by this method.

Abstract: A bis(methoxymethyl)biphenyl having the formula (I): ##STR1## which is capable of producing by a dehalogenating coupling of a halogenated methoxymethylbenzene and which is useful as an intermediate for a phenol novolak condensate, an epoxy resin curing agent, an epoxy resin composition, or a phenol resin composition.

Abstract: Methods for preparing low free resorcinol resins are disclosed. These methods generally comprise reacting a resin with an aromatic olefinic compound; suitable resins include one or more resins selected from the group consisting of a dihydric phenol, a polyhydric phenol, a dihydric phenolic novolak resin and a polyhydric phenolic novolak resin; the addition product of at least one of these resins and at least one compound selected from the group consisting of a monooxirane compound and a polyoxirane compound; and a phenol or alkyl or aralkyl substituted mono- or dihydric phenol modified form of these resins. The resins produced by this method are also disclosed, as are rubber compositions utilizing the resin produced by this method.

Abstract: The epoxy resin composition which comprises both components (A) an epoxy compound having at least two epoxy groups in a molecule and (B) a polyphenol compound containing a trisphenol compound represented by general formula (I) described below ##STR1## in which R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from ##STR2## in which R.sub.2 and R.sub.3 are each individually selected from an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.

Abstract: Disclosed is a method of preparing a fluorescent polymer, whereby an ethylenically unsaturated monomer is copolymerized with a polynuclear aromatic hydrocarbon or a substituted aromatic derivative thereof, such that the resultant polymer is fluorescent. Also disclosed are coating compositions containing such fluorescent polymers.

Abstract: An organozinc species, useful in the reactions of aldehydes and ketones, is a reaction product of a) a biphenyl compound having one or more hindered 2,2'-substituted biphenyl subunits and b) an organozinc compound, such as diethylzinc. The organozinc species catalyzes the reduction of a ketone by a borane, as well as the epoxidation of .alpha.,.beta.-unsaturated compounds by an oxidizing agent, such as O.sub.2 or an alkyl hydroperoxide. The biphenyl compound may be chiral and may catalyze the formation of optically active reaction products.

Abstract: The present invention is directed to the formation of phenol alkylation polymers which release negligible phenol and formaldehyde emissions. The phenol aralkylation polymers of the present invention are derived from a phenolic monomer, at least one styrene derivative and an aryl diolefin. In addition to the phenolic monomer, styrene derivative and aryl diolefin, other reactants may be introduced to produce a product with particular properties.

Abstract: Disclosed is a gas barrier coating and multilayer packaging materials made therefrom. The gas barrier coating includes a polyamine (A), a polyepoxide (B), and a filler (C). Polyamine (A) includes at least one of the following: (a) an initial polyamine, and (b) an ungelled polyamine adduct which is the reaction product of the initial polyamine and epichlorohydrin and/or a polyepoxide having a plurality of glycidyl groups linked to an aromatic member. Polyepoxide (B) includes a polyepoxide having a plurality of glycidyl groups linked to an aromatic member. Filler (C) includes a platelet-type filler with the following particle size distribution: (a) a number mean particle diameter in the range from about 5.5 to about 15 microns, and (b) a volume mean particle diameter in the range from about 8 to about 25 microns. In addition, the present invention provides glossy, multilayer packaging materials containing an oxygen barrier material layer having an oxygen permeability constant not more than 0.

Abstract: An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.

Abstract: Hydroxy-functional polyethers having a "cardo" diphenylene group in their backbones are prepared by contacting at least one dinucleophilic monomer with at least one diglycidyl ether of a cardo bisphenol, such as bis(hydroxyphenyl)fluorene, phenolphthalein, or phenolphthalimidine or a substituted cardo bisphenol, such as a substituted bis(hydroxyphenyl)fluorene, a substituted phenolphthalein or a substituted phenolphthalimidine, under conditions sufficient to cause the nucleophilic moieties of the dinucleophilic monomer to react with epoxy moieties to form a polymer backbone containing pendant hydroxy moieties and ether, imino, amino, sulfonamido or ester linkages. These polyethers possess a combination of high barrier to oxygen transmission (i.e., oxygen transmission rate less than 10.0 cm.sup.3 -mil/100 in.sup.2 -atm-day to oxygen) and high heat resistance (i.e., Tg above 120.degree. C.).

Abstract: This invention provides resins and resin compositions which afford cured products with high heat resistance, low water absorption and high adhesion which are useful as electric and electronic materials. Resins obtained by condensation reaction between 4,4'-di(.omega.-substituted methyl)biphenyl or the like and naphthols; epoxy resins obtained by glycidyleterifying said resins; epoxy resin compositions containing these resins; and cured products thereof are disclosed.

Abstract: The present invention is directed to the formation of phenol alkylation polymers which release negligible phenol and formaldehyde emissions. The phenol aralkylation polymers of the present invention are derived from a phenolic monomer, at least one styrene derivative and an aryl diolefin. In addition to the phenolic monomer, styrene derivative and aryl diolefin, other reactants may be introduced to produce a product with particular properties.

Abstract: The present invention is directed to the formation of phenol alkylation polymers which release negligible phenol and formaldehyde emissions. The phenol aralkylation polymers of the present invention are derived from a phenolic monomer, at least one styrene derivative and an aryl diolefin. In addition to the phenolic monomer, styrene derivative and aryl diolefin, other reactants may be introduced to produce a product with particular properties.

Abstract: The present invention is directed to the formation of phenol alkylation polymers which release negligible phenol and formaldehyde emissions. The phenol aralkylation polymers of the present invention are derived from a phenolic monomer, at least one styrene derivative and an aryl diolefin. In addition to the phenolic monomer, styrene derivative and aryl diolefin. In addition to the introduced to produce a product with particular properties.

Abstract: The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.

Abstract: Novel soluble, fast doping and de-doping, conductive, electroluminescent .pi.-conjugated homo- and co-polymers comprise poly(phenylene vinylene) polymers of the chemical formula ##STR1## wherein R' is the same or different and is selected from the group consisting of hydrogen, (C.sub.1 -C.sub.10)alkyl, alkenyl, and alkynyl, (C.sub.6 -C.sub.30)aryl, cycloalkyl, cycloalkenyl and cycloalkynyl, (C.sub.7 -C.sub.40)arylalkyl, arylalkenyl, arylalkynyl, alkyl, alkenyl and alkynyl cycloalkyl, alkyl, alkenyl, and alkynyl cycloalkenyl, and alkyl, alkenyl and alkynyl cycloalkynyl, --OR'" and combinations thereof, wherein R'" is selected from the group consisting of (C.sub.6 -C.sub.30)hydrocarbons comprising branched alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl and cycloalkynyl, mono- and poly-hydroxylated derivatives thereof, (C.sub.1 -C.sub.10)esters and ethers thereof, and (C.sub.5 -C.sub.30)carbohydrates comprising furanosyl, pyranosyl, and oligomers thereof, (C.sub.1 -C.sub.

Abstract: The present invention is directed to the formation of phenol alkylation polymers which release negligible phenol and formaldehyde emissions. The phenol aralkylation polymers of the present invention are derived from a phenolic monomer, at least one styrene derivative and an aryl diolefin. In addition to the phenolic monomer, styrene derivative and aryl diolefin, other reactants may be introduced to produce a product with particular properties.

Abstract: This invention relates to polymers having non-linear optical properties which polymers include fluorene moieties having at least one electron accepting group and at least one electon donating group substituted to different phenyl rings of the fluorene moiety.

Abstract: Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and can be readily activated at elevated temperatures to prepare phenolic based adhesives and coatings.

Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Abstract: Polyepoxide-polyamine gas barrier coatings for use on packaging materials such as polymeric containers are provided with low permeability at relatively low amine to epoxy cure ratios by including substantial aryloxy or aryloate group content. The aryloxy or aryloate content may be provided, for example, by polyglycidyl ether of resorcinol or polyglycidyl ester of phthalic acid.

Abstract: Thermosettable resins, including epoxy resins, polythiirane resins and vinyl ester resins were prepared from compounds containing one or more discotic mesogenic moieties. The resultant thermosettable resins may be processed to provide the discotic liquid crystalline state. The thermosettable resin compositions can be employed in coating, casting, encapsulation, electronic or structural laminate or composite, filament winding, molding and the like applications.

Abstract: Blends compriseA) from 55 to 99% by weight of a matrix of copolyarylene ether sulfones composed ofa.sub.1) from 91 to 97 mol % of structural units ##STR1## a.sub.2) from 3 to 9 mol % of structural units ##STR2## B) from 1 to 45% by weight of a disperse phase comprising copolyarylene ether sulfones, composed ofb.sub.1) from 91 to 97 mol % of structural units II andb.sub.2) from 3 to 9 mol % of structural units I,C) from 0 to 40% by weight of rubber impact modifiers,D) from 0 to 60% by weight of fibrous or particulate fillers or of mixtures thereof andE) from 0 to 40% by weight of processing assistants and/or additives.

Abstract: A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.

Abstract: A newly-blended one part system heat-resistant epoxy resin composition which exhibits excellent stability at room temperature, quickly undergoes the curing reaction, molded within short periods of time, and, after cured, exhibits excellent Tg, resistance against the water, resistance against degradation by heat, and a variety of excellent properties in combination. The heat-resistant epoxy resin composition having excellent stability at room temperature comprises an epoxy compound having two or more epoxy groups, a curing agent which comprises a naphthalenedicarboxylic dihydrazide as a main component, and a ceramic whisker as a filler.

Abstract: Cure of a novel trisepoxy resin-based composition provides a thermoset having high Tg, low dielectric constant, low water absorption and good flexural strength.

Abstract: An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.

Abstract: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.

Abstract: A deep ultraviolet absorbent comprising at least one compound having one or more glycidyl groups in the molecule and at least one anthracene derivative, and a solvent capable of dissolving these compounds is effective for preventing reflection of deep ultraviolet light from a substrate during formation of resist pattern, resulting in forming ultra-fine patterns without causing notching and halation.

Abstract: Novel aminoplast anchored UV stabilizers are provided. Compared to unanchored stabilizers, the anchored stabilizers disclosed herein have increased compatibility with coating resins and have reduced volatility due to higher molecular weights resulting from anchoring. A process for preparing the anchored stabilizers by the reaction of unanchored stabilizers with alkoxymethylated aminoplasts in a sulfuric acid medium is also provided. The unanchored stabilizers include 2-(2-hydroxyaryl)benzotriazoles, 2-hydroxybenzophenones, 2-(2-hydroxyaryl)-4,6-diaryl-1,3,5-triazines, salicylic acid derivatives, 2-hydroxyoxanilides, and blocked derivatives thereof as well as mixtures of two or more stabilizers. The aminoplasts include alkoxymethylated derivatives of glycolurils, melamines, and benzoguanamines.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: Curable compositions containing (A) one or more epoxy resins, one (B) or more curing agents and (C) one or more cure controlling catalysts wherein at least one of components (A) or (B) or both components (A) and (B) contain a mesogenic moiety are prepared. These curable compositions permit processing at higher temperatures and improved properties. They are useful in the preparation of coatings, castings, electrical or laminates or composites and the like.

Abstract: A polyester polymer comprising repeating units (I), or repeating units (I) and (II), and having a reduced viscosity (.eta..sub.sp /c) of 0.2 to 10.0 dl/g, measured at 20.degree. C. as a 0.5 g/dl solution dissolved in methylene chloride is prepared by allowing a dihydric phenol (III), or dihydric phenols (III) and (IV), to react with a carbonate precursor or a dibasic acid. An electrophotographic photoreceptor which comprises an electroconductive substrate and a photosensitive layer disposed on the electroconductive substrate and containing the polyester polymer as a charge transporting material or a binder resin. ##STR1## wherein, W is --O-- or single bond, X is a divalent group which is derived from a dihydric phenol containing a hydrazine structure, each of R.sup.25 and R.sup.26 is a halogen atom, an alkyl group, a cycloalkyl group or an aryl group, each of m and n is an integer of 0 to 4, Y is single bond, --O--, --S--, --SO--, --SO.sub.2 --, --CR.sup.27 R.sup.28 --, a 1,1-cycloalkylene group or an .alpha.

Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.

Abstract: Oligomerized 1,2-dihydro-2,2,4-trimethylquinoline is an effective curing agent for epoxy resins to give products with high glass transition temperatures, low water absorption and excellent retention of hot/wet physical properties. These cured epoxy resins find use as matrix resins, in laminates, adhesives, coatings and in electrical applications.

Abstract: Mesogen containing biaxially oriented films are prepared from curable mixtures containing an epoxy resin and a curing agent therefor. Certain of the mesogen containing biaxially oriented films possess unique properties, such as a metallic like, highly reflective appearance. These films are useful in adhesives, coatings, laminates or composites and the like.

Abstract: Laminates containing one or more plies of substrate material impregnated with a composition containing (A) one or more epoxy resins, (B) one or more curing agent and (C) about 0.00005 to about 0.1 mole per epoxide equivalent of cure controlling catalyst, wherein at least one of components (A) or (B) contain at least one mesogenic moiety, which, optionally, has been subjected to either (a) the application of an electric field, (b) the application of a magnetic field, (c) drawing or shear forces, or (d) any combination thereof, are prepared.

Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.