With Separate Coacting Pockets Patents (Class 53/93)
  • Method of packaging compound semiconductor substrates
    Patent number: 8381493
    Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: February 26, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara