Heat Pump, Selective Heating And Cooling Patents (Class 62/3.3)
  • Patent number: 6686532
    Abstract: A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: February 3, 2004
    Inventor: Chris Macris
  • Patent number: 6679064
    Abstract: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: January 20, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Chih-Wei Chang, Fa-Yuan Chang, Cheng-Ting Tseng, Chin-Chang Chen, Cheng-Cheng Chang, Shih-Fang Chen
  • Publication number: 20040006996
    Abstract: A workpiece chuck and method for supporting a workpiece such as a semiconductor wafer are described. The workpiece chuck includes an upper surface for supporting the wafer and a temperature control assembly in thermal communication with the upper surface to control temperature in the wafer. The temperature control assembly includes one or more thermoelectric modules between an upper and lower layers. One or more spacers between the upper and lower layers provide a space between the upper and lower layers such that the one or more thermoelectric modules vertically float in the space. That is, the upper and lower layers of the temperature control modules do not mechanically constrain the thermoelectric modules in the vertical direction. As a result, mechanical stresses on the thermoelectric modules due to temperature effects are substantially reduced or eliminated, resulting in much higher reliability of the chuck and the thermoelectric modules over temperature.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 15, 2004
    Inventor: Dana G. Butcher
  • Publication number: 20040008491
    Abstract: A heat dissipation apparatus. The heat dissipation apparatus includes a thermal plate, a thermal block, a heat pipe, and a thermal body. The thermal plate and the thermal block are joined by rivets through the corresponding holes.
    Type: Application
    Filed: November 14, 2002
    Publication date: January 15, 2004
    Inventor: Yung-Shun Chen
  • Patent number: 6672076
    Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: January 6, 2004
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6666031
    Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: December 23, 2003
    Assignee: Komatsu, Ltd.
    Inventors: Hideaki Ohkubo, Kazuhiko Kubota
  • Patent number: 6658857
    Abstract: A portable thermoelectric cooling and heating appliance device and associated method of using the device are disclosed. The device comprises: a generally rectangular box, a hinge, a generally rectangular lid, a locking means, and a power cord. The box has a divider wall which defines a partition between a left and a right chamber within the box. The box further includes: an outer shell; an insulation layer; a inner shell; a power input plug; a first heat transfer unit; a first network of cooling/heating coils; a first control knob having a first voltage regulator and a first thermostat operationally connected to each other; a first spigot having a first button and a first drain; a second heat transfer unit; a second network of cooling/heating coils; a second control knob having a second voltage regulator and a second thermostat operationally connected to each other; and a second spigot having a second button and a second drain. The hinge is attached to the outer shell of the box.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: December 9, 2003
    Inventor: Hatho M. George
  • Patent number: 6657169
    Abstract: An apparatus for thermally cycling samples of a biological material including a thermal block assembly including a plurality of sample holders for receiving samples of biological material; a heat sink thermally coupled to the thermal block assembly, the heat sink transferring heat away from the thermal block assembly to ambient air in contact with the heat sink; a first heat source thermally coupled to the thermal block assembly to provide heat to the thermal block assembly; and a second heat source thermally coupled to the first heat source and configured to provide heat to a portion of the first heat source. The arrangement of the heat sink, first heat source and second heat source can provide substantial temperature uniformity among the plurality of sample holders. The invention also includes a method for thermally cycling samples of biological material.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: December 2, 2003
    Assignee: Stratagene
    Inventor: Larry Richard Brown
  • Publication number: 20030218865
    Abstract: A Thermal Management System adapted to meet current dimensional standards and providing direct Thermoelectric controlled temperatures to maintain semiconductor performance. The disclosed invention utilizes Thermoelectric Cooling Devices, a controller unit, both fluid and gaseous heat exchangers together with low cost construction methods to provide a compact, effective semiconductor Thermal Management System meeting the cooling needs of current and future high-speed, heat-producing semiconductors.
    Type: Application
    Filed: May 24, 2002
    Publication date: November 27, 2003
    Inventor: Jose Javier Macias
  • Patent number: 6651446
    Abstract: An electrical equipment cabinet is provided that includes an enclosure adapted to contain electrical equipment. A battery compartment, which is located in the enclosure, is adapted to contain at least one battery electrically coupled to the electrical equipment. The battery compartment has first and second opposing side walls, a bottom surface, and a first pair of vents located in the first and second side walls through which external air flows to remove heat. In addition, a second pair of vents, which are also located in the first and second side walls, allow gas emitted by the battery to escape by diffusion. A thermal stabilizing unit is disposed in the battery compartment for regulating the temperature of the battery in contact therewith. The thermal stabilizing unit has a conduit therein for conducting the external air flow between the vents in the first pair of vents.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: November 25, 2003
    Inventor: Mark C. Woods
  • Patent number: 6651444
    Abstract: A method of easily deforming a plate-shape vacuum insulation material and producing a smaller but highly effective insulation container, comprising steps of inserting a thermoplastic open-celled rigid foam as a core material into a packet composed of gas barrier film, evacuating and sealing the packet so as to produce a vacuum insulation material, heating and softening the vacuum insulation material so as to deform the same, and cooling the vacuum insulation material so as to cure the same, and also a freezing and refrigerating container having Peliter element.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: November 25, 2003
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Kiyotake Morimoto, Michihiro Oga, Masato Hayashi, Junichi Hosaka, Reishi Naka
  • Publication number: 20030209014
    Abstract: A wafer transfer system having a temperature control apparatus. The temperature control apparatus is constructed and arranged so that a material, element, or atomic particle may flow therethrough to heat or cool a wafer carried by the wafer transfer system. The material, element or atomic particle flowing through the temperature control apparatus causes heat to be pumped to or from an upper surface or lower surface. Preferably the temperature control apparatus is a thermoelectric device. Preferably the thermoelectric device includes a plurality of alternating N-type and P-type semiconductor pellets arranged electrically in series and thermally in parallel, and connected to a DC power supply. A switch or relay is provided for altering the direction of current flow to the thermoelectric device from a DC supply.
    Type: Application
    Filed: May 13, 2002
    Publication date: November 13, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Wei Chang, Fa-Yuan Chang, Cheng-Ting Tseng, Chin-Chang Chen, Cheng-Cheng Chang, Shih-Fang Chen
  • Patent number: 6637210
    Abstract: An improved efficiency thermoelectric system operates the thermoelectric elements in the system in a non-steady state manner. The thermoelectric elements are powered for predefined periods of time to obtain increased efficiency. This benefit can be improved by also altering the resistance of the thermoelectric elements during the power-on period such that resistive heating is minimized.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: October 28, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Publication number: 20030192321
    Abstract: This invention relates to a system for holding food in ready-to-serve state, comprising
    Type: Application
    Filed: April 11, 2003
    Publication date: October 16, 2003
    Applicant: Electrolux Professional GmbH
    Inventor: Udo Baumann
  • Publication number: 20030188539
    Abstract: A novel heat exchanger includes a thermal reservoir and a tube, the tube having straight sections and corrugated bends, and being in thermal contact with the thermal reservoir. The thermal reservoir has a first plate and a second plate fixed to the first plate. The first plate has a channel formed therein with straight sections to receive the straight sections of the tube, and curved sections for receiving the corrugated sections of the tube. The second plate has a channel formed therein as well that is complementary to the channel of the first plate. The heat exchanger is heated by one or more cartridge heaters. In a particular embodiment, two thermal reservoirs are fixed to one another and the cartridge heaters are disposed in channels formed therebetween. Optionally the thermal reservoirs can be heated or cooled by thermoelectric chips, and can include one or more heat sinks.
    Type: Application
    Filed: April 3, 2002
    Publication date: October 9, 2003
    Inventors: Alexei D. Abras, Saeed Taghipour
  • Patent number: 6625990
    Abstract: An improved thermoelectric power generation system utilizes rotary thermoelectric configurations to improve and increase thermal power throughput. These systems are further enhanced by the use of hetrostructure thermoelectric materials, very thin plated materials, and deposited thermoelectric materials, which operate at substantially higher power densities than typical of the previous bulk materials. Several configurations are disclosed.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: September 30, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Publication number: 20030172657
    Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.
    Type: Application
    Filed: March 5, 2003
    Publication date: September 18, 2003
    Inventors: Hideaki Ohkubo, Kazuhiko Kubota
  • Patent number: 6619044
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: September 16, 2003
    Assignee: Hydrocool Pyt, Limited
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke
  • Patent number: 6615590
    Abstract: An object of the present invention is to provide a heat exchanger for a temperature control which can take a large area for transferring the heat to the fluid while it is compact, has a good efficiency for exchanging the heat, can increase and decrease the heat transferring area in conformity to the user's needs and the manufacturing cost thereof is low. The heat exchanging boards 2, 3 with a plate constitution and plural thermo modules are superposed alternately so that they have a laminate constitution. The heat exchanging board has a construction such that a flowing path defining board 5, in which a flowing path with a labyrinth construction is formed, is folded by a thin shell 7. The shell has an inflow hole into which the fluid flows and an outflow hole from which a fluid flows out passing through said flowing path with the labyrinth construction. A peltier element is used as the thermo module.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: September 9, 2003
    Assignee: SMC Corporation
    Inventors: Shigesuke Yaegashi, Hiroyuki Sakama
  • Publication number: 20030154725
    Abstract: Counter-current heat flow systems are disclosed, where heat containing medium flows in adjacent conduits arranged anti-parallel to one another so that the medium flowing from a warm zone to a cool zone flows adjacent to the medium flowing from the cool to the warm zone in the opposite direction. A plurality of heat pumps are distributed along the conduits to actively pump heat between adjacent points of the conduits. Little energy is required to pump heat between the adjacent points yet a large temperature difference can be maintained between the warm and the cool zones. The heat containing medium can be a fluid or an electric current. The medium in one conduit may have a different heat capacity than the medium in the other conduit. A controller may be included to regulate the plurality of heat pumps and/or the flow of the media to maintain a desired temperature at the warm zone or the cool zone.
    Type: Application
    Filed: February 15, 2002
    Publication date: August 21, 2003
    Inventor: Stephen P. McGrew
  • Patent number: 6606866
    Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: August 19, 2003
    Assignee: Amerigon Inc.
    Inventor: Lon E. Bell
  • Patent number: 6601401
    Abstract: A temperature controller 51 is disclosed, which comprises a temperature control element 53 disposed on the bottom of a case 52, a light-waveguide element 11 and a metal plate 55 intervening between the elements 53 and 11. The metal groove 55 has a groove, in which a temperature sensor 36 is buried together with a highly heat conductive material. The detected temperature output of the temperature sensor 36 is inputted to a temperature control circuit 58 for controlling the temperature of the temperature control element 53. The temperature sensor 36 inclusive of its lead lines are buried in the metal plate 55 such as to cover a long distance. Thus, the temperature control is less subject to the influence of the ambient temperature and can thus be made with high accuracy.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: August 5, 2003
    Assignee: NEC Corporation
    Inventor: Takefumi Oguma
  • Patent number: 6598405
    Abstract: An improved efficiency thermoelectric power generation system is disclosed wherein convection is actively facilitated through a thermoelectric array, and the thermoelectric array is used to generate electrical power. Thermal power is convected through the thermoelectric array or arrays toward at least one side of the thermoelectric array, which leads to increased efficiency. Thermal power is applied to the array, creating a temperature gradient across the array. The thermoelectric system may also be combined with other power generation systems, forming a co-generation system.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: July 29, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6598403
    Abstract: A thermoelectric cooling system integrating quantum cold point connections with lateral thermoelectric element formation. A preferred system has an n-type and p-type thermoelectric element, each connected to a common conducting section. The thermoelectric elements are each tapered at the end where they contact the common conducting section. The thermoelectric elements preferably all occupy substantially the same plane as each other and as the common conducting section.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: July 29, 2003
    Assignee: International Business Machines Corporation
    Inventor: Uttam Shyamalindu Ghoshal
  • Patent number: 6598404
    Abstract: Described herein is a temperature control system for cooling magnetic elements (14) in MRI apparatus (10). The control system comprises a wax (16) in contact with the elements (14) which is substantially maintained at its phase transition temperature between a solid state and a liquid state, but in a substantially solid state. A sensor (18) is immersed in the wax (16) and operates to provide a signal on the change of state of the wax (16). The sensor (18) is connected to a controller (20) which controls the operation of a heating element (26) also immersed in the wax (16) to control the temperature thereof. When the MRI apparatus is operational, heat is generated by the magnetic elements (14) is used to change the wax (16) to a liquid, this change being detected by the sensor (18) which sends signals to the controller (20) to turn off the heating element (26).
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: July 29, 2003
    Assignee: Oxford Magnet Technology Limited
    Inventor: Marcel Jan Marie Kruip
  • Patent number: 6591615
    Abstract: In an electrical appliance, a thermal conductor includes a hollow heat-conducting member that has inner and outer walls confining an enclosed chamber therebetween, and a superconductor disposed in the chamber. A heat-insulating layer is provided on an outer peripheral surface of the outer wall. A temperature control device includes a thermoelectric unit disposed on and in thermal communication with the outer wall of the heat-conducting member. A control unit is connected to the thermoelectric unit and is operable so as to enable the thermoelectric unit to operate in either a heat-absorbing mode, where the thermoelectric unit absorbs heat from the thermal conductor so as to reduce temperature in the heat-conducting member, or a heat-radiating mode, where the thermoelectric unit radiates heat to the thermal conductor. A power source is connected to the temperature control device for supplying electric power thereto.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: July 15, 2003
    Inventor: Chin-Kuang Luo
  • Publication number: 20030115887
    Abstract: A heating and/or air conditioning system for an interior of a vehicle has a central heating and/or cooling device and a decentralized air-conveying device which includes a plurality of air-conveying units arranged locally in the vehicle interior. In order to permit good regulation of the heating and/or air conditioning system and efficient air conditioning, respective air-conveying units of the decentralized air-conveying device are arranged in a plurality of subspaces of the vehicle interior for circulating air in the respective subspaces.
    Type: Application
    Filed: November 22, 2002
    Publication date: June 26, 2003
    Inventors: Joachim Currle, Frank Fruehauf, Juergen Maue, Juergen Wertenbach
  • Patent number: 6580025
    Abstract: A thermoelectric device adaptable for heating and for cooling a fluid such as air. The device includes at least one thermoelectric module and at least one rotating heat sink that transfer heat between the thermoelectric module(s) and the fluid. The heat sink(s) are mounted on a shaft and include a plurality of thermally conductive impeller blades. The thermoelectric module(s) rotate with the heat sink(s) about the shaft. Because the thermoelectric module(s) are in direct contact with the thermally conductive impeller, heat is transferred more efficiently into and out of the thermoelectric device. Because the impeller blades also act as heat sinks, fewer components are needed than with conventional devices.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: June 17, 2003
    Assignee: The Boeing Company
    Inventor: James K Guy
  • Patent number: 6574967
    Abstract: A cooling and heating apparatus using a thermoelectric module, in which the thermoelectric module, a heat emitting member and a heat conducting block are integrated into a single unit, to improve the performance and durability of the thermoelectric module. The cooling and heating apparatus includes a thermoelectric module. The heat emitting member is attached to a first surface of the thermoelectric module. The heat conducting block is attached to a second surface of the thermoelectric module. The heat absorbing member is attached to the heat conducting block. A cover integrates the thermoelectric module and the heat conducting block into the single unit by fixedly covering side surfaces of the thermoelectric module and the heat conducting block and a part of an inner surface of the heat emitting member.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: June 10, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Rae-Eun Park, Jae-Seung Lee, Su-Il Lee
  • Patent number: 6571564
    Abstract: Disclosed is an invention related to a warmer and cooler for a container that is programmably timed to engage a heating and/or cooling unit. The invention may be adapted for use with a baby bottle to facilitate nighttime feedings by programming when the unit should be turned on to heat the bottle or cool the bottle.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: June 3, 2003
    Inventors: Shashank Upadhye, Shilpa Upadhye
  • Publication number: 20030097845
    Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.
    Type: Application
    Filed: July 2, 2002
    Publication date: May 29, 2003
    Inventors: John Saunders, Jamey D. Jacob, Dayong Gao, Michel A. Myers
  • Patent number: 6560968
    Abstract: The present invention relates to a thermoelectric cooler, and more particularly, to a thermoelectric cooler, in which a thermoelectric module is applied to a blow system of a fan blade set and a motor, for converting a current blow system into a blow system having a cooling function with a low noise. To do this, the present invention provides a thermoelectric cooler including a thermoelectric module having thermoelectric elements each for absorbing or dissipating a heat at a junction of two different metal depending on a direction of a current flowing through the junction, a fan blade set for blowing air cooled at a heat absorption side of the thermoelectric module to a desired place, and a motor for giving a rotating force to the fan blade set.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: May 13, 2003
    Assignee: LG Electronics Inc.
    Inventor: Cheol Soo Ko
  • Publication number: 20030074903
    Abstract: Disclosed is an invention related to a warmer and cooler for a container that is programmably timed to engage a heating and/or cooling unit. The invention may be adapted for use with a baby bottle to facilitate nighttime feedings by programming when the unit should be turned on to heat the bottle or cool the bottle.
    Type: Application
    Filed: October 23, 2001
    Publication date: April 24, 2003
    Inventors: Shashank Upadhye, Shilpa Upadhye
  • Publication number: 20030062150
    Abstract: A temperature control system and method reduces thermal/strain fatigue failures in connections between first and second circuit elements of an electronic circuit. A temperature control device is in a heat exchange relationship with at least one of the first and second circuit elements. The temperature control device maintains a temperature of the first and second circuit elements below a predetermined high temperature and above a predetermined low temperature when the electronic circuit is operating and when the electronic circuit is not operating to reduce thermally-induced fatigue of the connection. The coefficients of thermal expansion (CTE) of the first and second circuit elements are also matched. The temperature control device includes a thermoelectric heat pump, a heat pipe, a finned heat exchanger, a phase change heat transfer device, a heat sink and/or any other suitable temperature control device.
    Type: Application
    Filed: September 25, 2001
    Publication date: April 3, 2003
    Inventors: Melissa Sweitzer, Michael Wolfinger
  • Patent number: 6539725
    Abstract: An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: April 1, 2003
    Assignee: BSST LLC
    Inventor: Lon E. Bell
  • Patent number: 6530232
    Abstract: A thermoelectric sleeve-type beverage insulator apparatus with a printable sleeve-type insulated jacket with a rigid enclosure mean, a thermoelectric engine assembly incorporated into the sleeve-type insulated jacket, an electrical connection mean connected to the thermoelectric engine assembly and secured to the rigid enclosure mean of the sleeve-type insulated jacket, a support base with mechanical connection mean and electrical connection mean, and an electrical power transmission mean between a power source and the support base. A preferred embodiment includes the printable sleeve-type insulated jacket that is made of printable tubular foam insulating member having an open top and closed base, an inner surface and partially exposed outer surface, a longitudinal groove on the inner surface reaching from the open top to the closed base and extending to the radial middle of the closed base, where the printable tubular foam insulating member allows use of the apparatus as an advertising medium.
    Type: Grant
    Filed: June 10, 2002
    Date of Patent: March 11, 2003
    Inventor: Mark Kitchens
  • Patent number: 6523354
    Abstract: The present invention essentially comprises a cooling blanket having multiple pockets to contain a heat sink with the heat sink provided in the pocket, the heat sinks being either a thermoelectric cooling unit or a cold pack.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: February 25, 2003
    Inventor: Deborah Ann Tolbert
  • Patent number: 6519947
    Abstract: A low-cost thermoelectric module utilizing a greatly reduced quantity of thermoelectric material as compared to similar prior art thermoelectric modules. An egg crate design containing thermoelectric elements is utilized in the present invention. However, the walls of the egg crate in the parts of the module separating the thermoelectric elements are made thick so that the total cross sectional area of the elements is less than 75 percent of the total module cross sectional area. The spaces above and below the elements are filled with a high heat and electric conducting material such as aluminum. This produces funnel-shaped conductors funneling heat and electric current into and out of each of the thermoelectric elements. The payoff to this approach is that the heat flux through the hot and cold module surfaces can be maintained while producing the same power output with about half the thermoelectric material or less.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: February 18, 2003
    Assignee: Hi-Z Technology, Inc.
    Inventors: John C. Bass, Daniel T. Allen, Norbert B. Elsner
  • Publication number: 20030029173
    Abstract: A personal environment appliance is disclosed in which a person in a work area can individually control the ambient conditions of that persons localized work space environment. The control permits highly localized adjustment to suit individual preferences, thereby, reducing the impact of individual environmental preferences on the individuals. In addition to environment conditions, a variety of accessories may be provided such as beverage heaters and/or coolers.
    Type: Application
    Filed: August 7, 2002
    Publication date: February 13, 2003
    Inventors: Lon E. Bell, Robert W. Diller
  • Patent number: 6510696
    Abstract: A thermoelectric air conditioning apparatus is comprised of a housing having a plurality of air inlets and a plurality of air outlets; a plurality of thermoelectric elements; two heat exchangers; a temperature regulator, having first and second air inlets, a main air outlet and at least one exhaust outlet; two air circulation units and a control unit. Thermoelectric elements are energized, and cause a reduction of temperature on one side and an increase of temperature on the other side. One air flow is forced to flow through one of the housing air inlets, over a heat exchanger and to the first air outlet of the temperature regulator. Another air flow is forced to flow through one of the housing inlets, over the other heat exchanger and to the second air outlet of the temperature regulator.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: January 28, 2003
    Assignee: Entrosys Ltd.
    Inventors: Glen D. Guttman, Rami A. Drori
  • Patent number: 6508062
    Abstract: A thermal exchanger assembly for a wafer chuck and method of use therefor is disclosed. More particularly, complimentary manifolds, each having a plurality of fins, are positioned with respect to one another to provide interleaved spaced-apart fins. At least one thermo-electric device is disposed between alternating pairs of fins. The thermo-electric device is coupled to the fins to provide a thermally conductive path from one manifold to the other through the thermo-electric device. The thermal exchanger assembly may be located in a process chamber for processing a wafer, including but not limited to a semiconductor wafer.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: January 21, 2003
    Assignee: Applied Materials, Inc.
    Inventor: Allen Flanigan
  • Patent number: 6507490
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: January 14, 2003
    Assignee: The Furakawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto
  • Patent number: 6499306
    Abstract: A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: December 31, 2002
    Assignee: Electrografics International Corporation
    Inventor: Adelbert M. Gillen
  • Publication number: 20020184894
    Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
    Type: Application
    Filed: July 26, 2002
    Publication date: December 12, 2002
    Inventors: Andrew W. Batchelor, Ben Banney, David McDonald, Tilak T. Chandratilleke
  • Patent number: 6490869
    Abstract: A thermoelectric module (7) having exothermic and endothermic surfaces, which are heated and cooled, respectively, when an electric current is supplied thereto is built in a manifold body (17), and a cavity (10c, 10d, 20d) is defined therein for entry of a fluid medium in cooperation with at least one of the exothermic and endothermic surfaces, together with a hollow (10a, 10b, 20a, 20b) that extends from an outside to the cavity. A stirring member (5) having a stirring portion (15) integrated together with a rotor (16) within the manifold body (17) for stirring the fluid medium within the cavity is disposed within the manifold body, so that a motor can be formed by the rotor (16) and a stator (8). In this structure, the stirring member (5) is rotated by supplying electric power to the stator (8), to allow the fluid medium to reach the cavity (10c, 10d) through the interior of the rotor (16).
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: December 10, 2002
    Assignee: Matsushita Refrigeration Company
    Inventors: Toshio Uetsuji, Syouhei Inamori, Osao Kido, Kenichi Morishita, Masatsugu Fujimoto
  • Patent number: 6489551
    Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: December 3, 2002
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 6481213
    Abstract: The present invention is directed to method and apparatuses for modifying the air of a localized zone to suit personal comfort. This invention includes the heating or cooling of the air in the localized zone with a novel apparatus and inhibiting the concurrent release of byproduct air at undesirable temperatures while using a heat pump. The apparatus includes a thermal storage mass that provides a reservoir for the undesirable heating or cooling effects for later restoration. This restoration would occur at a predetermined time in predetermined amounts, typically when the localized zone is unoccupied.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 19, 2002
    Assignee: Instatherm Company
    Inventors: Peter Carr, John J. Lindberg
  • Publication number: 20020168496
    Abstract: A method of easily deforming a plate-shape vacuum insulation material and producing a smaller but highly effective insulation container, comprising steps of inserting a thermoplastic open-celled rigid foam as a core material into a packet composed of gas barrier film, evacuating and sealing the packet so as to produce a vacuum insulation material, heating and softening the vacuum insulation material so as to deform the same, and cooling the vacuum insulation material so as to cure the same, and also a freezing and refrigerating container having Peliter element.
    Type: Application
    Filed: November 15, 2001
    Publication date: November 14, 2002
    Inventors: Kiyotake Morimoto, Michihiro Oga
  • Patent number: 6474073
    Abstract: In a thermoelectric device such as a thermoelectric manifold having a plurality of stages of thermoelectric modules, not only are distributions of heat at endothermic and exothermic surfaces equalized to increase the heat exchange efficiency and also to suppress thermal strains in the thermoelectric modules, but also heat transmission between the thermoelectric modules is facilitated even though bowing occurs. For this purpose, in the thermoelectric device utilizing the plural thermoelectric modules, a fluid serving as a heat transfer medium is intervened between the thermoelectric modules and is utilized to achieve a transmission of heat from the exothermic surface of the thermoelectric module on a cooling side to the endothermic surface of the thermoelectric module on a heating side.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: November 5, 2002
    Assignee: Matsushita Refrigeration Company
    Inventors: Toshio Uetsuji, Syouhei Inamori, Osao Kido, Kenichi Morishita, Masatsugu Fujimoto
  • Publication number: 20020152757
    Abstract: A cooling exchanger comprised of a cooling base plate, two units of water pans and two units of water pumps. Within, Said cooling base plate include two units of contact plats incorporated with multiple units of SbBi crystals and bridged with a conductor. Outer edges between said two contact plates are coated with insulation resin to close and separate a shortage. A DC source is connected to said two units of SbBi crystal containing opposite polarities connected and a relative temperature difference (&Dgr;T) takes place at where both contact plates connected to the crystals. Said two units of water pan are locked in position on two contact plates of the cooling base plate. A water inlet and a water outlet provided on the front of each eater pan are respectively connected to form a close pipeline for the water controlled by a water pump to circulate inside the pipeline.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 24, 2002
    Inventor: Tsung-Chih Chen