Thermoelectric; E.g., Peltier Effect Patents (Class 62/3.2)
  • Patent number: 11974503
    Abstract: Provided is a thermoelectric module. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode, a heat sink disposed on the second substrate, and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which predetermined patterns are regularly repeated and connected. Each pattern includes a first surface disposed opposite to the second substrate, a in second surface which extends upward from one end of the first surface, a third surface which extends from the second surface to face the second substrate, and a fourth surface which extends upward from the other end opposite to the one end of the first surface and is connected to a third surface of an adjacent pattern.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: April 30, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jong Hyun Kim, Young Sam Yoo, Se Woon Lee
  • Patent number: 11946100
    Abstract: The present application provides a microdroplet container and a method for manufacturing the same, a method for spreading microdroplets, a microdroplet-generating kit, a temperature-controlling device, an oil phase composition for microdroplet generating and a method for treating the same. The temperature controlling device includes a flexible circuit board a heating substrate, and multiple semiconductor electric couples. The semiconductor electric couples are disposed between the flexible circuit board and a first surface of the heating substrate, and are connected to each other.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: April 2, 2024
    Assignee: SNIPER (SUZHOU) LIFE TECHNOLOGY CO., LTD.
    Inventor: Guang-Ji Sheng
  • Patent number: 11924997
    Abstract: A cold plate apparatus is disclosed. A cold plate includes a first set of sinusoidal conduits and a second set of sinusoidal conduits formed therein. The first set of sinusoidal conduits is arranged in a first direction, and the second set of sinusoidal conduits is arranged in a second direction. Crests of the first set of sinusoidal conduits overlap troughs of the second set of sinusoidal conduits. Crests of the second set of sinusoidal conduits overlap troughs of the first set of sinusoidal conduits. A first set of header plates is fluidically coupled to the first set of sinusoidal conduits, and a second set of header plates is fluidically coupled to the second set of sinusoidal conduits.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 5, 2024
    Assignee: Rockwell Collins, Inc.
    Inventors: Joseph Turney, Kimberly Saviers, Ram Ranjan, Robert H. Dold, Kathryn L Kirsch
  • Patent number: 11896132
    Abstract: The present invention provides systems, methods, and articles for stress reduction and sleep promotion. A stress reduction and sleep promotion system includes at least one remote device, at least one body sensor, and at least one remote server. The sleep promotion devices includes a control unit able to thermoelectrically heat or cool a fluid circulating through a mattress pad. In one embodiment, the control unit includes Peltier chips connected to two heat sinks via heat pipes, with both heat sinks attached to a fan for dissipating heat. In another embodiment, the control unit further includes EMF shielding for reducing EMF interference with a user's sleep.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: February 13, 2024
    Assignee: SLEEP SOLUTIONS INC.
    Inventors: Tara Youngblood, Todd Youngblood, Matthew Holling
  • Patent number: 11892204
    Abstract: The present disclosure is related to nested cooling and heating systems. The cooling system includes an outer cooling assembly with an inner cooling assembly inserted within the outer cooling system. The inner cooling assembly includes thermoelectric coolers, and the outer cooling assembly may thermoelectric or vapor compression driven. Additional intermediate cooling assemblies may be nested together with the inner and outer cooling assemblies to increase the cooling effect in the innermost cooling assembly. Similarly, the heating system uses nested thermoelectric heating assemblies, and hot temperatures can be increased by adding intermediate nested heating assemblies. Intermediate and/or inner assemblies may be removed from the outer assembly to allow for easy transport.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: February 6, 2024
    Assignee: Sheetak, Inc.
    Inventors: Uttam Ghoshal, Brandon Lee Noska
  • Patent number: 11888206
    Abstract: A antenna module includes a telematics unit having a telematics printed circuit board and a Peltier element. The telematics printed circuit board has a first section and a second section. The first section is cooled by a forced airflow and the second section is cooled by the Peltier element.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: January 30, 2024
    Assignee: Hirschmann Car Communication GmbH
    Inventors: Markus Pfletschinger, Thomas Adam, Uwe Daum, Dominik Schaich, Roland Boehmert
  • Patent number: 11851626
    Abstract: Phase change material compositions and methods for using the compositions to prepare substrate coatings or bulk blended polymers that advantageously lower friction between interacting substrate surfaces and lower substrate surface wear.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: December 26, 2023
    Assignee: The Texas A&M University System
    Inventors: Reza Gheisari, Andreas A. Polycarpou
  • Patent number: 11848565
    Abstract: A wireless power transmitter includes a charging coil, an electronics housing, and a top side. The charging coil housing houses a charging coil and includes a top surface, wherein the charging coil wirelessly transmits power to a receiver placed on the top surface of the charging coil housing. The electronics housing houses one or more electronics and a fan. The top side is located adjacent to the electronics housing, wherein a top surface of the top side faces a bottom surface of the receiver. An intake cooling path is defined by a region between the bottom surface of the receiver and the top surface of the top side and an exhaust cooling path is located on a side of the charging coil housing opposite the intake cooling path and defined by a region between the receiver and the top surface of the top side.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: December 19, 2023
    Assignee: Aptiv Technologies AG
    Inventors: George Powell, Jr., James Cook, Evan Wallace
  • Patent number: 11846669
    Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: December 19, 2023
    Assignee: Advantest Test Solutions, Inc.
    Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Thomas Jones
  • Patent number: 11844278
    Abstract: A thermoelectric element of the present invention comprises a first metal substrate, a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes, a second resin layer, and a second metal substrate, wherein the first metal substrate is a low-temperature portion, the second metal substrate is a high-temperature portion, the second resin layer comprises a first layer and a second layer arranged on the first layer, the first and second layers include a silicon (Si)-based resin, and the bonding strength of the first resin layer is higher than the bonding strength of the second resin layer.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 12, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seung Hwan Lee, Se Woon Lee, In Seok Kang, Sung Chul Kim
  • Patent number: 11828497
    Abstract: A chilled liquid recirculation device (CLRD) is disclosed. In embodiments, the CLRD has a first air-cooling stage wherein a liquid cooling medium (LCM) is pumped through a first-stage radiator and forced-air chilled by axial fans driving ambient air through the radiator fins. The initially chilled LCM passes to a second thermoelectric-cooling stage wherein a second-stage liquid-cooled heatsink receives the LCM, the liquid-cooled heatsink in contact with the cold side of a thermoelectric module having a hot side in contact with a finned heatsink through which second-stage fans force ambient air, cooling the hot side and thereby further chilling the cold side and the LCM by contact. The twice-chilled LCM is then pumped to a remote chiller device to chill the hot side of another thermoelectric module, thereby chilling a recirculating air supply passing through a finned heatsink in contact with the cold side.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: November 28, 2023
    Assignee: B/E Aerospace, Inc.
    Inventor: Peter J. L. Burd
  • Patent number: 11791236
    Abstract: A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: October 17, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaebeom Byun, Taehoi Hwang
  • Patent number: 11788776
    Abstract: A refrigeration unit includes: a refrigeration circuit including a compressor, a condenser, a thermal expansion valve, and an evaporator connected into a circuit; and a heat recovery system including a thermoelectric module, a control module and a battery; the thermoelectric module includes a first side and a second side, the first side being configured to establish a thermal connection with a first heat source and the second side being configured to establish a thermal connection with a second heat source, the first heat source and the second heat source having different temperatures, the thermoelectric module being configured to generate power by the temperature difference between the first heat source and the second heat source; and the control module is configured to store the power generated by the thermoelectric module to the battery, the battery being configured to drive the refrigeration circuit.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: October 17, 2023
    Assignee: CARRIER CORPORATION
    Inventors: Linhui Chen, Tingcan Mi
  • Patent number: 11778772
    Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: October 3, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajia Sui, Quanming Li, Guo Yang, Shuainan Lin
  • Patent number: 11761647
    Abstract: An air conditioning module including a thermo electric cell having a first side and a second side; an conditioning duct attached to the first side of the thermo electric cell; and an exhaust duct attached to the second side of the thermoelectric cell; wherein the conditioning duct receives and conditions air from a room, and the exhaust duct vents unwanted thermal energy.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: September 19, 2023
    Assignee: Wise Earth Pty Ltd.
    Inventors: Garry Frederick Baverstock, Sam Peter Paolino, Stephen Frederick Lucks
  • Patent number: 11692431
    Abstract: Methods, systems, devices, and products for downhole operations. Embodiments include downhole tools comprising an outer member configured for conveyance in the borehole; a pressure barrel positioned inside the outer member; a substantially cylindrical pod positioned inside the pressure barrel; and at least one downhole electronic component mounted between the exterior surface and the frame. The pod comprises at least one rigid outer surface forming an exterior surface of the pod and supported by a central frame extending across a diameter of the pod, such as a plurality of outer rigid surfaces. The pod may include a plurality of coupled rigid elongated semicircular metallic shells, wherein each shell of the plurality comprises a rigid outer surface of the plurality of outer rigid surfaces. Each of the at least one downhole electronic component may be sealingly enclosed within a corresponding shell.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: July 4, 2023
    Assignee: Baker Hughes Oilfield Operations LLC
    Inventors: Joachim Treviranus, Stephan Wink, Olaf Gaertner, Daniel Porzig, Tim Mueller, Andreas Peter
  • Patent number: 11674739
    Abstract: An entrance refrigerator includes a condensation removal device supplying heat dissipation air generated from a cold air supply module to an outer gasket or an inner gasket to prevent condensation formation on surfaces of the outer gasket and the inner gasket or an outer circumferential surface of a cabinet.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: June 13, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Daewoong Kim, Minkyu Oh, Boan Kwon
  • Patent number: 11665865
    Abstract: A system and method for controlling a cooling system for an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: May 30, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Luke Thomas Gregory, Rick Chun Kit Cheung
  • Patent number: 11639816
    Abstract: A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects. Additional aspects include a thermal pad wrap and a thermally conductive liquid system for heat/cool distribution.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: May 2, 2023
    Assignee: GENTHERM INCORPORATED
    Inventor: Charles J. Cauchy
  • Patent number: 11616185
    Abstract: A device that includes a region comprising a heat generating device, and an energy harvesting device coupled to the region comprising the heat generating device. The energy harvesting device includes a first thermal conductive layer, a thermoelectric generator (TEG) coupled to the first thermal conductive layer, and a second thermal conductive layer coupled the thermoelectric generator (TEG) such that the thermoelectric generator (TEG) is between the first thermal conductive layer and the second thermal conductive layer. In some implementations, the energy harvesting device includes an insulation layer.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: March 28, 2023
    Assignee: QUALCOMM INCORPORATED
    Inventors: Jorge Luis Rosales, Victor Adrian Chiriac, Mario Francisco Velez, Peng Wang
  • Patent number: 11611346
    Abstract: Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 21, 2023
    Assignee: Intel Corporation
    Inventors: Catharina Biber, Jason Mix, Mark Carbone, Mohamed A. Abdelmoneum, Joshua Linden Levy, Timo Huusari, Sarah Shahraini
  • Patent number: 11596263
    Abstract: Systems and methods including a container assembly configured to maintain a controlled environment for storing a product therein are disclosed. Controlled environmental parameters may include at least one of the following: temperature, humidity, payload moisture content, solar radiation, magnetism, microwave, or light illumination. In certain implementations, the system includes a payload chamber and a self-contained environmental control unit (ECU) that may be coupled to the payload chamber using a substantially airtight seal. In certain embodiments, the ECU may include a condenser, a humidity controller, a liquid tank and a power source. Certain embodiments may include a warmer, temperature and/or humidity sensors, and/or a lock. Various combinations of the foregoing components and features may be incorporated, depending on the requirements of each particular implementation.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: March 7, 2023
    Assignee: PENDRAM, INC.
    Inventors: Jonathan Siann, Wilson C. Ng
  • Patent number: 11600760
    Abstract: A solid state cooler device is disclosed that comprises a first normal metal pad, a first aluminum layer and a second aluminum layer disposed on the first normal metal pad and separated from one another by a gap, a first aluminum oxide layer formed on the first aluminum layer, and a second aluminum oxide layer formed on the second aluminum layer, and a first superconductor pad disposed on the first aluminum oxide layer and a second superconductor pad disposed on the second aluminum oxide layer. The device further comprises a first conductive pad coupled to the first superconductor pad, and a second conductive pad coupled to the second superconductor pad, wherein hot electrons are removed from the first normal metal pad when a bias voltage is applied between the first conductive pad and the second conductive pad.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: March 7, 2023
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Aaron Ashley Hathaway, John X. Przybysz, Robert Miles Young, Edward R. Engbrecht
  • Patent number: 11549697
    Abstract: An air cleaner including a thermoelectric module includes a blowing fan, a filter, and a thermoelectric module, so it is possible to generate cold air or hot air and perform air purification.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: January 10, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Minkyu Oh, Yanghwan No, Seungmin Yoo, Hyunshin Kee
  • Patent number: 11536506
    Abstract: A device for dispensing items includes a cabinet, and a drawer within the cabinet. The drawer includes one or more compartments for storing items and a cooling system within the drawer. The cooling system is configured to maintain the one or more compartments in the drawer at a temperature below the temperature of the environment surrounding the cabinet. The drawer further includes thermal insulation at sides of the drawer and thermal insulation beneath the one or more compartments. The refrigeration system may be a thermoelectric cooling system.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: December 27, 2022
    Assignee: OMNICELL, INC.
    Inventors: Herbert Lawson Fisher, Edith Wilson, Dean Fambro, Brian Arnold, Brad Basler, Vihar Kapadia, Sunil Belligundu
  • Patent number: 11525609
    Abstract: An entrance refrigerator includes a cabinet installed to pass through a front door or a wall and forming a storage compartment for storing goods, a housing coupled to a lower end of the cabinet, an outdoor side door coupled to a front surface of the cabinet to open or close the storage compartment and exposed to an outside, an indoor side door coupled to a rear surface of the cabinet to open or close the storage compartment and exposed to an inside, a cold air supply device accommodated in a space defined by a lower portion of the cabinet and the housing and supplying cold air to the storage compartment, and at least one guide duct mounted on a bottom surface of the housing and extending in a front-to-rear direction of the housing, the at least one guide duct having a discharge port formed therein.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: December 13, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Minkyu Oh, Minseok Kim, Insun Yeo, Deukwon Lee, Wonjin Lee, Kyukwan Choi, Yezo Yun
  • Patent number: 11511489
    Abstract: A three-dimensional shaping device includes a chamber that has a shaping space; a heating unit configured to heat the shaping space; a base that has a shaping surface exposed to the shaping space; a discharge unit configured to discharge a shaping material toward the shaping surface while moving in a first direction in the shaping space heated by the heating unit and shape a three-dimensional shaped article; a first drive unit configured to move the base in a second direction crossing the first direction; and a tubular first heat resistant member that is disposed between a peripheral part of a first opening formed in a partition wall of the chamber and the base, configured to extend and contract in the second direction in accordance with a movement of the base in the second direction, and defines a separation space separated from the shaping space, in which at least a part of the first drive unit is disposed in the separation space.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: November 29, 2022
    Inventors: Kohei Yuwaki, Koichi Saito
  • Patent number: 11509399
    Abstract: An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: November 22, 2022
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Taofiq Paraiso, Mirko Sanzaro, Thomas Roger, Davide Giacomo Marangon, Innocenzo De Marco, Zhiliang Yuan, Andrew James Shields
  • Patent number: 11493257
    Abstract: An entrance refrigerator includes an upper first cold air supply on an upper portion and a lower second cold air supply on a lower portion, and an external air guide provided between the upper first cold air supply and the lower second cold air supply.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: November 8, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Daewoong Kim, Minkyu Oh, Boan Kwon, Wonjin Lee
  • Patent number: 11485241
    Abstract: A system and method for efficient (e.g., economical) computing in hybrid, plug-in hybrid, and electric vehicles is disclosed. A compute manager is configured to receive and schedule compute tasks for execution on computing cores in the vehicle to increase the usage of recaptured energy that would otherwise be wasted due to battery limitations. Vehicle status information such as current battery charge level and current route may be used to determine whether compute tasks can be beneficially executed.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: November 1, 2022
    Assignee: Core Scientific, Inc.
    Inventor: Benjamin Flint Stephens
  • Patent number: 11482870
    Abstract: A vehicle battery charging apparatus for wirelessly charging a device. The apparatus has a charging device compartment with a platform for retaining the device, and a battery charger housing for retaining a wireless battery charger. One or more housing vents are provided in the battery charger housing. And, a blower is in air communication with the battery charger housing to communicate air with the battery charger housing through the one or more housing vents to cool the wireless battery charger.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 25, 2022
    Assignee: AMPHENOL TECVOX, LLC
    Inventors: Steven F. Selby, Tommy L. Roberts
  • Patent number: 11473792
    Abstract: A temperature-regulating fan includes a housing in which a chamber is formed, wherein the housing is provided with an air inlet and an air outlet communicated with the chamber, and an air flow passage is formed between the air inlet and the air outlet; a wet curtain assembly comprising an evaporation unit provided in the air flow passage; and an air flow driving assembly configured to drive the air flow entering through the air inlet to the air outlet to be blown out through the air flow passage. The temperature-regulating fan of the present application has high cooling and heating efficiency, and has a good market application prospect.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: October 18, 2022
    Assignee: Jmatek (Zhongshan) Ltd.
    Inventors: Naresh Kumra, Bo Ge, Yi Pu, Huoxi Zhou
  • Patent number: 11462457
    Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 4, 2022
    Assignee: Intel Corporation
    Inventors: Krishna Vasanth Valavala, Kelly Lofgreen, Chandra-Mohan Jha
  • Patent number: 11435766
    Abstract: A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 6, 2022
    Assignee: Maxwell Labs Inc
    Inventor: Jacob A. Balma
  • Patent number: 11434126
    Abstract: A water cooling apparatus and a water purifier having a water cooling apparatus is provided. The water cooling apparatus may include a case, a water tank provided within the case, a cooling block provided to be in contact with the water tank and to cool the water tank through heat exchange, a thermoelectric element having one side in contact with the cooling block and provided so as to transfer heat from the one side to another side of the thermoelectric element when power is applied thereto, an insulator provided within the case and that covers the water tank and the cooling block, and a heat dissipation block provided outside of the case and provided to be in contact with the other side of the thermoelectric element to dissipate heat from the other side of the thermoelectric element.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: September 6, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Jintae Kim, Jinpyo Hong, Jaegeun Lee, Jisun Jung
  • Patent number: 11414981
    Abstract: Aspects of the subject technology relate to a sensor container for a downhole tool. The sensor container can be mountable in a receiver space on a carrier that is insertable into a wellbore. The sensor container can comprise a container body having a receiving space to which a shock-sensitive sensor is couplable. Further, the sensor container can comprise a shock absorber positioned at a lateral side thereof. The shock absorber can be configured to buffer shock forces and vibration forces acting thereupon.
    Type: Grant
    Filed: June 30, 2019
    Date of Patent: August 16, 2022
    Assignee: Halliburton Energy Services, Inc.
    Inventor: Brian David Breaux
  • Patent number: 11310934
    Abstract: A power transmitter includes a transmitter antenna includes at least one coil configured to transmit the power signal to the power receiver, the at least one coil and a shielding comprising a ferrite core and defining a cavity, the cavity configured such that the ferrite core substantially surrounds all but the top face of the at least one coil. The power transmitter includes a housing configured for housing, at least, the transmitter antenna. The housing defines an airflow opening configured to provide an airflow to a first airflow channel and to a second airflow channel. The first and second airflow channels configured to provide the airflow to one or more of a top face of a mobile device thereon and a bottom face of the mobile device.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: April 19, 2022
    Assignee: NuCurrent, Inc.
    Inventors: Oleg Los, Md Nazmul Alam
  • Patent number: 11298667
    Abstract: A preparation vessel, in particular for a food processor, has a vessel wall and a preparation area surrounded by the vessel wall. The vessel wall has a cooling device that contacts the vessel wall in a heat-conducting manner for cooling a preparation item present in the preparation area. The vessel wall in at least a partial area has a double-walled design, with an inner wall bordering the preparation area and an outer wall that is formed separately from the inner wall and spaced apart from the inner wall by a gap, wherein the gap has the cooling device and a phase change material located between the cooling device and the outer wall as viewed in a direction from the preparation area to the outer wall.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 12, 2022
    Assignee: Vorwerk & Co. Interholding GmbH
    Inventors: Michel Kellenberger, Stefan Stahl
  • Patent number: 11287193
    Abstract: A refrigerator may include an inner casing having a storage chamber defined therein; and a thermoelectric module including a thermoelectric element for cooling the storage chamber, a cooling sink in contact with one surface of thermoelectric element, and a heat sink contacting the other surface of thermoelectric element, wherein the heat sink includes: a heat dissipation fin including a stack of a plurality of fins; a heat dissipation plate coupled to the heat dissipation fin; a heat dissipation pipe for connecting the heat dissipation plate to the heat dissipation fin, wherein the heat dissipation pipe is arranged to pass through the heat dissipation fin.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: March 29, 2022
    Assignee: LG Electronics Inc.
    Inventors: Woosung Lee, Jihun Lee
  • Patent number: 11291138
    Abstract: The invention provides a cooling system for a server. The cooling system includes a casing and a first heat dissipation device. The casing includes a tank and a cover. The tank has an accommodation space. The cover is movably mounted on the tank, and the cover covers the accommodation space so as to form an airtight space with the tank. The first heat dissipation device is mounted on the cover and located within the airtight space of the casing.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: March 29, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 11277935
    Abstract: A power transmitter includes a transmitter antenna includes at least one coil configured to transmit the power signal to the power receiver, the at least one coil and a shielding comprising a ferrite core and defining a cavity, the cavity configured such that the ferrite core substantially surrounds all but the top face of the at least one coil. The power transmitter includes a housing configured for housing, at least, the transmitter antenna. The housing defines an airflow opening configured to provide an airflow to a first airflow channel and to a second airflow channel. The first and second airflow channels configured to provide the airflow to one or more of a top face of a mobile device thereon and a bottom face of the mobile device.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: March 15, 2022
    Assignee: NuCurrent, Inc.
    Inventors: Oleg Los, Md Nazmul Alam
  • Patent number: 11252956
    Abstract: A container includes a vial, cap, and one or more wireless transponders secured to the cap, the vial or a jacket to store and identify samples of biological material at cryogenic temperatures (e.g., vitrified biological samples), for instance held by cryopreservation storage devices. A specimen holder may be extend from the cap. The vial and/or cap includes ports or vents. A carrier includes a box, thermal shunt, thermal insulation to store and identify arrays of containers that hold cryopreservation storage devices with samples of biological material at cryogenic temperatures. Various apparatus include wireless transponders positioned and oriented to enhance range, and allow interrogation while retained in a carrier. Various apparatus can maintain the biological material at or close to cryogenic temperatures for prolonged period of times after being removed from a cryogenic cooler, and can allow wireless inventorying while maintaining the biological samples at suitably cold temperatures.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: February 22, 2022
    Assignee: TMRW Life Sciences, Inc.
    Inventors: William Alan Blair, Timothy Alan Sharp
  • Patent number: 11209197
    Abstract: The present invention provides a refrigerating/heating device that efficiently refrigerates and heats while suppressing device costs. This refrigerating/heating device for efficiently heating and refrigerating is provided with: a refrigeration chamber; a Peltier-type cooler for supplying cold air to inside the refrigeration chamber; a heat radiation member for radiating Peltier heat; fans for air-cooling the heat radiation member; an exhaust duct through which waste heat from the fans and the heat radiation member passes; and an installation part to which a subject to be heated can be installed. The subject to be heated is installed in the waste heat flow path of the exhaust duct and heated.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 28, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Tadao Yabuhara, Terumi Tamura, Hiroshi Watanabe
  • Patent number: 11193456
    Abstract: An EGR system is configured to allow a part of exhaust gas discharged from an engine to an exhaust passage to flow as an EGR gas to an intake passage through an EGR passage to return to the engine. The EGR system includes a heating film provided on an inner wall of at least one of the intake passage through which the EGR gas flows, i.e., an intake manifold, and the EGR passage, at least one pair of a positive electrode and a negative electrode to energize the heating film, a water temperature sensor and an intake temperature for detecting a warm-up state of the intake passage and the EGR passage, and an electronic control unit configured to control energization of the heating film from before start of EGR based on the detected warm-up state.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: December 7, 2021
    Assignee: AISAN KOGYO KABUSHIKI KAISHA
    Inventors: Mamoru Yoshioka, Kaisho So, Takashi Bessho
  • Patent number: 11148505
    Abstract: A temperature control layer, for example for an interior trim of a vehicle or a vehicle part is disclosed. The temperature control layer includes an areal thermoelectrical temperature control arrangement with at least one thermoelectrical element and an air extraction arrangement with at least one air extraction duct. The at least one air extraction duct leads from an outside of the temperature control layer through the temperature control arrangement to an inside of the temperature control layer.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: October 19, 2021
    Inventors: Dirk Neumeister, Achim Wiebelt
  • Patent number: 11125720
    Abstract: A capillary electrophoresis apparatus is disclosed that does not discharge and achieves both compactness and performance even with a part configuration having insufficient spatial distance or creeping distance. This capillary electrophoresis apparatus is provided with a resistance heater for heating capillaries, an electrode holder that holds capillary electrodes and is connected to a high-voltage unit, and a conductive member that at least partially comprises metal and has been grounded to a low potential. The electrode holder and conductive member are in contact with heat-dissipating rubber disposed there between that composes a structure comprising an insulation member. As a result of this configuration, discharge risk is reduced through the reduction of the potential of parts near the high-voltage unit and the slow reduction of the high potential of the high-voltage unit.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 21, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Taro Nakazawa, Motohiro Yamazaki, Kenko Uchida, Akira Fujii
  • Patent number: 11098702
    Abstract: A liquid delivery device includes a pump head having a pump chamber provided in the inside, a plunger whose tip is slidably inserted into the pump chamber, and at least one plunger pump having a drive mechanism that reciprocates the plunger in its axial direction. Then, at least one of the plunger pumps is a pressurizing pump that pressurizes a mobile phase including a compressible fluid sucked into the pump chamber and then discharges the mobile phase from the pump chamber, and at least the pump head of the pressurizing pump includes a cooling part that is connected to an outlet channel from the pump chamber, and allows the pump head to absorb heat of the mobile phase discharged from the pump chamber to cool the mobile phase.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 24, 2021
    Assignee: Shimadzu Corporation
    Inventor: Jun Yanagibayashi
  • Patent number: 11092377
    Abstract: A beverage container cooling unit has: (a) a housing having a slot for receiving a container therein, (b) a cooling element having a cold supply, (c) a heat conductive panel enabling heat transfer between a container provided in the slot and the cold supply; wherein the heat conductive panel has two material layers fixed against one another: (I) a first material layer defining a cooling surface facing the container receiving slot and an opposed surface, said first layer made of a material having a thermal expansion coefficient of X1; (ii) a second material layer having a contact surface facing positioned against the opposed surface of the first material layer and a second opposed surface, the second material layer having a thermal expansion coefficient of X2, different from X1, the difference in thermal expansion causing the conductive panel to bulge at a change in temperature.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: August 17, 2021
    Assignee: Anheuser-Bush InBev S.A.
    Inventors: Daniel Peirsman, Stijn Vandekerckhove
  • Patent number: 11073502
    Abstract: This disclosure relates a device for a chromatographic system, comprising: a chamber defining an internal portion, a capillary disposed within the chamber, the capillary having an input, an output, and an elongate body extending between the input and the output, a cold finger having a first portion in thermal contact with a portion of the elongate body to define a capillary trapping zone, wherein the first portion of the cold finger extends to a second portion that is situated external to the chamber, a heater in thermal contact with the trapping zone of the capillary and configured to transfer heat to the trapping zone, a thermal buffer configured to buffer the heat from the heater into the cold finger and thereby retain the heat within the trapping zone of the capillary, a cooling device arranged external to the chamber and thermally connected to the second portion of the cold finger to define a primary conduction zone, wherein the cooling device is configured to generate a cooling temperature zone at the p
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: July 27, 2021
    Assignee: LECO Corporation
    Inventors: Gaetano Stallone, Mark Merrick
  • Patent number: 11054087
    Abstract: A light emitting diode (LED) filament light bulb is disclosed. The LED filament light bulb includes a plurality of LED filaments, an RF driver, an antenna, and a cover. The antenna defines a first end portion and a second end portion, where the first end portion of the antenna is electrically connected and in signal communication with the RF driver. The cover defines an external wall and a support structure. The external wall defines an interior volume and the support structure defines an evacuation passageway and a cavity. The evacuation passageway and the antenna are both received within the cavity of the support structure and the evacuation passageway is fluidly connected to the interior volume of the cover.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 6, 2021
    Assignee: Technical Consumer Products, Inc.
    Inventors: Dustin Cairns, George J. Uhler, Paul Phillips, Jimmy Zheng