Abstract: The invention is a method for structuring a flat substrate composed of glass material in the course of a viscous flow process. The glass flat substrate is joined to a surface of a flat substrate, which is preferably a semiconductor flat substrate, having at least one depression bounded by a circumferential edge located in the surface. In the course of a subsequent tempering process, glass material is changed to a viscous free-flowing state in which at least proportions of the free-flowing glass material of the flat substrate flow over the circumferential edge into the depression in the flat substrate.

Abstract: MEMS and microelectronic devices and fabrication methods feature providing a first material including a glass, providing a second material having an elastic modulus greater than the elastic modulus of silicon, causing the second material to have a surface with a RMS surface roughness of greater than 0.001 ?m and less than approximately 0.15 ?m, contacting the surface of the second material to a surface of the first material, and applying a voltage between the first and second materials to cause an anodic bond to form.

Abstract: The invention provides a method of fastening lamellae of a lamellar material that is at least partially conductive onto an insulating substrate (2) containing oxides that are suitable for dissociating into mobile ions of given charge and stationary ions of opposite charge, the method comprising the steps of: placing a sample (1) of the lamellar material against a surface of the substrate; causing the oxides of the substrate to dissociate; and subjecting the substrate and the sample to an electric field by means of an electrode in contact with the substrate and an electrode in contact with the sample.

Abstract: A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate 2, and such a coating film 8 is fired to form a sealing material layer 7. The glass substrate 2 is laminated with another glass substrate via a sealing material layer 7, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.

Abstract: Glasses comprising Bi203, ZnO B203 and optionally a colorant including an oxide of a metal such as iron, cobalt, manganese, nickel, copper and chromium are suitable to form hermetic seals in solar cell modules, architectural glass windows and MEMS devices. Glass frit and paste compositions suitable for flow and bonding to various substrates—glass, metal, silicon, in the temperature range of 400-500 degrees Centigrade. The broad compositional range in mole % is 25-70% Bi203, up to 65% ZnO, and 1-70% B203. Such glasses do not have batched in alumina or silica. Such glasses lack alumina and silica.

Abstract: A frame-attached anti-reflection glass (a cap for optical device) includes a plate-shaped member including an anti-reflection film formed on at least one surface of a plate-shaped glass, and a frame-shaped member made of silicon joined to a peripheral portion on one surface side of the plate-shaped member. The anti-reflection film includes two partial films having different compositions, and one partial film is a light-absorbent film. The two partial films are continuously formed on the plate-shaped glass, and respective surfaces of each partial film are on a level with each other. The plate-shaped glass and the frame-shaped member (silicon) are joined together by anodic bonding.

Abstract: A composite object comprises two components (2a, 2b) made of an oxidic material which is ion conductive at an elevated temperature, said components being joined to each other in a medium-tight manner by way of a solder bridge (4) in a connection zone (6) located therebetween. In order to form a reliable connection, it is proposed that the solder bridge is formed by a low-melting tin alloy that has a weight proportion of at least 65%w tin and a melting point of maximally 350° C. and comprises at least one activating metal as an alloying constituent.

Abstract: A novel fused and cast refractory product with a high zirconia content having improved electrical resistivity includes, as a percentage by weight relative to the oxides and for a total of more than 98.5%: ZrO2+Hf2O: >85% SiO2: 2% to 10% Al2O3: 0.1% to 2.4%, with Al2O3/SiO2<0.5 Y2O3: ?1%, B2O3: <1.5%; and a dopant selected from the group formed by V2O5, CrO3, Nb2O5, MoO3, Ta2O5, WO3, and mixtures thereof, in a weighted quantity such that: 0.2%?2.43V2O5+8.84CrO3+1.66Nb2O5+6.14MoO3+Ta2O5+3.81WO3.

Abstract: After sealing layers are formed on peripheral edge parts of a front substrate and a rear substrate, the front substrate and the rear substrate are disposed to be opposed to each other. Current paths are formed in the sealing layers, and power supply is begun. An electric current, which reaches a maximum current value after a current-increasing period of 10% or more of an entire power-supply time, is supplied for a perdetermined time period. The sealing layers are heated and melted by the power supply, and peripheral parts of the front substrate and rear substrate are joined.

Abstract: Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or unifying with the underlying porous thin film layer so that the combined sol-gel/thin layer exhibits substantially the same properties as the untreated porous thin film layer before the sol-gel was applied. As a result, a greater etching accuracy is achieved.

Abstract: The method includes the steps include: providing first and second sheets of translucent glass having first and second principle sides coating at least a portion of at least on of the first principle sides of the first and second sheets with a layer of ceramic paint; placing the first and second sheets of coated translucent glass together such that the first principle surfaces are in contact with each other forming a sandwich; applying a layer of material on at least a portion of an external surface of at least one of said first and second glass sheets that will cause differential heating of the layer of ceramic paint applied to at least a portion of at least on of said first principle sides of said first and second sheets when the sandwich is heated to temperatures which will fuse the first and second sheets together; and heating the sandwich to a sufficient temperature for a sufficient time such that the first and second coated sheets of glass are fused together.

Abstract: A dielectric lens is formed by laminating a plurality of dielectric sheets having different diameters along a focal axis of the lens. The first dielectric sheet is formed by injecting a dielectric material in a molten state at a predetermined pressure and cooling and solidifying the dielectric material. Each successive dielectric sheet is formed by injecting the dielectric material in a molten state on the preceding dielectric sheet and cooling and solidifying the dielectric material, so that each successive dielectric sheet and each immediately preceding dielectric sheet are fusion-bonded to each other.

Abstract: An improved apparatus and method for vacuum fusion bonding of large, patterned glass plates. One or both glass plates are patterned with etched features such as microstructure capillaries and a vacuum pumpout moat, with one plate having at least one hole therethrough for communication with a vacuum pumpout fixture. High accuracy alignment of the plates is accomplished by a temporary clamping fixture until the start of the fusion bonding heat cycle. A complete, void-free fusion bond of seamless, full-strength quality is obtained through the plates; because the glass is heated well into its softening point and because of a large, distributed force that is developed that presses the two plates together from the difference in pressure between the furnace ambient (high pressure) and the channeling and microstructures in the plates (low pressure) due to the vacuum drawn.

Abstract: An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a conventional epoxy or frit. The electrostatic thermal bonding method uses a silicon-glass bonding mechanism. First, a silicon thin film is deposited on a metal thin film formed on a side of one glass substrate, and the two glass substrates are brought face to face with each other by bringing the silicon thin film into contact with the surface of the other glass substrate. A predetermined direct current voltage is applied between the metal thin film and the other glass substrate under a predetermined temperature, thereby the bonding between glass substrates is performed. In the glass-glass bonding method utilizing the silicon thin film, the direct current voltage in the range of 0 to 1000V is applied under a bonding temperature between 100 to 500° C.

Abstract: A semiconductor acceleration sensor has a silicon detecting body and a glass substrate. The silicon detecting body has a weight, a supporting frame, and beams for coupling the weight to the supporting frame, which are integrally processed from a silicon wafer. At least one semiconductor strain gauge is formed on a surface of a beam. The glass substrate is electrostatically joined with the supporting frame of the silicon detecting body. Furthermore, a gap portion is formed between a surface of the glass substrate and a lower surface of the weight.

Abstract: Flat glass provided with precision structures is required for precision applications, especially for glasses with optical properties, for example for modern flat display screen glass. A method for forming precision structures in or on flat glass includes filling a structuring surface of a forming tool with a paste-like material and pressing the forming tool on one side of the flat glass. The forming tool is heated locally shortly prior and/or during or after contact with the glass surface with the structuring surface from the outside until the structuring surface down to a depth predetermined by the height of the structures being formed reaches a temperature at which a melting and hardening of the paste-like material forming the structures occurs during contact with the flat glass. The local heating of the structuring surface is performed by laser radiation which is passed through the flat glass to the structuring surface. Alternatively an inductive or resistance heating can be performed.

Abstract: The invention relates to a method of anodic bonding and a method for producing glass coatings for purposes of anodic bonding and colloidal solutions suitable for this purpose. The method is particularly suitable for anodic bonding with glass coatings with a thickness of greater than 100 nm up to 10 .mu.m, which are used for connecting two semiconductor layers. In order to produce the required glass coating, an SiO.sub.2 -sol is dissolved in at least one or in a mixture of n-alkanols (n=1 to 5). Then tetraethyl orthosilicate (TEOS), methyl triethoxysilane (MTEOS) and water are added to this organosol. Furthermore, a small quantity of acid is added to the desired quantity of alkali salts, and the colloidal solution is at least partly polymerized. The colloidal solution thus obtained is suitable for coating conductive materials by cost-effective methods such as immersion, spin-on deposition or spraying and subsequent tempering. After one coating there results a glass coating with a thickness of up to 2 .mu.m.

Abstract: A flat display device, preferably of the PALC type, in which the plasma channels are formed by etching in a substrate laterally-spaced channels and bonding a thin dielectric sheet over the etched substrate. Adjoining each of the channels are shallow ledges, also formed by etching, which serve as recessed areas to receive enlarged ends serving as contact pads for each of the electrodes. Holes are formed in the thin dielectric sheet and contact material deposited on the bonded thin dielectric sheet such that the deposited material makes electrical contact with the underlying electrode contact pads and seals off the holes, which allows a plasma-forming atmosphere to be provided in the channels. This arrangement results in a glass-to-glass interface between the substrate and the thin dielectric sheet, which allows anodic bonding to be employed to assemble the two elements and thus eliminates the frit glass sealing process required in other constructions.

Abstract: A small glass electrode and process for preparation thereof, the small glass electrode having a bonded structure and comprising a reference electrode composed of silver/silver chloride, a glass substrate having a pad embedded therein, the pad being composed of gold or platinum and circuit-connected to the reference electrode, and a silicon substrate having a (100) plane selectively etched by the anisotropic etching technique and comprising a groove for injecting an electrolyte composed of an aqueous solution containing chlorine such as KCA, or HCA, at least one hole for holding the electrolyte and a glass film formed in a portion corresponding to the reference electrode. The structure of the small glass electrode may be produced by the disclosed process easily and at low cost. Additionally, the small glass electrode, in differing embodiments, may include a reference electrode and a temperature sensor.

Abstract: A method for the controlled bending of anodically bonded two-dimensional composites of glass and metal or semiconductor materials. The composite is heated after bonding, for up to 200 hours to a temperature of from 250.degree. C. to Tg-10 K. As a result of this heating, controlled compaction of the glass body and, hence, bending of the composite, are achieved to reduce or reverse any distortion that has occurred during bonding.

Abstract: A process for anodic bonding, in which Si substrate and glass substrate are contacting each other, a voltage is applied therebetween, and then light is irradiated on a contact portion thereof, whereby the Si substrate and the glass substrate are bonded at a lower temperature than transition temperature of the glass substrate.

Abstract: Anodic bonding of an insulator containing no movable ion and a conductor through the medium of a conductive film and an insulator layer containing a movable ion affords a bonded member of the insulator containing no movable ion and the conductor without use of any adhesive agent. A method for effecting the anodic bonding is also provided.

Abstract: The invention provides a method of bonding a glass substrate and a nonconductive substrate comprising the steps of: (a) contacting a surface of the nonconductive substrate which is coated with a field-assist bonding material with a conforming surface of the glass substrate; and (b) applying sufficient heat to the two substrates and sufficient voltage across the two substrates to bond the two substrates together.

Abstract: A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.

Abstract: An anodic bonding method in which a semiconductor wafer and an inorganic insulating material are bonded together includes the steps of forming a first metallic thin film having a strong contact with the inorganic insulating material on one surface of the inorganic insulating material. Then, a second metallic thin film which is stable in air is formed on the first metallic thin film. The inorganic insulating material is placed on the semiconductor wafer so that a surface of the inorganic insulating material opposite the first metallic film is brought into contact with the semiconductor wafer. Then, a DC voltage is applied across the first and second metallic thin films as a cathode and the semiconductor wafer as an anode while the inorganic insulating material and semiconductor wafer are heated. Since the first metallic thin film contacts with the inorganic insulating material strongly and fills all fine gaps, voids can be prevented from occurring in bonded layers.

Abstract: An insulated glass unit formed from a pair of glass sheets, one of which has an electroconductive coating, i.e. a first sheet, is fabricated by positioning the first sheet on a vacuum support and the other sheet, i.e. second sheet, spaced above the first sheet a sufficient distance therefrom to prevent arcing during electrical heating of the marginal edges of the second sheet. After the marginal edges of the second sheet are heated to a temperature sufficient to cause sagging of the marginal edges, the two sheets are brought together to join the marginal edges by fusion. A strip heater heats the edges of the sheet to a temperature sufficient to prevent chilling of the marginal edges of the upper sheet when contacting the marginal edges of the lower sheet. Thereafter, the sheets are separated from one another and air moved between the sheets to bloom the edes. After blooming the edges, the joined glass sheets are annealed, and an insulating gas moved into the airspace through a pore hole.

Abstract: In a method of manufacturing a semiconductor device, at least a support body (1) and a monocrystalline semiconductor body (2) are provided with at least one flat optically smooth surface obtained by means of bulk-reducing polishing (mirror polishing), while at least the semiconductor body is provided at the optically smooth surface with an oxide layer (3). The two bodies (1 and 2) are brought into contact with each other in a dust-free atmosphere after their flat surfaces have been cleaned in order to obtain a mechanical connection. Before the bodies are brought into contact with each other, at least the oxide layer (3) on the semiconductor body (2) is subjected to a bonding-activating operation, while after a connection has been formed between the surfaces, radiation (5) of a laser is focused on the connection surface of the two bodies and material of at least the semiconductor body is molten locally near the connection surface by means of the laser radiation.

Abstract: The method of producing a hermetic stable structural bond between quartz crystals includes providing first and second quartz crystals and depositing thin films of borosilicate glass and silicon on portions of the first and second crystals, respectively. The portions of the first and second crystals are then juxtaposed in a surface contact relationship and heated to a temperature for a period sufficient to cause the glass and silicon films to become electrically conductive. An electrical potential is then applied across the first and second crystals for creating an electrostatic field between the adjoining surfaces and causing the juxtaposed portions to be attracted into an intimate contact and form a bond for joining the adjoining surfaces of the crystals.

Abstract: Methods for bonding transparent materials to opaque materials. The materials to be bonded are placed in tightly abutting relation to one another, and an energetic laser pulse is directed through the transparent material until it melts a thin surface layer of the opaque material. The desired bond is formed when the melted layer solidifies. In alternative embodiments the transparent material is precoated with various mediator materials to facilitate the bonding process.

Abstract: This invention concerns with a process and apparatus for fabricating microlenses on optical fibers. A pulsed laser beam and an end portion of a fiber are arranged relative to each to another so that the laser beam is incident on the end portion of the fiber at an acute angle .theta. to the longitudinal axis of the fiber. The angle is selected to attain a desired curvature of a lens formed by ablation and heating of the end portion of the fiber by the laser beam. A movement of the fiber and the laser relative each to another results in progressive engagement of the end portion of the fiber with the laser for a preselected distance so as to produce a short taper with a lens at the end thereof. In the preferred embodiment, the fiber rotated about its axis within a passage of the holder which moves the end-portion of the fiber into and through the laser beam resulting in the said lens. The precise repeatability of the lens formation may be controlled by a computer.

Abstract: A system is provided for positioning a pair of electrodes on either side of the end portion of an optical fiber extending through a contact, to establish an arc through a cross-aperture in the contact and across the fiber to melt the fiber into a lens, which assures close control of the arc and which prolongs the life of the electrodes. The tips of the electrodes are positioned to lie slightly within opposite ends of the cross-aperture, to avoid establishing an arc between the electrodes which passes around the contact instead of through the cross-aperture. The electrodes are spaced apart by at least about eight times the diameter of the optic fiber, to avoid deposition of vapors from the heated optic fiber onto the electrodes. The cross-aperture extends to the tip of the contact, so the contact can be moved along its axis to a position where the electrodes lie on opposite sides of the fiber end portion.

Abstract: A system is described for forming a lens at the end of an optical fiber which extends through a hole in a contact, so the tip of the lens lies at a desired lens position located a predetermined distance rearward of the tip of the contact. The fiber is fixed to the contact at a position wherein the tip of the fiber lies forward of the desired lens position, at about the tip of the contact. The contact is positioned vertically, with the tip of the fiber pointing upwardly, and an arc is passed across the end portion of the fiber, to initially heat and bulge out a location on the fiber spaced rearward of the tip. As the fiber is heated, the tip portion falls into the bulging portion, while the bulging portion moves down, with the heating continued long enough so that the tip of the molten ball of glass lies at the desired lens position.

Abstract: A system is provided for forming an end of an optical fiber into a lens, which produces a lensed fiber having an especially smooth lens surface and high strength near the intersection of the lens and the rest of the fiber. A lens is formed by establishing a pair of electrodes on opposite sides of a fiber end portion and establishing an arc between the electrode tips for a sufficient current and time to melt the fiber end portion into a lens, with the arc being repeatedly terminated and restarted at a rate of thousands of times per second.

Abstract: A fixture is provided which enables the rapid mounting of an optical fiber contact with its forward end at a predetermined position and orientation with respect to arc-creating electrodes. The fixture includes a frame with a vertical slot having a width greater than the diameter of the cylindrical contact, and a plurality of spring-biased plungers which enable the contact to be pushed sidewardly into the slot and which thereafter press the contact against the slot bottom. The contact can slide vertically along the slot and plungers until a stop on the contact abuts a corresponding stop on the fixture and an orienting pin on the fixture passes into a corresponding hole in the contact stop.

Abstract: An improved electrode for detecting ion concentration and a method of manufacturing such an electrode. The electrode includes concentric glass tubes, including an inner tube which is filled with a filling solution and a larger, outer tube which extends above the level of the filling solution in the inner tube. A metal contact is immersed in the filling solution and extends outside the inner tube through a hermetic seal to allow electrical contact to be made to the filling solution. The inner tube is made of a different glass from the outer tube so that the inner tube will absorb radiation at selected wavelengths which are transmitted by the outer tube. The inner tube is illuminated with radiation of the proper wavelength so that the inner tube melts and collapses around the metal contact to form the hermetic seal. In an alternate embodiment, the electrode has an inner tube which is made of two different types of glass. An apparatus for mechanizing the electrode sealing process is also described.

Abstract: A process for producing pressure sensors and other similar devices in which a fluid-tight bond between a sealing glass and another material is obtained under the effect of the application of heat and an electric field.The process is characterized in that the parts to be assembled float on the surface of a molten metal bath. The bath is positioned in a chamber within which a partial vacuum prevails.

Abstract: Dielectrically isolated single crystal silicon of high quality is produced by an extremely convenient process. This process involves the fusing of two silicon bodies where at least one of these bodies has a region of silicon oxide. The bodies are contacted so that the silicon oxide is at an interface between the two bodies. The bodies are then heated to an elevated temperature while applying a nominal electrical potential across the interface. This combination of applied potential and temperature permanently fuses the two bodies without producing any significant damage to the crystal quality of these bodies.

Abstract: A method for making an airtight seal between a pair of insulator elements, uch as glass plates, without destroying any fine structure etched in the insulator elements. A thin metal film is deposited on one of the elements to be sealed and then placed in intimate contact with the other element to be sealed. The elements are then heated to a temperature well below their softening point, but high enough to significantly enhance the ion mobility in the insulator. A voltage is applied across the interface and the resulting anodic reaction consumes the film at the interface while producing a strong hermetic bond between the insulator elements.

Abstract: A method of utilizing anodic bonding to bond a conductive semiconductor wafer to a metallized dielectric glass plate so as to form a capacitive pressure sensing element is disclosed. The method includes positioning the semiconductor wafer in contact with the glass plate, heating the wafer and glass plate and applying a substantial positive DC potential to the semiconductor wafer and metallization on the glass plate while applying a negative DC voltage potential to the glass plate. The glass plate metallization forms one capacitor plate of the capacitive pressure sensing element while the semiconductor wafer forms the other capacitor plate.

Abstract: A glass edge multiple glazed unit having fillets of substantially uniform thickness is produced by the application of heat to marginal edge portions of adjacent sheets, followed by a delay sufficient to establish a substantially uniform, greater than fusing temperature condition in the body of fillet-forming glass. The fused sheets are thereafter drawn apart a preselected distance to a spaced-apart face-to-face relation to form a glass-edge multiple glazed unit.

Abstract: A method of bonding a cover glass to a semiconductor substrate having conductors thereon. The cover glass and the semiconductor substrate are placed in a relatively high voltage field and heated to induce ion drift in the glass and improved conductivity in the substrate. Additional localized heating softens the cover glass in the vicinity of the conductors permitting the cover glass to flow around the conductors and to be drawn into contact and bonded with the substrate.

Abstract: A method and apparatus for electrostatic bonding of a layered structure having at least one glass stratum by heating the layered structure to a temperature above the annealing point of the glass stratum, by applying a predetermined pressure and voltage potential across the layered structure while the layered structure is maintained at an elevated temperature. Application of pressure across the heated layered structure permits electrostatic bonding of non-complemental surfaces to form a laminated structure.

Abstract: Double-glazed window units made by electrically heating the margins of two glass sheets to form a continuous peripheral weld are disclosed wherein an electroconductive stripe is deposited on the margins of one of the glass sheets from an aqueous composition comprising colloidal graphite, a perfluoroalkyl surfactant and optionally a water-soluble thixotropic agent.

Abstract: Corrosion-resistant, hermetic glassceramic-to-metal seals are made in a single rapid heating step by inserting a glass preform made of 25-35% by weight ZnO, 2.5-10% by weight Al.sub.2 O.sub.3 and 30-60% SiO.sub.2 together with optional nucleating and/or fluxing agents, between a metal pin and surrounding metal collar. Heating is rapid in a single step to first fluidize the glass, while avoiding excessive oxidation of the metal pin and the metal collar and to prevent excessive interaction of the glass composition at the glass/collar interface, then to ceram the seal. The resulting seals exhibit good corrosion resistance to potassium hydroxide solutions and are useful in Ni-Cd batteries.

Abstract: The contacted edge portions of plate glasses to be joined are locally heated to a temperature higher than in the other portions of the plate glasses, after the whole of the plate glasses is heated. Electric current is then passed to the edge portions in order to further heat the edge portions so that the edges of the plate glasses are molten and welded together.

Abstract: As a first step to bend a glass along a line traversing the plate, external heat is applied to the glass plate such that a narrow zone containing the entire length of the bending line is heated more intensely than the remaining area to reach a temperature at which the glass does not yet soften but exhibits an appreciable lowering of its electrical resistivity. Then an electric current is caused to flow through the glass in the intensely heated zone from one terminal of the bending line to the other terminal, until the glass is softened only in this zone, i.e. along the bending line by the Joule effect of the current. In this state, desired manner of bending is achieved by the use of a suitably shaped bending die.

Abstract: The edge portion of a plate glass is locally heated to a temperature higher than that in the other portion of the plate glass, after the whole of the plate glass is heated. Electric current is thereafter applied to the edge portion of the plate glass in order to further heat the edge portion so that the edge of the plate glass is slightly melted.

Abstract: A process for welding two glass members together to form a weld bead through which connecting wires extend. The glass members are first brought into intimate contact with metal parts which can be heated by a high frequency current. The glass members are held close to one another with the wires disposed in the space between them, and the glass is then melted until it welds by heating the metal parts with the aid of high-frequency heating coil windings surrounding the metal parts.

Abstract: Marginal edge portions of a pair of glass sheets are welded together to make a multiple glazed unit by sequentially imposing a voltage on marginal edge portions of a sheet followed by alternately imposing a voltage on opposed corners of the sheet.

Abstract: Marginal edge portions of a pair of glass sheets are welded together to make a multiple glazed unit by sequentially imposing a voltage on marginal edge portions of a sheet during side heating cycles followed by alternately imposing a voltage on opposed corners of the sheet during diagonal heating cycles. During the last side heating cycle, the voltage applied to the next to last marginal edge heated is for a shorter time period than the time period in which the first marginal edge was heated. In this manner, the average resistance of the electrical paths during the first diagonal heating cycle is substantially equal.