Abstract: A system and a method of detecting a temperature of a battery, which calculate a resistance value of a temperature detecting unit based on a size of a voltage applied to the temperature detecting unit connected with a battery for measuring a temperature of the battery, and detect the temperature of the battery connected with the temperature detecting unit based on the calculated resistance value.

Abstract: Methods and systems are provided for estimating a temperature of a direct injector. In one example, a method may include estimating the temperature of the direct injector based on a resistance of a solenoid coil of the direct injector. In one example, a pulse-width of the direct injector during an opening phase is adjusted in response to the temperature.

Abstract: A control device comprises a catalyst warmup control part configured to supply electric power to a conductive base to warm up a catalyst device. The catalyst warmup control part is provided with a first estimating part configured to estimate a temperature of the conductive base based on an engine operating state, a second estimating part configured to estimate a temperature of the conductive base based on a resistance value of the conductive base detected when supplying current to the conductive base, and an electric power control part configured to control an amount of electric power supplied to the conductive base when warming up the catalyst device based on a result of comparison of magnitudes of a first estimated temperature of the conductive base estimated by the first estimating part and a second estimated temperature of the conductive base estimated by the second estimating part.

Abstract: A method for high-throughput assay processing includes (a) modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer, including a plurality of image sensors, by heating the image sensor wafer using a heating module thermally coupled with the image sensor wafer, to control reaction dynamics in the samples, and (b) capturing a plurality of fluorescence images of the samples, using the plurality of image sensors, to detect one or more components of the plurality of samples. A method for manufacturing a high-throughput fluorescence imaging system with sample heating capability includes (a) bonding a fluidic wafer, including a plurality of recesses, to an image sensor wafer including a plurality of image sensors, and (b) bonding a heating module, including a heater for generating heat, to the image sensor wafer to thermally couple the heater and the image sensor wafer.

Abstract: A semiconductor device including a power transistor is prevented from being broken. A cathode of a temperature sensing diode and a source of a power MOSFET are electrically coupled to each other so as to have the same potential. Such a characteristic point allows the temperature sensing diode to be disposed in a power MOSFET formation region without considering withstand voltage. This means that there is no need to provide an isolating structure that maintains a withstand voltage between the power MOSFET and the temperature sensing diode. Consequently, the power MOSFET and the temperature sensing diode can be closely disposed.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature each heater electrode by determining the resistance of each heater electrode.

Abstract: A measurement circuit is provided for measuring the resistance of a variable resistance element biased with an external voltage supply. The measurement circuit includes an analog-to-digital converter (ADC) and a reference generator connected with the ADC. The ADC is operative to receive a reference voltage and a first voltage developed across the variable resistance element, and to generate a digital output signal indicative of a relationship between the first voltage and the reference voltage. The reference generator is operative to generate the reference voltage as a function of the external voltage supply.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.

Abstract: The present disclosure provides apparatus and methods for monitoring and controlling filaments used in hotwire semiconductor processing and for monitoring integrity of filaments in a hotwire processing chamber. Embodiments of this disclosure may use real time voltage and current feedback signals provided by the power supply, known attributes, for example resistivity, of filament, filament geometries, for example diameter and length, and filament assembly configurations as input, to derive filament temperature in real time. Embodiments of the present disclosure are capable of continuously derive accurate temperatures of the filament assembly in a hotwire processing chamber after the filament assembly has changed geometries due to normal usage by using the measured cold resistance of the wire periodically before the process starts.

Abstract: An I/O circuit for measuring temperatures uses multiple cold-junction compensation sensors permanently affixed near the terminals of the terminal block in order to compensate significant temperature variation across the terminals of the I/O module (up to 3° C.) that can substantially affect the accuracy of thermocouple measurements. The use of these multiple sensors is enabled by a compensation system that corrects for the distance between the built-in sensors and the terminals, a multiplexer that accommodates the additional signal burden produced by the sensors, and a compensation system that allows low-cost sensors to be used and calibrated to as little as a single high accuracy sensor. In one embodiment, a third temperature sensor with relatively higher accuracy is used to compensate for lower accuracy of permanently affixed sensors.

Abstract: A control apparatus is disclosed for a diesel exhaust fluid injector located in an exhaust pipe of a diesel internal combustion engine. The control apparatus includes an electronic control unit configured to: energize a solenoid of the injector to perform a diesel exhaust fluid injection; determine an electric voltage value indicative of the electric voltage applied to the injector solenoid during the diesel exhaust fluid injection; determine an electric current value indicative of the electric current flowing through the injector solenoid during the diesel exhaust fluid injection; calculate an electric resistance value of the injector solenoid as a function of the determined electric voltage value and the electric current value; and estimate an injector temperature value as a function of the calculated electric resistance value.

Abstract: The invention relates to a method of determining internal temperatures (2) (coil and magnet temperatures) in a synchronous electric machine (4) using state observers for the resistance of the coils and the magnetic flux of the magnet. The invention also relates to a diagnostic method, a control method and system (3) for controlling a synchronous electric machine from the internal temperatures thus determined.

Abstract: An apparatus, system and method for temperature measurement of a target site, such a human body site. The invention includes an intelligent temperature probe configured to physically contact a target site and to communicate with a host device, which can be implemented as a hand-held device or as a personal computer. The host device can compute, store and display an accurate predicted temperature, or an actual temperature at thermal equilibrium, of the target site for each of a plurality of different intelligent temperature probes that each have unique and varied operating characteristics. A set of unique operating characteristics for each temperature probe is represented by information communicated between each respective temperature probe and the host device.

Abstract: The present invention is a method for capturing a cooling transfer function for a thermally-isolated, self-heating device. The method includes causing the device to undergo a plurality of successive heat-up cycles and cool-down cycles. The method further includes changing durations of time of the successive cool-down cycles. The method further includes deducing the cooling transfer function based upon temperature measurements for the device obtained at the end of the successive cool-down cycles (ex.—at the beginning of the successive heat-up cycles) of the device. The method thereby allows for capture of the cooling transfer function without direct observation of the cooling transfer function.

Abstract: Embodiments are directed to receiving, by a device, an identification of a coupling configuration associated with at least one sensor via a user interface, sensing, by the device, a sensed parameter associated with the at least one sensor, calculating, by the device, a translated parameter based on the sensed parameter, and mapping, by the device, the translated parameter to a temperature.

Abstract: In an apparatus, a temperature obtainer obtains, in a learning mode of the apparatus during a conductive carrier being deenergized a, value of a carrier temperature based on a physical parameter correlative with the carrier temperature and different from a carrier resistance. A resistance obtainer instantaneously energizes, in the learning mode, the conductive carrier to obtain a value of the carrier resistance during the instant energization. A calculator obtains, in a normal operation mode of the apparatus after the learning mode, a value of the carrier resistance, and calculates, in the normal operation mode, a value of the carrier temperature based on: the obtained value of the carrier resistance in the normal operation mode, and a pair of the value of the carrier temperature and the value of the carrier resistance obtained in the learning mode.

Abstract: A thermometer includes a first surface temperature measurement unit; a first reference temperature measurement unit; a second surface temperature measurement unit; a second reference temperature measurement unit; a temperature correction unit that calculates a mounting positional difference between the first and second surface temperature measurement units from a measurement subject and a mounting positional difference between the first and second reference temperature measurement units from the measurement subject in terms of temperature differences that compensate for temperature dependence, thus correcting the first surface temperature and first reference temperature, or the second surface temperature and second reference temperature; and a core temperature calculation unit that calculates a core temperature of the measurement subject using the first surface temperature and first reference temperature or the second surface temperature and second reference temperature corrected by the temperature correction

Abstract: Thermometric apparatus includes at least one body-surface sensor, which is configured to be placed at a location on a body surface of a patient and generates a sensor output that varies according to a body-surface temperature at the location. Analog conversion circuitry is coupled between the at least one body-surface sensor and a connector for coupling to a patient monitor. The circuitry is configured to convert the sensor output into an output resistance across the connector that is indicative of a corrected temperature of the patient.

Abstract: Systems and methods of estimating a fluid injector tip temperature. A controller having a processor and a memory supplies a current to a coil of a fluid injector, a resistance of the coil is measured when the current is supplied to the coil, a coil temperature is determined based on the measured resistance, and a tip temperature of a fluid injector tip is estimated based on the determined coil temperature.

Abstract: A preexisting voltage across a sensor is latched to a storage capacitor prior to any excitation current being applied to the sensor. Once the excitation current is applied, the voltage on the storage capacitor is directly subtracted from a differential voltage across the sensor. The subtraction is done before a measurement is converted to a digital value and passed to a transmitter. The subtraction is performed in hardware, and a time required to sample and hold the preexisting voltage across the storage capacitor is within a settling time used for collecting any sensor measurements.

Abstract: In one embodiment, a temperature sensing apparatus includes a temperature sensor disposed in a structure at a first depth from a first surface of the structure. A heat flux sensor is also disposed in the structure at substantially the same depth as the first depth. A measurement circuit is coupled to the temperature sensor and the heat flux sensor. The measurement circuit calculates a surface temperature of the first surface based on a temperature of the temperature sensor and a heat flow of the heat flux sensor.

Abstract: An integrated circuit chip is defined by a stack of several interconnected layers. The integrated circuit chip includes at least two layers of dissimilar metal patterned to define an array of integrated bimetallic thermocouples.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.

Abstract: An apparatus and method of determining the junction temperature (Tj) and drain-source current (Ids) of a standard FET within a multi-FET module includes a control IC managing one or more 3 terminal standard FETs within the same package, calculating Tj and Tds for one or more FETs in one or more packages, and protecting each FET against short circuit faults while allowing high current transients, such as inrush currents from a lamp load.

Abstract: Variations of the impedance of each output driver of a semiconductor device can be reduced, and high-speed calibration is achieved. A calibration circuit including a replica circuit having the same configuration as each pull-up circuit or pull-down circuit included in an output driver of a semiconductor device is provided within a chip. During a first calibration operation, the replica circuit is provided with voltage conditions that allow the maximum current to flow through the output driver so that an impedance of the replica circuit is equal to a value of an external resistor. During a second calibration operation, table parameters obtained in the first calibration operation are used to adjust the impedance of the output driver without use of the replica circuit.

Abstract: One embodiment provides a semiconductor chip including a semiconductor body and a power semiconductor component integrated therein. The power semiconductor component includes a load electrode zone arranged on a first surface of the semiconductor body, a control electrode zone arranged on the first surface, the control electrode zone being electrically insulated from the load electrode zone, and a resistance track arranged on the load electrode zone and the control electrode zone. The resistance track ensures an electrical connection between the load electrode zone and the control electrode zone.

Abstract: Different advantageous embodiments provide a monitoring system comprising one or more sensor systems and a processing unit. The one or more sensor systems is configured to monitor a subject for change in temperature and generate monitoring data. The processing unit is configured to analyze the monitoring data to generate a result.

Abstract: A method for evaluating the temperature of a contactor comprising a processing unit designed to act on control means of the voltage applied to an actuating coil. Measuring means measure an electric current flowing in said at least one actuating coil. The method consists in: sending a closing order consisting in applying a voltage to the terminals of the actuating coil enabling the electric current flowing in the coil to be modified up to a first reference value; sending a drop-out order consisting in fixing a voltage called drop-out voltage at the terminals of the actuating coil; measuring the electric current flowing in said actuating coil; performing acquisition of specific values on a signal of the electric current; analyzing specific values for evaluation of the operating temperature of the actuating coil.

Abstract: A process for testing an integrated circuit includes collecting a set of points of a physical property while the integrated circuit is executing a multiplication, dividing the set of points into a plurality subsets of lateral points, calculating an estimation of the value of the physical property for each subset, and applying to the subset of lateral points a step of horizontal transversal statistical processing by using the estimations of the value of the physical property, to verify a hypothesis about the variables manipulated by the integrated circuit.

Abstract: Systems for determining differential and average temperatures from resistive temperature devices are provided. In one embodiment, a device comprises a bridge network including a first node and second node, wherein the first node receives a constant current from a current source; a first branch coupled between a first node and a second node, the first branch including a first temperature sensing element of a first resistive temperature device; a second branch coupled in parallel with the first branch between the first node and the second node, the second branch including a second temperature sensing element of a second resistive temperature device; a first output that provides a signal representing a difference between a voltage developed across the first temperature sensing element and a voltage developed across the second temperature sensing element; and a second output that provides a signal representing a voltage developed across first node and the second node.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.

Abstract: The present invention relates to a fuel identification system and method normally applied to internal combustion engine vehicles of the flex-fuel type by means of which it is possible to identify the composition of the fuel used at each point in time, particularly the ratio used in a gasoline/ethanol blend or detect the presence of air or fuel in the vapor state in the fuel line, using the same device that heats the fuel.

Abstract: A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.

Abstract: A method is provided for estimating the temperature in an internal combustion engine. The method includes, but is not limited to the steps of providing a sensor resistor (RTD) in the internal combustion engine, the sensor resistor (RTD) having a predetermined resistance-temperature characteristic, measuring a sensor voltage (VRTD) across the sensor resistor (RTD), calculating a resistance value of the sensor resistor (RTD) based on the sensor voltage (VRTD) and estimating the temperature using the resistance value and the resistance-temperature characteristic. The method further comprises the steps of connecting, in series to the sensor resistor (RTD), a first branch of a current mirror arrangement, connecting a reference resistor (R0) in series to a second branch of the current mirror arrangement, measuring a reference voltage (V0) across the reference resistor (R0) and calculating the resistance value of the sensor resistor (RTD) based on the sensor voltage (VRTD) and the reference voltage (V0).

Abstract: An I/O circuit for measuring temperatures within an industrial control system uses a stored empirical model together with input from at least one reference temperature sensor to determine inter-terminal temperature differences for more accurate cold junction compensation.

Abstract: Aspects of the invention relate generally to diagnostic methods and systems for determining the operating condition and performance of a cooling element in a metallurgical reactor during operation of the reactor. In a system aspect, the system comprises sensing means, processing means and display means. The sensing means is located in or approximate the cooling element for sensing operating conditions of the cooling element. The processing means is in communication with the sensing means for receiving data corresponding to the sensed operating conditions and for processing the data to determine a relative condition indicator of the cooling element. The display means is in communication with the processing means and displays the relative condition indicator to a user of the diagnostic system. The display means can display a first, second or third state representative of the relative health indicator.

Abstract: A circuit and method for providing temperature data indicative of a temperature measured by a temperature sensor. The circuit is coupled to the temperature sensor and configured to identify for a coarse temperature range one of a plurality of fine temperature ranges corresponding to the temperature measured by the temperature sensor and generate temperature data that is provided on an asynchronous output data path.

Abstract: One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally coupled to the power semiconductor component and likewise integrated into the semiconductor body and arranged between the control connection and the load connection of the power semiconductor component. The resistance component has a temperature-dependent resistance characteristic curve. A driving and evaluation unit is designed to evaluate the current through the resistance component or the voltage drop across the resistance component and provides a temperature signal dependent thereon.

Abstract: A temperature measurement device is provided to measure an environment temperature and includes a thermistor, a resistor, a determination circuit, and a measurement circuit. The thermistor is coupled to a first node. The thermistor has a specific impedance value at a specific environment temperature point. The resistor has a first terminal coupled to the first node. The determination circuit determines a real impedance value of the resistor. The measurement circuit is coupled to the first node for receiving a measurement value signal generated at the first node and obtains a value of the specific environment temperature point according to the measurement value signal and the real impedance value of the resistor.

Abstract: A temperature measurement system is provided for a light emitting diode (LED) assembly that includes an LED having two semiconductors joined together at an LED junction. The system includes a temperature sensor operatively connected to the LED assembly at a remote location that is remote from the LED junction. The temperature sensor is configured to measure a temperature of the LED assembly at the remote location. A temperature calculation module is operatively connected to the temperature sensor for receiving the measured temperature at the remote location from the temperature sensor. The temperature calculation module is configured to determine a junction temperature at the LED junction based on the measured temperature a the remote location.

Abstract: An isotherm sensor tracks space vehicle temperatures by a thermal protection system (TPS) material during vehicle re-entry as a function of time, and surface recession through calibration, calculation, analysis and exposed surface modeling. Sensor design includes: two resistive conductors, wound around a tube, with a first end of each conductor connected to a constant current source, and second ends electrically insulated from each other by a selected material that becomes an electrically conductive char at higher temperatures to thereby complete an electrical circuit. The sensor conductors become shorter as ablation proceeds and reduced resistance in the completed electrical circuit (proportional to conductor length) is continually monitored, using measured end-to-end voltage change or current in the circuit. Thermocouple and/or piezoelectric measurements provide consistency checks on local temperatures.

Abstract: In an apparatus, a temperature obtainer obtains, in a learning mode of the apparatus during a conductive carrier being deenergized a, value of a carrier temperature based on a physical parameter correlative with the carrier temperature and different from a carrier resistance. A resistance obtainer instantaneously energizes, in the learning mode, the conductive carrier to obtain a value of the carrier resistance during the instant energization. A calculator obtains, in a normal operation mode of the apparatus after the learning mode, a value of the carrier resistance, and calculates, in the normal operation mode, a value of the carrier temperature based on: the obtained value of the carrier resistance in the normal operation mode, and a pair of the value of the carrier temperature and the value of the carrier resistance obtained in the learning mode.

Abstract: A method for determining a temperature and/or a temperature change at a neutral electrode having a contacting agent layer. The method comprises determining at least one impedance value of the contacting agent layer and calculating a temperature change and/or a temperature at the neutral electrode, at least on the basis of the impedance value. The contacting agent lavers may be made from hydrogel and the method uses a correlation that exists between the temperature change and the impedance change.

Abstract: An electronic thermometer is configured for ease and accuracy in construction. A probe of the thermometer includes a flex circuit containing electronic components used to measure temperature and transmit signals to a calculating unit of the thermometer. A resilient locator can function to pre-position the flex circuit prior to final fixation so that the electronic components are reliably positioned in manufacture.

Abstract: A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

Abstract: An apparatus and method of determining the junction temperature (Tj) and drain-source current (Ids) of a standard FET within a multi-FET module includes a control IC managing one or more 3 terminal standard FETs within the same package, calculating Tj and Tds for one or more FETs in one or more packages, and protecting each FET against short circuit faults while allowing high current transients, such as inrush currents from a lamp load.

Abstract: The electronic clinical thermometer includes a thermistor, a reference resistor, a voltage switch for selectively applying a voltage in order to accumulate electric charge in a capacitor via the thermistor or reference resistor, an A/D converter for detecting a voltage change occurring when removing the electric charge accumulated in the capacitor, and outputting an ON signal while the capacitor has a voltage equal to or higher than a predetermined voltage, a timer for measuring the duration of the ON signal, and an arithmetic processor for calculating the ambient temperature of the thermistor by using the discharge time when removing the electric charge accumulated in the capacitor via the thermistor, and the average value of the discharge times when removing the electric charge accumulated in the capacitor via the reference resistor immediately before and after removing the electric charge accumulated in the capacitor via the thermistor.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed heater electrodes, wherein the heater electrodes are part of a multiplex circuit including a common lead connecting the heater electrodes to a power supply, each of the heater electrodes being associated with one of the microfluidic channels. The microfluidic device also includes a control system configured to regulate power applied to each heater electrode by varying a duty cycle, the control system being further configured to determine the temperature of each heater electrode by determining the resistance of each heater electrode.