Abstract: An information processing apparatus provides control of power consumption of multiple central processors. The apparatus includes, sections for: measuring temperature of each central processor; calculating halt percentage for each of the central processors from measured temperatures halt percentages and a particular thread executed in each of the central processors; transitioning to a wait state in which a central processor executes another thread during a predetermined wait period or a running state in which an internal halt instruction is executed causing the central processor to halt processing in accordance with the halt percentage; and interrupting each of the central processors and causing a central processor that is halting processing to resume processing.

Abstract: Apparatuses, methods, and systems associated with and/or having components capable of, detecting a temperature of an integrated circuit in real time during testing are disclosed herein. In exemplary embodiments, an integrated circuit includes a register to store a temperature limit for the integrated circuit; a temperature sensor formed on the integrated circuit to sense a temperature of the integrated circuit, and output a signal indicative of the temperature sensed, based at least in part on the temperature sensed; and testing logic coupled to the register and the temperature sensor to record a temperature violation if at any time during a testing mode of operation the temperature sensed by the temperature sensor violates the stored temperature limit.

Abstract: An information handling system and method of operating an information handling system are disclosed. In one embodiment the method comprises operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.

Abstract: An on die thermal sensor (ODTS) for use in a semiconductor memory device includes: a temperature information code generation unit for sensing an internal temperature of the semiconductor memory device in response to first and second enable signals and for generating a temperature information code which includes the sensed temperature information; and a flag signal logic determination unit for generating a plurality of first flag signals having temperature information and determining whether the plurality of first flag signals have a predetermined logic level or a variable logic level in response to the first and second enable signals.

Abstract: A system and method to fully characterize the thermal behavior of complex 3D submicron electronic devices. The system replaces and/or supplements laser-based surface temperature scanning with a CCD camera-based approach. A CCD camera records multiple points of light energy reflected from an integrated circuit to obtain a static temperature measurement. The system is used to non-invasively measure with submicron resolution the 2D surface temperature field of an activated device. A CW laser illuminates a single point on the surface of an active device and a photodetector records the reflected light energy to obtain a transient temperature measurement. The measured 2D temperature field is used as input for an ultra-fast inverse computational solution to fully characterize the thermal behavior of the complex 3D device. The system extracts geometric features of a known device, assessing the system's ability to combine measured results and computations to fully characterize complex 3D electronic devices.

Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: Detecting, predicting, and diagnosing faults in a cooling system. According to one embodiment, a heat sink is in thermal contact with a heat-generating electronic component. When a temperature differential between the electronic component and the heat sink exceeds a set point, a fault signal is generated. The set point may be empirically or theoretically determined. The set point may be a static set point, or it may be a dynamic set point determined according to real-time operational parameters of the system. The system may be implemented with predictive failure analysis (PFA) to provide a more reliable, efficient, inexpensive, and robust computer system.

Abstract: A fan control apparatus and method to reduce the temperature in an equipment body by a time control when setting a stop period constant at the start by adding a time axis fan control by means of a temperature sensor. The fan control apparatus includes a temperature sensor that detects the temperature in the equipment body; a CPU and a sub-microcomputer perform the control of the cooling fans according to the detected temperature value. The CPU performs communication with a server connected to the equipment body via a network, and the CPU and sub-microcomputer perform the control of the cooling fans according to the time value based on a previous communication start and the present communication start.

Abstract: According to one embodiment, a first capacitive element may be provided and associated with a surface where a fouling layer is to be detected. A second capacitive element may also be provided, and a capacitance between the first and second capacitive elements may be used to detect formation of the fouling layer. According to another embodiment, a thermal device is provided proximate to a surface where a fouling layer is to be detected. A detector (e.g., a thermometer or vibration detector) may detect a condition associated with the surface, and formation of the fouling layer may be determined based at least in part on the condition.

Abstract: The present invention provides a fire sensing system comprising a step of recording positional data of a wireless chip in a memory included in the wireless chip, a step of obtaining temperature data from a temperature sensor included in the wireless chip to be recorded in the memory, a step of taking out the positional data and the temperature data from the memory, and a step of judging whether a fire occurs or not based on an individual identification number, the positional data, and the temperature data of the wireless chip.

Abstract: Methods and apparatuses to measure temperatures of integrated circuits are disclosed. New circuit arrangements for measuring temperature using various types of integrated circuit sensor elements are discussed. Embodiments comprise methods and apparatuses arranged to measure temperature based upon current leakage rates of different integrated circuit sensor elements. The methods and apparatuses generally involve using a pulse module to generate a charge for the integrated circuit elements. In these method and apparatus embodiments, one or more elements form a decay module to sense when the voltage decays to a threshold value. The method and apparatus embodiments may also have a module to calculate or infer a temperature from the rate of the voltage decay.

Abstract: Methods and apparatus are described for characterizing the temporal-spatial properties of a dynamic fluid front within a mold space while the mold space is being filled with fluid. A method includes providing a mold defining a mold space and having one or more openings into the mold space; heating a plurality of temperature sensors that extend into the mold space; injecting a fluid into the mold space through the openings, the fluid experiencing a dynamic fluid front while filling the mold space with the fluid; and characterizing temporal-spatial properties of the dynamic fluid front by monitoring a temperature of each of the plurality of heated temperature sensors while the mold space is being filled with the fluid.

Abstract: According to one embodiment of the invention a method for determining the location of a potential defect in a device includes scanning a surface of the device with a temperature sensor while operating the device. The method also includes measuring a temperature of the device by a temperature sensor at a plurality of locations while scanning. Based upon the measured temperatures, a temperature profile is constructed for the device. The method also includes comparing the constructed temperature profile to a reference profile to determine a location of the potential defect in the device.

Abstract: An exemplary resistance calculating method includes steps of: calculating a heat transfer rate of a conductor; and finding a resistance of the conductor as a reciprocal of the heat transfer rate of the conductor. The calculating method includes sub-steps of: simulating the conductor with a software which can calculates a heat transfer rate of the conductor according to a coefficient of heat conductivity of the conductor and a temperature difference of input and output terminals of the conductor; setting the coefficient of heat conductivity of the conductor with a reciprocal of a resistivity of a material of which the conductor comprises; setting the temperature difference of the input and output terminals with ?1 Celsius degrees; and calculating the heat transfer rate of the simulated conductor with the software.

Abstract: A method and corresponding software for automatically validating a computer platform thermal solution. An application program is employed to selectively execute thermal stress code to cause the platform's processor to dissipate an amount of power corresponding to a predetermined value, such as a thermal design power dissipation value specified by the processor's manufacturer. In one embodiment, tests are performed while operating at this power dissipation level to determine if a thermal overload condition exists, which may be determined by the processor's temperature, an indication that the processor is throttled, or a signal provided by the processor indicating the processor has detected a thermal overload condition. In another embodiment, a thermal resistance value is calculated based on the processor power dissipation, the temperature of the processor, and the ambient temperature of the test environment.

Abstract: The claimed invention is a method for determining a relationship between a metal temperature of a turbine component and an operating condition of a turbine housing the component. The claimed invention is also a method for determining consumed operating life for a turbine component. The invention further comprises a system for determining an amount of remaining useful life in a turbine component. The invention further comprises a method for determining a relationship between a stress state of a turbine component and an operating condition of a turbine housing the component.

Abstract: A device to control memory bandwidth including a processing unit and a memory connected to the processing unit, the memory having a memory controller driver to issue at least one command based on a memory bandwidth requirement of another driver process. A memory controller to direct data to and from the memory. An active cooling device is connected to the processing unit and a thermal sensor.

Abstract: A method of modeling a heat exchanger is disclosed and comprises assigning input temperatures, assumed output temperatures, and a set of flow rates, inputting the parameters into a set of equations arranged to calculate a heat transfer coefficient, inputting parameters into a second set of equations arranged to calculate output temperatures, substituting actual output temperatures for the assumed output temperatures, and again calculating the heat transfer cooefficient. The new heat transfer coefficient is then used to obtain revised actual output temperatures, and the initial actual output temperatures and the revised actual output temperatures are compared to determine whether they differ by less than a desired variance. If not, a new iteration is performed until the output temperatures converge.

Abstract: An apparatus (10) tests different products (15). The apparatus (10) includes an environmental chamber (20) for providing thermal shock to the products (15), a conveyor (40) for transporting the products (15) through the environmental chamber (20), a fixture (100) movable with the products (15) through the environmental chamber (15), and an interface (300) removably mounted on the fixture (100). The fixture (100) has a means (60, 80) for electric stimulation and monitoring of the products (15) during transport of the products (15) through the environmental chamber (20). The interface (300) is constructed to test one of the different products. The interface (300) provides a mechanical and electrical connection between the fixture (100) and the product being tested. The interface (300) is tailored for stimulating and monitoring the product being tested.

Abstract: A method, apparatus and computer instructions are provided to autonomically monitor and adjust system characteristics based on a customer optimization goal specified in a policy or profile. An autonomic management component is implemented in firmware comprising a set of control algorithms. Response to reading system characteristics from a plurality of sensors, the autononmic management component selects at least one control algorithm from the set and the control algorithm adjusts the parameters of the system characteristic to optimize performance according to the optimization goal specified by the customer.

Abstract: A method, apparatus and computer program product are provided for implementing thermal integrity screening. Predefined processor module temperature data are obtained and processed. An initial thermal calibration is performed to record a predefined processor resistance with no power applied to the processor module. A limit check is performed at power up to detect and compare a thermal bond operating temperature with an identified threshold temperature for the processor module. Responsive to an identified thermal bond operating temperature greater than the identified threshold temperature, the processor module is shutdown and the processor module failed.

Abstract: A method for estimating the thermal properties of surface materials using long-wavelength thermal imagery by exploiting the differential heating histories of ground points in the vicinity of shadows. The use of differential heating histories of different ground points of the same surface material allows the use of a single image acquisition step to provide the necessary variation in measured parameters for calculation of the thermal properties of surface materials.

Abstract: A temperature sensing circuit, and method of using the same. A temperature sensing circuit includes a comparator, a temperature reference circuit and trimmer. The comparator is configured to receive a sense voltage that is indicative of a sensed temperature. The temperature reference circuit has a plurality of reference voltages coupled to the comparator such that the plurality of reference voltages are alternately compared to the sense voltage. The trimmer is coupled to the temperature reference circuit and is independently adjustable to adjust the plurality of reference voltages.

Abstract: A water heater performance monitoring device for monitoring whether a water heater is functioning optimally or whether it requires service. The device uses maximum heating rates taken from a plurality of measured heating rates to determine if the performance of the water heater has degraded from a threshold performance level. A water heater performance monitoring device can reduce the number of false alarms that occur regarding the need for water heater service by filtering out temporary factors, lasting less than a time cycle, which affect heating rate of water in the water heater. This can save users time and money by reducing unnecessary water heater inspections.

Abstract: A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.

Abstract: Subscriber line interface circuitry includes an integrated circuit having sense inputs for a sensed tip signal and a sensed ring signal of a subscriber loop. The integrated circuit generates a subscriber loop linefeed driver control signal in response to the sensed signals. The linefeed driver does not reside with the integrated circuit. A method for monitoring power dissipation of the linefeed driver components includes the step of sampling at least one of the tip and ring signals to determine a line voltage and a line current of a selected linefeed driver component. Instantaneous power dissipation of the linefeed component is estimated and then filtered to generate an estimated junction temperature of the linefeed component. In one embodiment, the linefeed driver includes a tip fuse series-coupled to the tip line and a ring fuse series-coupled to the ring line.

Abstract: The method measures the temperature, emissivity, and other properties of relatively smooth surfaces radiating thermal energy, and is especially adapted for monitoring semiconductor fabrication processes. Temperature is determined by relating measured radiance to the predictions of the Planck radiation law, using knowledge of the emissivity determined from an analysis of the polarization of the thermally emitted radiance. Additional information regarding the properties of thin films, such as thickness and composition, can be computed from the emissivity or the ratio of the emissivities measured at two independent polarizations. Because the data are obtained from the intrinsic thermal radiance, rather than from an extrinsic light source, the measurement can be performed when it is inconvenient or impossible to provide a light source for reflectance measurements.

Abstract: A method of creating a sanitation level model with respect to a predefined microorganism in food processing equipment is provided. The method includes generally three steps. First, a temperature history during a use cycle of the food processing equipment is created. The temperature history includes a collection of a plurality of temperatures that the food processing equipment undergoes during the use cycle. The use cycle includes a normal use stage, a sanitizing stage, and perhaps an idle stage. Second, a growth model of the microorganism is continuously applied to each applicable temperature in the temperature history. Third, a death model of the microorganism is continuously applied to each applicable temperature in the temperature history. The created sanitation level model is used to ascertain the microorganism growth/death rate in the food processing equipment during the use cycle.

Abstract: An apparatus for predicting a deformation of a board includes a board dividing unit that divides the board into a plurality of areas based on wiring information on the board; and a deformation predicting unit that grasps a wiring pattern of an area macroscopically, calculates an equivalent physical property value equivalent to a modulus of longitudinal elasticity and a coefficient of thermal expansion by a finite element method, and predicts the deformation of the board based on the equivalent physical property value calculated for each of the areas divided by the board dividing unit.

Abstract: A pagewidth printhead assembly that includes a support beam assembly having a composite shell of metals selected so that the shell has a coefficient of thermal expansion substantially the same as that of silicon and a core located within the shell and defining a number of longitudinally extending ink reservoirs for containing respective inks. At least one printhead is mounted on the support beam assembly to receive inks from the ink reservoirs the, or each, printhead including a silicon-based printhead integrated circuit.

Abstract: Analytical solutions to error bounds on the temperature depth distribution have been given in this invention. Solving the one dimensional steady state heat conduction equation for different sets of boundary conditions and radiogenic heat generation and incorporating Gaussian randomness in the thermal conductivity analytical closed form solutions to the mean and variance in the temperature depth distribution have been obtained. These closed form analytical solutions of mean and variance for the temperature field for different conditions have been used to compute and display the plot and results of the temperature depth profiles along with its error bounds. Quantifying the error statistics in the system output due to errors in the system input is very essential for a better evaluation of the system behavior. Earth Scientists involved in understanding the subsurface thermal structure relevant to geodynamical studies will benefit using these findings.

Abstract: An on-chip temperature sensor for a semiconductor device. A temperature sensing mechanism includes a first current generator producing a first current that is proportional to absolute temperature of the semiconductor device. A second current generator produces a second current that is inversely proportional to absolute temperature of the semiconductor device. A current mode amplifier is coupled to amplifying the difference between the first current and the second current to produce a temperature signal.

Abstract: A method for performing an electromigration check and detecting EM problems in a device or circuit. The method uses the capacitance and resistance of the conductors of the device or circuit as parameters in determining a power limit that maintains a required temperature environment that ensures the reliability of the device or circuit. The power limit is then used to check each device interconnect to identify the location of potential EM problems. Corrective action is taken to avoid EM problems as they are detected in the device or circuit.

Abstract: A method and apparatus for condition diagnosing of a tap changer immersed in a cooling fluid, controlling and regulating an inductive power device, such as a transformer or reactor. The diagnosing method compares and evaluates expected heat exchanges between the tap changer and ambient air and the inductive power device, an expected amount of heat generated by the tap changer during operation, together with an actual temperature of the fluid. From the actual temperature, expected heat exchanges and expected generated heat, the heat balance in the system may be obtained and is used for disgnosing the operation conditions of the tap changer. The results from the condition diagnosing may be used as indicators that can alarm operators or may be sent as a data signal to remote and/or portable display means, such as a computer.

Abstract: The invention relates to a method and to a device for system- and/or process-monitoring in connection with a measurement apparatus that determines/monitors at least one process parameter of a medium. The method and device enable statements to be made regarding the present and future functionality of a measurement apparatus, or individual components of the measurement apparatus. The temperature values (T) of the medium are ascertained directly or indirectly and a trend analysis regarding the thermal loading of the measurement apparatus or the thermal loading of individual components of the measurement apparatus is carried out on the basis of the ascertained temperature values (T) of the medium or on the basis of the derivatives of the ascertained temperature values of the medium.

Abstract: In some embodiments of the present invention, a method and system are provided in a multiple resource environment for relieving a thermal condition by applying cooling techniques or throttling to lower priority threads.

Abstract: A method of infrared thermography is described. The invention utilizes a high resolution infrared thermography system and associated computer in conjunction with a test chamber to determine heat transfer coefficients and film effectiveness values from a single test.

Abstract: The present invention relates to a device for detecting the thermal conductivity by application of optical pulse techniques. A sample preheated in a furnace is exposed to energy by means of an optical pulse. The temperature profile in the sample is recorded by means of an infrared sensor. The thermal conductivity of the sample can then be detected by mathematical derivation. To reduce tho influence of the time history of the optical pulse on measurement, a measuring means is provided for determining this history, An analyzer unit then derives therefrom the corrected temperature profile.

Abstract: A method of measuring temperature of a component capable of emitting thermal radiation and reflecting background radiation having the steps of: providing a pyrometer for measuring the radiation from the component, characterised by coating a part of the component with a first emissivity coating and a part of the component with a different and second emissivity coating, each with known emissivities EH and EL respectively, recording a first radiation measurement from the first emissivity coating RH and a second radiation measurement from the second emissivity coating RL, then calculating the true radiation RBlade from the component from the equation R Blade = ( R H E H - R L E H ? ( 1 - E H 1 - E L ) ) ( 1 - E L E H ? ( 1 - E H 1 - E L ) ) and relate the RBlade value to the true component temperature by calibration of the pyrometer.

Abstract: An apparatus for measuring the water content of a water-containing liquid mixture contained in a tight chemistry tank includes a heating device for controlling the temperature of the liquid mixture to a temperature near the boiling point of the liquid mixture, a cooling medium system disposed at the top of the tight chemistry tank having a cooling medium inlet and a cooling medium outlet, a temperature measurement system for determining the temperature difference between the cooling medium inlet and outlet, and a computing device for calculating the water content of the liquid mixture from the temperature difference. Also provided is a tank for supplying water to the liquid mixture, and a control system for adjusting the amount of water supplied from the tank based upon the water content measured by the measuring apparatus. Also provided is a method for measure the water content.

Abstract: A method and apparatus for adjusting clock skew involves sensing a temperature at a location on an integrated circuit. A temperature sensor indicates a temperature value of the location on the integrated circuit. The temperature value is monitored, and a tunable buffer is adjusted dependent on the monitoring. The tunable buffer is used to adjust clock skew.

Abstract: A thermal characterization chip comprising a substrate having overlying electronics, the electronics including semiconductor circuitry and thin film circuitry overlying the semiconductor circuitry; wherein the electronics define a plurality of thermal domains, each of the domains defining a portion of a receiving surface for receiving an external influence that alters a thermal parameter within the thermal domains; and wherein the electronics further comprises monitoring circuitry for monitoring the thermal parameter in each of the thermal domains over a test time period.

Abstract: Methods and systems are provided for thermal self-monitoring of integrated circuits. Temperature is sensed, digitized, encoded, and compared to one or more threshold values by circuits added within an integrated circuit. A signal produced by a thermal diode within an integrated circuit is applied to an analog to digital converter and may be compared to one or more threshold values to produce a digital over temperature condition signal. An appropriate cooling action may be initiated by processing of the digital signal so produced. Also provided are methods and systems to alter the range and resolution of the temperature threshold comparisons.

Abstract: A flash memory device includes a charge pump having a capacity that is preset to a particular value. The flash memory device includes a measuring circuit to measure the actual capacity of the charge pump and to reset the capacity of the charge pump to a value based on the measured capacity.

Abstract: Disclosed is an apparatus incorporating hardware based logic and a predetermined default list of software affecting responses to be taken in connection with temperatures sensed by thermal sensors checking the temperature of portions of computer logic. At the time application software is loaded, the software can modify the default response list. The list of responses to be taken and the over temperature conditions at which they are to be activated are stored in hardware directly accessible by hardware based thermal sensor monitoring logic for direct control of the hardware. The control can alter conditions such as clock frequency, stopping use of application software, interrupting OS functionality, removing power from components and so forth.

Abstract: In some embodiments of the present invention, a method and system are provided in a multiple resource environment for relieving a thermal condition by applying cooling techniques or throttling to lower priority threads.

Abstract: According to the present invention, there is provided a secondary battery control circuit which can perform a reliable charge/discharge control without activating Positive Temperature Coefficient element. The secondary battery control circuit includes a temperature detection section for detecting a temperature of the secondary battery and a system logic for controlling charging/discharging of the secondary battery based on the temperature detected by the temperature detection section. The system logic interrupts the charging of the secondary battery in a case where the temperature detected by the temperature detection section is out of a predetermined first temperature range, and interrupts the discharging of the secondary battery in a case where the temperature detected by the temperature detection section is out of a predetermined second temperature range.

Abstract: Presented are methods, systems, and apparatus for deriving heat flux information and using heat flux information for a workpiece used in temperature sensitive processes.

Abstract: A method for generating thermal network data for use in thermal analysis of a coupling structure of a large number of components. Depending on the density of nodes having a position defined by the structure, two-dimensional quadtree area division or three-dimensional octtree area division is performed. A node is provided in the center of the divided area and anode is determined using approximation to a node having a position defined by the structure. Alternatively, an area and a node are determined using Voronoi area division in case of area subdivision where a small area is assigned only to a defined node. Thermal network data is generated by inserting thermal resistances between respective nodes.

Abstract: A fault determining apparatus for a variable valve timing mechanism is provided for shortly and accurately determining a fault even at low oil temperatures. The mechanism is driven by an oil pressure to change a cam phase of an intake cam and/or an exhaust cam with respect to a crank shaft of an internal combustion engine, thereby controlling the actual cam phase to reach a target cam phase. The apparatus has a fault determining routine executed by an ECU (electric control unit) for determining that the mechanism is faulty when a cam phase difference between the target cam phase and the actual cam phase is not within a predetermined range, an oil temperature sensor for detecting the temperature of the working oil, and a correcting routine executed by the ECU for correcting the predetermined range in an increasing direction when the detected oil temperature is low.