With Protective Separator Patents (Class 73/706)
  • Patent number: 10788388
    Abstract: Provided is a pressure sensor that uses a sensor chip as a pressure measurement element and can suppress condensation around the sensor chip of water vapor permeating a protective member from a gas to be measured. The pressure sensor includes a pressure measurement chamber into which a gas to be measured is introduced; a sensor chip that faces the pressure measurement chamber; a sensor support that has a support surface supporting the sensor chip; and a protective member that covers the sensor chip. The pressure sensor also includes a heat insulation chamber that faces a back surface opposite to the support surface of the sensor support; and a gas passage that communicates the heat insulation chamber and the pressure measurement chamber.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 29, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Masahiko Soshino
  • Patent number: 10775252
    Abstract: A medical liquid-pressure-detecting device capable of detecting both the negative and positive pressure of liquid, whereby the misconnection of the device to a liquid flow route can be prevented.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: September 15, 2020
    Assignee: Nikkiso Company Limited
    Inventors: Shigeaki Funamura, Hiroaki Mochizuki
  • Patent number: 10737077
    Abstract: A method of limiting an inflation system pressure for dilating a region of a patient's nasal sinus passageways. The method includes grasping an inflation device. The inflation device includes a syringe including a plunger slidably disposed within a barrel, a connector for fluidly connecting an outlet of the syringe with a surgical instrument balloon, and a mechanical pressure indicator associated with the syringe, the mechanical pressure indicator including a housing and an indicator body disposed within the housing. The method also includes delivering the surgical instrument balloon to a patient's paranasal sinus target area, operating the plunger within the barrel of the syringe to deliver pressurized fluid to the surgical instrument balloon, and transitioning the indicator body to extend outside of the housing when a predetermined inflation pressure of the surgical instrument balloon is reached.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: August 11, 2020
    Assignee: Medtronix Xomed, Inc.
    Inventors: Wenjeng Li, David J. Little
  • Patent number: 10739221
    Abstract: A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: August 11, 2020
    Assignee: Apple Inc.
    Inventors: Ashwin Balasubramanian, William Scott Lee
  • Patent number: 10656039
    Abstract: An apparatus includes a sensor body, a sensor configured to measure differential pressure, and first and second pressure inputs in or on the sensor body. The pressure inputs are configured to provide multiple input pressures to the sensor. Each pressure input includes a barrier diaphragm configured to move in response to pressure and an overload diaphragm configured to limit movement of the barrier diaphragm. The overload diaphragm is also configured to exert a preload force against the sensor body. The overload diaphragm of each pressure input may include multiple convolutions. Bases of the convolutions may be configured to provide the preload force, and tops of the convolutions may be separated from the sensor body by gaps. Tops of the convolutions that are non-adjacent may be configured to provide the preload force, and tops of the convolutions between the non-adjacent convolutions may be separated from the sensor body by gaps.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 19, 2020
    Assignee: Honeywell International Inc.
    Inventors: George Hershey, Richard D. Daugert
  • Patent number: 10627302
    Abstract: A differential pressure sensor module includes a base having a pair of process fluid pressure inlets and defining a sensor chamber having a sensor chamber inlet. A differential pressure sensor is disposed within the sensor chamber and has an inlet configured to receive a first pressure and provide a signal indicative of a difference between the first pressure and a sensor chamber pressure external to the differential pressure sensor within the sensor chamber. A pair of isolation diaphragms are provided in substantially the same plane, with each isolation diaphragm sealing a respective process fluid pressure inlet. A first fluid passageway is operably coupled to one of the isolation diaphragms and the inlet of the differential pressure sensor. A second fluid passageway is operably coupled to the other of the isolation diaphragms and to the sensor chamber inlet. An overpressure protection feature is operably coupled to the sensor chamber, the first fluid passageway and the second fluid passageway.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: April 21, 2020
    Assignee: Rosemount Inc.
    Inventors: David M. Strei, Mark G. Romo
  • Patent number: 10591377
    Abstract: A pressure transfer module for transfer of pressures less equals 100 mbar, and suitable for high temperature applications, comprising an isolating diaphragm outwardly sealing a first pressure chamber; a transfer diaphragm outwardly sealing a second pressure chamber; and a pressure transfer path connecting the first pressure chamber with the second pressure chamber. The first and the second pressure chambers and the pressure transfer path are filled with a pressure transfer liquid, via which a pressure acting externally on the isolating diaphragm is transmitted to the transfer diaphragm. The pressure transfer liquid is under a pre-pressure, especially a pre-pressure of greater than or equal to 30 mbar, especially greater than or equal to 50 mbar.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: March 17, 2020
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Dieter Funken, Igor Getman, Sergej Lopatin
  • Patent number: 10571352
    Abstract: The present disclosure discloses a relievable safety press gauge. The relievable safety press gauge comprises a fixed mount comprising a rotation body and a crimped edge provided at an edge of lower end of the body, a base provided at a bottom of the fixed mount, and an edge of upper end of the base wrapped and fixed by the crimped edge, and a membrane, an edge of which is located between an edge of lower end of the body and the edge of upper end of the base; further comprising an O-ring made of rubber or silicone provided between an edge of the membrane and the edge of upper end of the base, and the crimped edge is provided with a hollow-out pressure release gap, a first release clearance is provided between the edge of upper end of the base and the edge of the membrane, while a second release clearance is provided between the edge of upper end of the base and the crimped edge.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: February 25, 2020
    Assignee: Zhejiang Fumao Machinery Co., Ltd.
    Inventor: Changqing Huang
  • Patent number: 10533669
    Abstract: Methods, systems, and devices are provided for controlling fluid flow in a pressure sensing system. A bi-directional valve can include a first capillary that can couple to a process fluid in a process fluid channel, and a second capillary that can couple to a pressure sensor. The first and second capillaries can include an interface therebetween for controlling fluid flow between the first and second capillaries. The interface region can be configured to allow fluid flow between the first and second capillaries when a magnitude of a pressure difference between the first capillary and the second capillary is less than or equal to a threshold pressure. The interface region can also be configured to prevent fluid flow between the first capillary and the second capillary when the magnitude of the pressure difference between the first capillary and the second capillary exceeds than the threshold pressure.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 14, 2020
    Assignee: Baker Hughes, a GE Company, LLC
    Inventors: Bjørn Erik Seeberg, Paal Martin Vagle
  • Patent number: 10515783
    Abstract: A charge volume configuration for use in delivery of gas to a reactor for processing semiconductor wafers is provided. A charge volume includes a chamber that extends between a proximal end and a distal end. A base connected to the proximal end of the chamber, and the base includes an inlet port and an outlet port. A tube is disposed within the chamber. The tube has a tube diameter that is less than a chamber diameter. The tube has a connection end coupled to the inlet port at the proximal end of the chamber and an output end disposed at the distal end of the chamber.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: December 24, 2019
    Assignee: Lam Research Corporation
    Inventor: Karl Leeser
  • Patent number: 10458328
    Abstract: A combustion pressure sensor has a case member with a joint surface on the side of a tip end and in which an opening portion is provided. A joint surface of a pressure reception member on which a combustion pressure acts is brought into planar contact with the joint surface of the case member so as to block the opening portion. A welding portion joins the joint surfaces to each other. A piezoelectric element stored in the case member converts a pressing force based on the combustion pressure transmitted from the pressure reception member into a signal. On the side of one edge side in at least the one joint surface, the one joint surface is limited to a given depth of welding from the other edge side. A predetermined clearance portion is provided so as to form a predetermined gap with the opposite joint surface and a welding portion is provided which includes at least all the limited joint surface from the other edge side in the one joint surface.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: October 29, 2019
    Assignees: CITIZEN FINEDEVICE CO., LTD., CITIZEN WATCH CO., LTD.
    Inventors: Kazuo Takahashi, Yoshihiko Soga
  • Patent number: 10378984
    Abstract: A process pressure transmitter system includes a process pressure transmitter housing and a process pressure sensor in the process pressure transmitter housing. A metal flange is configured to mount to a process vessel which carries a process fluid. An isolation diaphragm attaches to the metal flange and is exposed to the process fluid through an opening in the process vessel. The isolation diaphragm comprises a polymer diaphragm bonded to a metal face of the metal flange. A capillary passageway carries a fill fluid from the isolation diaphragm to thereby convey a process pressure to the pressure sensor.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: August 13, 2019
    Assignee: ROSEMOUNT INC.
    Inventor: Baogang Li
  • Patent number: 10378987
    Abstract: An apparatus includes a sensor body and a sensor configured to measure pressure. The apparatus also includes at least one pressure input in or on the sensor body, where the at least one pressure input is configured to provide at least one input pressure to the sensor. The apparatus further includes multiple fluid passages configured to convey the at least one input pressure from the at least one pressure input to the sensor using a fill fluid. The multiple fluid passages are configured to both (i) transport the fill fluid and (ii) absorb thermal energy in a flame created by the sensor before the flame exits the sensor body. The fluid passages can include long and narrow straight passages, long and narrow curved or helical passages, and turns or bends. The fluid passages can have small cross-sections relative to their lengths.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: August 13, 2019
    Assignee: Honeywell International Inc.
    Inventors: George Hershey, Richard D. Daugert, Ronald E. Beselt
  • Patent number: 10345178
    Abstract: An apparatus includes a header containing a sensor configured to measure pressure and a sensor body connected to the header, where the sensor body and the header form a pressure vessel configured to receive an input pressure. The header is connected to the sensor body such that the input pressure received on an inner surface of the header is substantially equal to the input pressure received on an outer surface of the header. A lowest connection point of the header to the sensor body may be located at or above a highest point at which the input pressure extends into the header. A lower portion of the header may be unconnected to the sensor body and extend into an interior volume of the sensor body. The header may include a vent configured to expose the sensor to atmospheric pressure or a lower-pressure input pressure.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: July 9, 2019
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: George Hershey, Richard D. Daugert
  • Patent number: 10330552
    Abstract: In aspects of the invention, a sensor unit is stored in a recessed sensor mount portion formed in a resin case. The sensor unit can be formed so that a semiconductor pressure sensor chip is joined to one side of a glass pedestal, and the other side of the glass pedestal is die-bonded to the bottom of the sensor mount portion through an adhesive. An electrode pad on the semiconductor pressure sensor chip is electrically connected through a bonding wire to a lead terminal for leading externally that pierces through the resin case and is integrally insert-molded therein. An entire surface of the sensor unit, an exposed part of the lead terminal internally-located in the resin case, the bonding wire, and an exposed part of an inner wall of the resin case can be coated with the protective film composed of a poly(p-xylylene)-family polymer including fluorine.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: June 25, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Katsuyuki Uematsu
  • Patent number: 10281352
    Abstract: A diaphragm seal for transmitting media pressure, comprising: a diaphragm-carrier body having a media-side surface and a separating diaphragm, which is connected to the diaphragm-carrier body in a pressure-tight manner along at least one periphery. A pressure chamber is formed between the separating diaphragm and the diaphragm-carrier body, and a temperature-isolation body having a channel, which can be filled with a transmission fluid, in order for the pressure chamber of the diaphragm-carrier body attached to a first front side to be connected to a pressure transducer which can be connected to a second front side, so that media pressure prevailing at the separating diaphragm can be transmitted to the pressure transducer.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: May 7, 2019
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventors: Raimund Becher, Dietmar Salg
  • Patent number: 10281350
    Abstract: A pressure sensor includes a bearing region and a frame which is spatially separated from the bearing region, wherein a sensing element of the pressure sensor is produced on the bearing region. When the aforementioned pressure sensor is mounted on a package substrate, the stress from the package substrate or a circuit board can be isolated by a space between the bearing region and the frame to avoid unexpected deformation on the sensing element.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: May 7, 2019
    Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD.
    Inventor: Li-Tien Tseng
  • Patent number: 10254187
    Abstract: A waterproof pressure sensor includes a pressure detection element, a cavity package configured to be provided with a recess in which the pressure detection element is mounted and an edge provided around the recess, a frame configured to be attached to the edge of the cavity package and has a surface more smoothed than the edge and an opening, a contact prevention member configured to be attached to the frame, and a pressure introducing hole having a diameter smaller than a diameter of the opening at a position overlapping the opening, and a gel agent configured to be provided in the recess and the opening, in which the gel agent is provided to be separated from an edge of the pressure introducing hole on the frame side.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 9, 2019
    Assignee: ALPS ALPINE CO., LTD.
    Inventors: Hisanobu Okawa, Eiji Umetsu, Hideki Kamimura
  • Patent number: 10247632
    Abstract: A pressure sensor can include a housing having a sense side cavity formed on a first side of the housing; a sense side diaphragm attached to the first side and over the sense side cavity, a sense die assembly placed in the cavity and attached to the housing; a reference side cavity formed in the housing, a reference side diaphragm attached to a second side of the housing and over the reference side cavity, and pin(s) electrically connected to the sense die assembly and extending outside the housing from the second side. The cavities are filled with oil. Manufacturing the pressure sensor can include mounting the sense die assembly onto the housing, attaching the sense side diaphragm to the first side of the housing, filling the cavities with oil, and attaching the reference side diaphragm on the second side of the housing and over the reference side cavity.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: April 2, 2019
    Assignee: Honeywell International
    Inventors: Ryan Jones, Alistair David Bradley, Todd Eckhardt
  • Patent number: 10222286
    Abstract: To improve connectivity with tubes to be connected to an inlet and an outlet of a flow passage, while increasing the rapidity of an operation of changing a fluid to be passed through the flow passage and also increasing the safety. Provided is a pressure detecting device including a pressure detecting unit detecting a pressure transmitted to a diaphragm, a flow passage unit having a diaphragm for transmitting a pressure of a fluid flowing through the flow passage to the diaphragm, and a nut for removably mounting the flow passage unit onto the pressure detecting unit. The nut mounts the flow passage unit onto the pressure detecting unit when a position of a positioning groove of the pressure detecting unit about an axis coincides with a position of a positioning projection of the flow passage unit about an axis.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: March 5, 2019
    Assignee: SURPASS INDUSTRY CO., LTD.
    Inventors: Takashi Imai, Masahiro Hasunuma, Masamichi Kobayashi
  • Patent number: 10156491
    Abstract: A pressure sensor module for a process pressure transmitter is provided. The pressure sensor module includes a first member formed of a metal suitable for exposure to seawater. The first member has a passageway extending therethrough. An isolation diaphragm is coupled to the first member and has a first side configured to contact a process fluid and an opposite side in fluidic communication with the passageway of the first member. A second member is formed of a different metal than the first member and is mechanically coupled to the first member to define a chamber that is fluidically coupled to the passageway. A pressure sensor is disposed to sense a pressure within the chamber. A seal is coupled to the first and second members to seal an interface between the first and second members.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: December 18, 2018
    Assignee: Rosemount Inc.
    Inventor: Aleksandr Vladimirovich Fetisov
  • Patent number: 10105732
    Abstract: A coater includes a chuck, a source of a coating material, a dispensing head, an exhaust system, and a liner. The chuck is configured to support a wafer. The dispensing head is configured to dispense the coating material onto the wafer. The exhaust system is configured to exhaust the excess coating material. The liner is present at least partially on an inner surface of the exhaust system. The liner has a stick resistance to the coating material, and the stick resistance of the liner is greater than a stick resistance of the inner surface of the exhaust system.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: October 23, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hsiang Hung, Teng-Yi Huang, Fu-Jen Tien, Li-Jen Wu, Cheng-Ming Wu, Teng-Hwee Ng, Ming-Yang Chuang
  • Patent number: 10101229
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adaptor and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: October 16, 2018
    Assignee: Kulito Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 10068817
    Abstract: A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: September 4, 2018
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventors: Paul Bovaird, Stefano D'Agostino, Vikas Manan
  • Patent number: 10048152
    Abstract: A process fluid pressure transmitter is provided. The process fluid pressure transmitter includes a pressure sensor having an electrical characteristic that changes in response to a deformation of the pressure sensor in response to pressure. Measurement circuitry is coupled to the pressure sensor and is configured to provide an indication of the electrical characteristic. An isolation diaphragm is configured to contact the process fluid and deform in response to process fluid pressure. A substantially incompressible fill fluid fluidically couples the isolation diaphragm to the pressure sensor. An overpressure compliant structure is coupled to the fill fluid and is configured to be substantially rigid at pressures below a selected threshold, but to deform in response to pressure above the selected threshold.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: August 14, 2018
    Assignee: Rosemount Inc.
    Inventors: Aleksandr Valdimirovich Fetisov, Pavel Aleksandrovich Petukhov, Galina Vladimirovna Cherkashina, Charles R. Willcox
  • Patent number: 10036676
    Abstract: A force sensor may comprise a sensing die comprising a cap and a support. Generally, a first surface of the support may comprise a buried cavity and one or more channels. The one or more channels may extend from the buried cavity towards the outer edges of the support and may ensure the force sensor is not sensitive to ambient or atmospheric pressure variation. The cap may be bonded to the first surface of the support, thereby forming a sensing diaphragm located above the buried cavity. Additionally, the force sensor may comprise an actuation element to sense a change in force from an external media. The actuation element may transmit the force to the sensing diaphragm causing it to deflect into the buried cavity. The one or more sense elements on the sensing diaphragm may provide an indication of the change in force based on the amount of deflection.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: July 31, 2018
    Inventors: Alistair David Bradley, Richard Alan Davis, Richard Wade
  • Patent number: 10018527
    Abstract: A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: July 10, 2018
    Assignee: ALPS ELECTRIC CO., LTD.
    Inventors: Hisanobu Okawa, Kazushige Sejimo, Chiaki Kera, Shigeaki Yamauchi
  • Patent number: 10018526
    Abstract: A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: July 10, 2018
    Assignee: Robert Bosch GmbH
    Inventors: Michael Schlitzkus, Stefan Lehenberger, Dmitriy Aranovich, Gerald Brinks, Peter Diesel
  • Patent number: 9945747
    Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: April 17, 2018
    Assignee: Honeywell International Inc.
    Inventors: Vishal Shalitkumar Kusanale, Palani Thanigachalam, Todd Eckhardt, Lamar Floyd Ricks, Jim Cook, Pavan R. Kashyap, Vignesh Murugesan
  • Patent number: 9915373
    Abstract: A pressure relief comprises a valve body which includes an inlet bore that is connectable to a flow line, an outlet bore that is connectable to a vent line and a valve bore that extends to between the inlet and outlet bores. A valve member is slidably supported in the valve bore and is moveable between a closed position in which the fluid in the flow line is prevented from flowing from the inlet bore to the outlet bore and an open position in which the fluid in the flow line is permitted to flow from the inlet bore to the outlet bore. A solenoid operated pilot valve is connected to the valve body over the valve bore, and a fluid chamber is located in the pilot valve above the valve member. The fluid chamber is filled with a hydraulic fluid, and the hydraulic fluid in the fluid chamber is operatively engaged with the valve member.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: March 13, 2018
    Assignee: FMC Technologies, Inc.
    Inventor: Paul A. Crawford
  • Patent number: 9879781
    Abstract: A sealing system includes, among other things, an exterior plate, an interior plate, a first seal received against the exterior plate and configured to restrict moisture ingress through the exterior plate, and a second seal received against the interior plate and configured to restrict moisture ingress through the interior plate.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 30, 2018
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Daniel Miller, James Lawrence Swoish, Asif Iqbal, Jeremy Samborsky
  • Patent number: 9829404
    Abstract: A pressure sensor includes a tubular housing; a diaphragm which is joined to one end portion of the housing through a fusion zone; and a sensor element which is disposed in the housing and to which pressure received by the diaphragm is transmitted. As viewed in a section which contains the center axis of the housing, a pair of the fusion zones exist, and each of the fusion zones is formed in such an inclined manner that its distance from the center axis increases as it extends from the outer surface of the diaphragm toward the other-end-portion side of the housing.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: November 28, 2017
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tatsunori Yamada, Junki Iwabuchi
  • Patent number: 9804002
    Abstract: An integral sensor system is provided. In one embodiment, the system includes a sensor installed in a carrier and a component having a body for receiving a fluid. The carrier is integrated into the component to enable the sensor to detect one or more characteristics of the fluid, and the carrier is integrated into the component such that an interface between the carrier and the component is a fully integral pressure boundary without a seal connection between the carrier and the component. The carrier can be welded to the component to form the integral pressure boundary. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: September 4, 2013
    Date of Patent: October 31, 2017
    Assignee: Cameron International Corporation
    Inventors: Edmund McHugh, Michael D. Mullin
  • Patent number: 9778130
    Abstract: Certain implementations of the disclosed technology include a differential pressure transducer and method of assembly. The differential pressure transducer includes: a housing having a first pressure port and a second pressure port; a header welded to the housing; a cap welded to the header; a sensor module disposed in the header and in communication with first pressure port and the second pressure port. The sensor module includes a diaphragm having a first side and a second side. The first side is configured to receive a first pressure by the first pressure port, and the second side is adapted to receive a second pressure by the second pressure port. The differential pressure transducer also includes a reference tube configured to communicate the second pressure from the second pressure port to the diaphragm second side. The reference tube is welded to a portion of the header with an inspectable weld.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: October 3, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Lou DeRosa, Steven Kleiber
  • Patent number: 9772248
    Abstract: This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 26, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa, Leo Geras, Dick Martin
  • Patent number: 9766148
    Abstract: A diaphragm seal system, which is filled with a pressure transmission medium, wherein the pressure measurement instrument is welded by its connecting thread into a connecting adapter.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: September 19, 2017
    Assignee: WIKA Alexander Wiegand SE & Co. KG
    Inventors: Thomas Berberich, Udo Hoerning, Albrecht Kalisch, Heiko Kern, Horst Weis-Schneider
  • Patent number: 9733140
    Abstract: A double diaphragm type pressure sensor includes a metal container having a concave portion; a pressure sensor unit mounted on a bottom of the container; a metal diaphragm airtightly bonded to an opening portion of the concave portion of the container; a pressure transmission medium filling a space formed by the metal diaphragm and the concave portion of the container; and a metal terminal penetrating the bottom of the container and being electrically insulated from the container.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: August 15, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kimihiro Ashino
  • Patent number: 9638556
    Abstract: Methods and devices for measuring fluid properties include an electromagnetic sensor. The electromagnetic sensor includes a coaxial probe body having a first integral pressure barrier and a second integral pressure barrier formed from coaxial-feedthrough connector. The first integral pressure barrier and the second integral pressure barrier have a desired characteristic impedance.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: May 2, 2017
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Cheng-Gang Xie, Guillaume Jolivet, Renke Tang, Alexander Tuborg Vilstrup, Yngve Boee, Rolf Rustad
  • Patent number: 9568384
    Abstract: Measurements of pressure relative to atmospheric reference pressure are enabled by a sealed enclosure, which in one aspect is a variable volume enclosure including a movable element responsive to atmospheric pressure, to at least partially equalize pressure internal to the variable volume enclosure to the pressure external to the variable volume enclosure, such that a pressure sensor pneumatically connected to the internal volume can use its pressure a reference in measuring atmospheric pressure. The variable volume enclosure may house electronics and/or electrical terminations for pressure sensing, or the variable volume enclosure may be a sub-enclosure connected pneumatically to the pressure sensor, with another enclosure housing electronics or electrical terminations. In another embodiment, the sealed enclosure includes an absolute pressure sensor for sensing atmospheric pressure for use as a reference, and need not have variable volume.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: February 14, 2017
    Assignee: Remote Industrial Sensor Company LLC
    Inventor: Ken N. Stith, Jr.
  • Patent number: 9523617
    Abstract: A transducer assembly configured to accommodate a plurality of individually tunable sensing elements of various geometries and configurations by using a cap and an accompanying capillary tube. The configuration of the various embodiments described herein eliminate the header to flat plate welds of the prior art, and therefore better accommodates a plurality of sensing elements and corresponding header assemblies within one transducer assembly.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: December 20, 2016
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa
  • Patent number: 9512933
    Abstract: A valve assembly includes an electronics housing and a valve housing assembly engaged to the electronics housing. The valve housing assembly includes a valve body defining a plurality of fluid ports in fluid communication with the valve bore. A plurality of fluid dampeners is disposed in the fluid ports. A sensor plate is engaged to the valve body. The sensor plate defines a plurality of sensor ports that are generally aligned with the fluid ports of the valve body. At least four fluid sensors are disposed in the plurality of fluid ports of the valve body. A cover is engaged to the sensor plate. The cover defines a cavity. A circuit board is disposed in the cavity of the cover. The circuit board is in electrical communication with the fluid sensors.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: December 6, 2016
    Assignee: EATON CORPORATION
    Inventors: Pankaj Nalgirkar, Rahul L. Navale, Kevin E. Alstrin
  • Patent number: 9513183
    Abstract: A process fluid pressure transmitter includes a sensor body having a pressure sensor and electronics coupled to the pressure sensor to obtain an indication of pressure from the pressure sensor. At least one process fluid isolation assembly is fluidically coupled to the pressure sensor and is configured to receive a process fluid. The process fluid isolation assembly includes an isolation diaphragm welded to a weld ring. The weld ring has a sealing surface on a first side adapted for contact with a metal sealing ring and a weld portion welded to the sensor body on a second side. The sealing surface and the weld are substantially aligned with one another.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: December 6, 2016
    Assignee: Rosemount Inc.
    Inventors: Tyler Matthew Thompson, David Anthony Horky, Thomas Earl Johnson
  • Patent number: 9493133
    Abstract: An apparatus includes a body having a fastening portion and a pressure sensor coupled to the body apart from the fastening portion. The pressure sensor has a chamber therein. The body includes a first channel extending therethrough from an outside surface thereof. The first channel is in fluid communication with the chamber.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: November 15, 2016
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Mahmoud Yousef Ghannam, Abraham G. Philip, Erich Kemnitz
  • Patent number: 9442031
    Abstract: A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: September 13, 2016
    Assignee: Rosemount Inc.
    Inventors: Robert C. Hedtke, Fred C. Sittler
  • Patent number: 9360389
    Abstract: This disclosure provides example systems and methods for a high pressure flat plate transducer assembly. A transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can include a header front side configured for accepting the transducer and a header back side configured for mating with the housing at an interface between the header back side and the housing. The transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: June 7, 2016
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa, Leo Geras, Dick Martin
  • Patent number: 9360386
    Abstract: An amplifier-embedded pressure sensor includes: a pressure-detecting element which detects the differential pressure between the fluid and the space where the pipe including a fluid passage of the fluid is installed, and outputs the pressure signal; an amplifier circuit board having an amplifier circuit for amplifying the pressure signal; a housing to which the pressure-detecting element is fixed; and a separation part which is fixed to the housing and separates a space inside the housing into a first space where the pressure-detecting element is disposed and a second space where the amplifier circuit board is disposed. The housing includes an inflow port for letting cooling gas for cooling the amplifier circuit board flow into the second space and a discharge port for discharging the cooling gas from the second space.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: June 7, 2016
    Assignee: SURPASS INDUSTRY CO., LTD.
    Inventor: Toshiyuki Takanohashi
  • Patent number: 9326408
    Abstract: A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: April 26, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Holger Scholzen, Christoph Gmelin, Jens Vollert, Markus Ellmer
  • Patent number: 9316552
    Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: April 19, 2016
    Assignee: MEASUREMENT SPECIALTIES, INC.
    Inventors: David E. Wagner, James H. Hoffman, Kaspar L. Jenni
  • Patent number: 9274018
    Abstract: A process pressure measuring system includes a transmitter having a first sealed system in which a first outlet couples to a pressure sensor, a first isolator diaphragm assembly, a first capillary passage, and a first isolation fluid. The first isolation fluid couples a first pressure from the first isolator diaphragm to the first outlet and the pressure sensor. A second sealed system includes a second pressure outlet that is coupled to the first isolator diaphragm assembly, a second isolator diaphragm assembly, a second capillary passage and a second isolation fluid. The second isolation fluid is adapted for use in a first temperature range and couples a pressure from the second isolator diaphragm assembly to the second pressure outlet. A third sealed system includes a third pressure outlet that is coupled to the second isolator diaphragm assembly, a third isolator diaphragm assembly, a third capillary passage and a third isolation fluid.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: March 1, 2016
    Assignee: Rosemount Inc.
    Inventors: Brent Wayne Miller, Paul Ryan Fadell
  • Patent number: 9261425
    Abstract: A pressure sensor assembly includes a pressure sensor having a pressure sensing transducer connected to a plurality of electrode pins via a plurality of electrode pads disposed on the transducer, an inner casing configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels having the electrode pins disposed therein. The pressure sensor further includes an outer casing holding the inner casing therein having a capsule header with a plurality of capsule header electrode pin channels defined therein which can include a ceramic seal disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate including an isolator plate fluid port defined therein and a pressure isolator disposed on the isolator plate and configured to deflect in response to a change in ambient pressure.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: February 16, 2016
    Assignee: ROSEMOUNT AEROSPACE INC.
    Inventors: Saeed Fahimi, Odd Harald Steen Eriksen, Charles Little, Anita Fink