Abstract: A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.

Abstract: A process fluid pressure transmitter is provided. The process fluid pressure transmitter includes a pressure sensor having an electrical characteristic that changes in response to a deformation of the pressure sensor in response to pressure. Measurement circuitry is coupled to the pressure sensor and is configured to provide an indication of the electrical characteristic. An isolation diaphragm is configured to contact the process fluid and deform in response to process fluid pressure. A substantially incompressible fill fluid fluidically couples the isolation diaphragm to the pressure sensor. An overpressure compliant structure is coupled to the fill fluid and is configured to be substantially rigid at pressures below a selected threshold, but to deform in response to pressure above the selected threshold.

Abstract: A force sensor may comprise a sensing die comprising a cap and a support. Generally, a first surface of the support may comprise a buried cavity and one or more channels. The one or more channels may extend from the buried cavity towards the outer edges of the support and may ensure the force sensor is not sensitive to ambient or atmospheric pressure variation. The cap may be bonded to the first surface of the support, thereby forming a sensing diaphragm located above the buried cavity. Additionally, the force sensor may comprise an actuation element to sense a change in force from an external media. The actuation element may transmit the force to the sensing diaphragm causing it to deflect into the buried cavity. The one or more sense elements on the sensing diaphragm may provide an indication of the change in force based on the amount of deflection.

Abstract: A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.

Abstract: A sensor package includes a pressure sensor, a computation unit that performs specified computation in accordance with a result of detection performed by the pressure sensor, a lead frame through which a result of computation performed by the computation unit is output to an outside, a main housing that is formed of resin and that holds the lead frame, and a sensor housing that is formed of ceramic and that has an inner space in which the pressure sensor is disposed. The pressure sensor is disposed in the main housing using the sensor housing.

Abstract: Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.

Abstract: A pressure relief comprises a valve body which includes an inlet bore that is connectable to a flow line, an outlet bore that is connectable to a vent line and a valve bore that extends to between the inlet and outlet bores. A valve member is slidably supported in the valve bore and is moveable between a closed position in which the fluid in the flow line is prevented from flowing from the inlet bore to the outlet bore and an open position in which the fluid in the flow line is permitted to flow from the inlet bore to the outlet bore. A solenoid operated pilot valve is connected to the valve body over the valve bore, and a fluid chamber is located in the pilot valve above the valve member. The fluid chamber is filled with a hydraulic fluid, and the hydraulic fluid in the fluid chamber is operatively engaged with the valve member.

Abstract: A sealing system includes, among other things, an exterior plate, an interior plate, a first seal received against the exterior plate and configured to restrict moisture ingress through the exterior plate, and a second seal received against the interior plate and configured to restrict moisture ingress through the interior plate.

Abstract: A pressure sensor includes a tubular housing; a diaphragm which is joined to one end portion of the housing through a fusion zone; and a sensor element which is disposed in the housing and to which pressure received by the diaphragm is transmitted. As viewed in a section which contains the center axis of the housing, a pair of the fusion zones exist, and each of the fusion zones is formed in such an inclined manner that its distance from the center axis increases as it extends from the outer surface of the diaphragm toward the other-end-portion side of the housing.

Abstract: An integral sensor system is provided. In one embodiment, the system includes a sensor installed in a carrier and a component having a body for receiving a fluid. The carrier is integrated into the component to enable the sensor to detect one or more characteristics of the fluid, and the carrier is integrated into the component such that an interface between the carrier and the component is a fully integral pressure boundary without a seal connection between the carrier and the component. The carrier can be welded to the component to form the integral pressure boundary. Additional systems, devices, and methods are also disclosed.

Abstract: Certain implementations of the disclosed technology include a differential pressure transducer and method of assembly. The differential pressure transducer includes: a housing having a first pressure port and a second pressure port; a header welded to the housing; a cap welded to the header; a sensor module disposed in the header and in communication with first pressure port and the second pressure port. The sensor module includes a diaphragm having a first side and a second side. The first side is configured to receive a first pressure by the first pressure port, and the second side is adapted to receive a second pressure by the second pressure port. The differential pressure transducer also includes a reference tube configured to communicate the second pressure from the second pressure port to the diaphragm second side. The reference tube is welded to a portion of the header with an inspectable weld.

Abstract: This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.

Abstract: A diaphragm seal system, which is filled with a pressure transmission medium, wherein the pressure measurement instrument is welded by its connecting thread into a connecting adapter.

Abstract: A double diaphragm type pressure sensor includes a metal container having a concave portion; a pressure sensor unit mounted on a bottom of the container; a metal diaphragm airtightly bonded to an opening portion of the concave portion of the container; a pressure transmission medium filling a space formed by the metal diaphragm and the concave portion of the container; and a metal terminal penetrating the bottom of the container and being electrically insulated from the container.

Abstract: Methods and devices for measuring fluid properties include an electromagnetic sensor. The electromagnetic sensor includes a coaxial probe body having a first integral pressure barrier and a second integral pressure barrier formed from coaxial-feedthrough connector. The first integral pressure barrier and the second integral pressure barrier have a desired characteristic impedance.

Abstract: Measurements of pressure relative to atmospheric reference pressure are enabled by a sealed enclosure, which in one aspect is a variable volume enclosure including a movable element responsive to atmospheric pressure, to at least partially equalize pressure internal to the variable volume enclosure to the pressure external to the variable volume enclosure, such that a pressure sensor pneumatically connected to the internal volume can use its pressure a reference in measuring atmospheric pressure. The variable volume enclosure may house electronics and/or electrical terminations for pressure sensing, or the variable volume enclosure may be a sub-enclosure connected pneumatically to the pressure sensor, with another enclosure housing electronics or electrical terminations. In another embodiment, the sealed enclosure includes an absolute pressure sensor for sensing atmospheric pressure for use as a reference, and need not have variable volume.

Abstract: A transducer assembly configured to accommodate a plurality of individually tunable sensing elements of various geometries and configurations by using a cap and an accompanying capillary tube. The configuration of the various embodiments described herein eliminate the header to flat plate welds of the prior art, and therefore better accommodates a plurality of sensing elements and corresponding header assemblies within one transducer assembly.

Abstract: A process fluid pressure transmitter includes a sensor body having a pressure sensor and electronics coupled to the pressure sensor to obtain an indication of pressure from the pressure sensor. At least one process fluid isolation assembly is fluidically coupled to the pressure sensor and is configured to receive a process fluid. The process fluid isolation assembly includes an isolation diaphragm welded to a weld ring. The weld ring has a sealing surface on a first side adapted for contact with a metal sealing ring and a weld portion welded to the sensor body on a second side. The sealing surface and the weld are substantially aligned with one another.

Abstract: A valve assembly includes an electronics housing and a valve housing assembly engaged to the electronics housing. The valve housing assembly includes a valve body defining a plurality of fluid ports in fluid communication with the valve bore. A plurality of fluid dampeners is disposed in the fluid ports. A sensor plate is engaged to the valve body. The sensor plate defines a plurality of sensor ports that are generally aligned with the fluid ports of the valve body. At least four fluid sensors are disposed in the plurality of fluid ports of the valve body. A cover is engaged to the sensor plate. The cover defines a cavity. A circuit board is disposed in the cavity of the cover. The circuit board is in electrical communication with the fluid sensors.

Abstract: An apparatus includes a body having a fastening portion and a pressure sensor coupled to the body apart from the fastening portion. The pressure sensor has a chamber therein. The body includes a first channel extending therethrough from an outside surface thereof. The first channel is in fluid communication with the chamber.

Abstract: A process fluid pressure measurement probe includes a pressure sensor formed of a single-crystal material and mounted to a first metallic process fluid barrier and disposed for direct contact with a process fluid. The pressure sensor has an electrical characteristic that varies with process fluid pressure. A feedthrough is formed of a single-crystal material and has a plurality of conductors extending from a first end to a second end. The feedthrough is mounted to a second metallic process fluid barrier and is spaced from, but electrically coupled to, the pressure sensor. The pressure sensor and the feedthrough are mounted such that the secondary metallic process fluid barrier is isolated from process fluid by the first metallic process fluid barrier.

Abstract: An amplifier-embedded pressure sensor includes: a pressure-detecting element which detects the differential pressure between the fluid and the space where the pipe including a fluid passage of the fluid is installed, and outputs the pressure signal; an amplifier circuit board having an amplifier circuit for amplifying the pressure signal; a housing to which the pressure-detecting element is fixed; and a separation part which is fixed to the housing and separates a space inside the housing into a first space where the pressure-detecting element is disposed and a second space where the amplifier circuit board is disposed. The housing includes an inflow port for letting cooling gas for cooling the amplifier circuit board flow into the second space and a discharge port for discharging the cooling gas from the second space.

Abstract: This disclosure provides example systems and methods for a high pressure flat plate transducer assembly. A transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can include a header front side configured for accepting the transducer and a header back side configured for mating with the housing at an interface between the header back side and the housing. The transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing.

Abstract: A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.

Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Abstract: A process pressure measuring system includes a transmitter having a first sealed system in which a first outlet couples to a pressure sensor, a first isolator diaphragm assembly, a first capillary passage, and a first isolation fluid. The first isolation fluid couples a first pressure from the first isolator diaphragm to the first outlet and the pressure sensor. A second sealed system includes a second pressure outlet that is coupled to the first isolator diaphragm assembly, a second isolator diaphragm assembly, a second capillary passage and a second isolation fluid. The second isolation fluid is adapted for use in a first temperature range and couples a pressure from the second isolator diaphragm assembly to the second pressure outlet. A third sealed system includes a third pressure outlet that is coupled to the second isolator diaphragm assembly, a third isolator diaphragm assembly, a third capillary passage and a third isolation fluid.

Abstract: A pressure sensor assembly includes a pressure sensor having a pressure sensing transducer connected to a plurality of electrode pins via a plurality of electrode pads disposed on the transducer, an inner casing configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels having the electrode pins disposed therein. The pressure sensor further includes an outer casing holding the inner casing therein having a capsule header with a plurality of capsule header electrode pin channels defined therein which can include a ceramic seal disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate including an isolator plate fluid port defined therein and a pressure isolator disposed on the isolator plate and configured to deflect in response to a change in ambient pressure.

Abstract: A multivariable process fluid transmitter module includes a base having a pair of recesses. A pair of pedestals is provided with each pedestal being disposed in a respective recess and being coupled to a respective isolation diaphragm. At least one line pressure assembly is mounted proximate one of the pedestals. The at least one line pressure assembly couples a respective isolation diaphragm to a line pressure sensor. A differential pressure sensor has a sensing diaphragm fluidically coupled to the isolation diaphragms by a fill fluid. At least one additional sensor is disposed to sense a temperature of a process fluid. Circuitry is coupled to the line pressure sensor, the differential pressure sensor, and the at least one additional sensor to measure an electrical characteristic of each of the line pressure sensor, the differential pressure sensor, and the at least one additional sensor.

Abstract: A separating membrane for use particularly in pressure sensors, for separating between a process fluid and a pressure-transferring hydraulic oil, is described. The separating membrane is in the form of a thin foil covering an opening into a volume containing the oil, with the foil being fastened to the edges of the opening, and is characterized in that the separating membrane is fastened at the edges of the opening in such a manner that it, in at least one region of its area, exhibits a transition from a concave to convex bulging, whereby the membrane is able to accommodate a volume change of the oil through a non-energy requiring translation of the transition(s). Also described are a method of manufacturing the separating membrane as well as a pressure sensor comprising the separating membrane.

Abstract: Hydrogen which has entered into a pressure/differential pressure transmitter from external or internally generated hydrogen and hydrocarbons are converted to air bubbles within pressure guide paths. As a result, the indicated value drifts and an accurate numerical value is not output. A pressure/differential pressure transmitter includes a space formed between a diaphragm and a main body side wall face, pressure guide paths connected to the main body side wall face, a sealed liquid sealed in the space and the pressure guide paths to transmit a pressure received by the diaphragm to a sensor, and a hydrogen absorption material provided at least in the sealed liquid, on the main body side wall face, or in a part of a path between the main body side wall face and the sensor to absorb hydrogen atoms in the sealed liquid.

Abstract: A flexible display apparatus includes a substrate that is flexible and is foldable according to an intention of a user, the substrate including a display area, wherein a size of the substrate is variable according to a folding thereof, a deformation sensing unit that is in an overlapping relationship with the display area and that senses deformation of the substrate, a control unit obtaining information from the deformation sensing unit, and a resolution adjusting unit that is controlled by the control unit and adjusts a resolution of an image displayed on the display area.

Abstract: A pressure transmitter system for measuring a pressure of a process fluid in an industrial process includes a pressure transmitter having a pressure sensor. A process fluid passageway having a circular opening is configured to couple pressure of the process fluid to the pressure sensor. A concentric seal support structure extends around the circular opening comprising an annular recess. An annular stress riser is positioned radially inward from the annular recess. A seal material fills the annular recess and contacts at least a portion of the annular stress riser.

Abstract: The invention relates to an assembly, in particular for measuring a process variable, which consists of a measuring instrument having a process connection and a housing, which is partially rotationally symmetrical at least in the region of the process connection, and of an adapter having a through-hole, which extends in the axial direction, and a sealing web in the through-hole. The measuring instrument and the adapter are connected to each other in a releasable and sealed manner via two sealing surfaces. According to the invention, at least one of the sealing surfaces then has a coating composed of parylene. The invention furthermore relates to an assembly for the releasable and sealed connection of two medium-carrying parts, in particular pipelines.

Abstract: Pressure sensor. The sensor includes a deformable diaphragm responsive to applied pressure and a rigid beam mounted to move as the diaphragm deforms. The rigid beam includes a mirrored surface for receiving light from and reflecting light into an optical fiber thereby forming a Fabry-Perot cavity to detect changes in the position of the rigid beam. The rigid beam further includes inter-digital fingers extending from the mirrored surface and moving with the rigid beam with respect to fixed inter-digital fingers to create a change in electrical charges in the fingers to detect changes in the position of the rigid beam thereby providing two measures of rigid beam displacement which are measures of pressure. In a preferred embodiment, the optical fiber is a single mode optical fiber.

Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.

Abstract: A pressure transmitter system for measuring a pressure of a process fluid in an industrial process includes a pressure transmitter having a pressure sensor. A process fluid passageway having a circular opening is configured to couple pressure of the process fluid to the pressure sensor. A concentric seal support structure extends around the circular opening comprising an annular recess. An annular stress riser is positioned radially inward from the annular recess. A seal material fills the annular recess and contacts at least a portion of the annular stress riser.

Abstract: A pressure measurement system is provided. The system includes a pressure sensing probe extendable into a process fluid and having a pressure sensor with an electrical characteristic that varies with process fluid pressure. A mineral insulated cable has a metallic sheath with a distal end attached to the pressure sensing probe and a proximal end. The mineral insulated cable includes a plurality of conductors extending within the metallic sheath and being spaced from one another by an electrically insulative dry mineral. The proximal end of the metallic sheath is configured to be sealingly attached to a process fluid vessel.

Abstract: An isolator system for a pressure transmitter includes a port internal to the transmitter, a sensor tube, and a fill tube. The sensor tube is connected to the port to fluidly connect a passageway through a transmitter body to a pressure sensor. The sensor tube includes a first end disposed in the port. The first end has a first cross-sectional area. The fill tube is internal to the transmitter and connected to the port to fluidly connect to the passageway. The fill tube includes a second end disposed in the port. The second end of the fill tube has a second cross-sectional area that is less than the first cross-sectional area of the sensor tube.

Abstract: A support unit for a circuit board in a sensor unit comprises a main body that defines an outer contour and includes a first joining geometry and a second joining geometry. The first joining geometry is configured to at least one of guide and electrically contact external contact elements, and includes contact receiving pockets configured to guide the external contact elements, and at least one reinforcement web that separates two adjacent contact receiving pockets. The second joining geometry is configured to join the support unit to the circuit board. The first joining geometry defines at least in part an external interface via which at least one electrical output signal of the circuit board is tapped.

Abstract: A pressure transmitter connectable to a process line provides an output responsive to a pressure in the process line. The transmitter includes a housing having a base with a process end coupled to an interior cavity formed in the housing, a sensor for sensing the pressure and an isolating assembly mounted at the process end of the housing and isolating fluid in the process line from the interior cavity. The isolating assembly includes an isolation diaphragm configured to be fluidically coupled to the process pressure in the process line, and an isolator plug positioned in the process of the housing adapter.

Abstract: A fluid pressure measurement sensor (11) comprises a microelectromechanical system (MEMS) chip (23). The MEMS chip (23) comprises two lateral walls (56), a sensitive membrane (49) connected to said lateral walls (56) and sealed cavity (9). The exterior surfaces of the lateral walls (56) and the sensitive membrane (49) are exposed to the fluid pressure. The lateral walls (56) are designed to subject the sensitive membrane (49) to a compression stress transmitted by the opposite lateral walls (56) where said lateral walls (56) are connected to the sensitive membrane (49) such that the sensitive membrane (49) works in compression only. The MEMS chip (23) also comprises a stress detection circuit (31) to measure the compression state of the sensitive membrane (49) which is proportional to the fluid pressure.

Abstract: A process device has a process seal for coupling to an industrial process. The process device includes a process device body having an isolation cavity and an isolation passageway extending from the isolation cavity to a pressure sensor. The isolation cavity and isolation passageway filled with an isolation fluid. An isolation diaphragm is positioned to isolate the isolation cavity from process fluid. The isolation diaphragm has a process fluid side and an isolation fluid side. A weld ring is positioned around a periphery of the process fluid side of the isolation diaphragm. The weld ring is formed of a first material compatible with the isolation diaphragm and a second material compatible with the process device body. A weld secures the weld ring to the process device body.

Abstract: A ceramic component having at least one electrical feedthrough, comprising: a ceramic body, through which a bore extends; and a metal conductor, which is arranged at least sectionally in the bore and which is secured in the bore by means of an active hard solder, or braze, whereby the bore is sealed. The active hard solder fills an annular gap between the metal conductor and the ceramic body, characterized in that the active hard solder has a radially variable, chemical composition.

Abstract: A process fluid pressure transmitter for measuring a process pressure referenced to atmospheric pressure is provided. The process fluid pressure transmitter includes a pressure sensor fluidically coupled to a pair of pressure conveying conduits. The pressure sensor has an electrical characteristic that varies with the pressures applied by the pressure conveying conduits. A process fluid inlet is disposed to contact a process fluid, and is in fluidic communication with a first conduit of the pair of pressure conveying conduits. An atmospheric vent is coupled to a second conduit of the pair of pressure conveying conduits. The atmospheric vent is replaceable and has a filter element disposed therein.

Abstract: An integrated reference vacuum pressure sensor with an atomic layer deposition (ALD) coated input port comprises a housing with an port for a media to enter the housing; a substrate and stress isolation member in the housing; wherein a channel extends through the substrate and the stress isolation member, wherein a trace is embedded within the stress isolation member, wherein stress isolation member and substrate surfaces exposed to the channel are coated with an ALD; a sensor die bonded to the stress isolation member, the sensor die comprising a diaphragm having circuitry, wherein a side of the diaphragm is exposed to the channel and the circuitry is mounted to another side of the diaphragm; a via extending through the sensing die electrically connecting the circuitry to the trace; and a cover bonded to the stress isolation member, the cover having a recess, the sensor die in the recess.

Abstract: The invention is for a method and apparatus for a pressure measuring cell for measuring a metered pressure, with a base body having at least one base body electrode and with a membrane body connected to the base body to form a sensor chamber, which has at least one membrane electrode and can be subjected to the pressure of a medium that is below the measurement pressure, wherein both the wall of the sensor chamber that is formed by the base body and the wall of the sensor chamber that is formed by the membrane body is covered with a protective layer; according to the invention, the protective layer is fashioned as a glass layer.

Abstract: A relative pressure sensor includes: a pressure measuring transducer having a measuring membrane of a semiconductor chip and a platform, wherein, between both of these, a reference pressure chamber is formed; a support body, connected with the platform by means of a pressure-bearing adhesion, wherein a reference pressure path extends through the two former elements into the reference pressure chamber; and a sensor outer body, in which a transducer chamber with a first opening and a second opening is formed. The pressure measuring transducer is brought into the transducer chamber through the first opening, and is held therein by means of the support body. The support body pressure-tightly seals the first opening, and a side of the measuring membrane facing away from the reference pressure chamber is contactable with the media pressure through the second opening.

Abstract: A pressure sensor is disclosed. The pressure sensor comprises a sensor chip having a depressed portion and a diaphragm defining a bottom of the depressed portion, a support member defining a pressure transmission passage communicating with the depressed portion, and a gel member continuously filling the depressed portion and at least a part of the pressure transmission passage. The sensor chip is bonded to a mounting surface of the support member with an adhesive. An edge of an open end of the pressure transmission passage on the mounting surface faces an surrounding region of the depressed portion of the sensor chip.

Abstract: A tunable pressure transducer assembly that comprises a sensing element disposed within a housing, wherein the sensing element is adapted to output a signal substantially indicative of an applied pressure, and a filter assembly also disposed within the housing. The filter assembly comprises a cap and a tube, wherein the cap is spaced from the sensing element within the housing such that it encloses a set volume around the sensing element, and wherein the tube controls access of the applied pressure to the set volume. The filter assembly is operative to substantially reduce high frequency pressure ripples and allow static and quasi-static pressures to pass through to the sensing element, and may be manipulated to tune the pressure transducer assembly to achieve a desired dampening frequency. The filter assembly therefore enables one pressure transducer assembly outline to accurately measure pressure in various systems.

Abstract: Systems and methods for a pressure sensor are provided, where the pressure sensor comprises a housing having a high side input port that allows a high pressure media to enter a high side of the housing and a low side input port that allows a low pressure media to enter a low side of the housing when the housing is placed in an environment containing the high and low pressure media; a substrate mounted within the housing; a stress isolation member mounted to the substrate; a die stack having sensing circuitry bonded to the stress isolation member; a low side atomic layer deposition (ALD) applied to surfaces, of the substrate, the stress isolation member, and the die stack, exposed to the low side input port; and a high side ALD applied to surfaces, of the stress isolation member and the die stack, exposed to the high side input port.