Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.

Abstract: According to an embodiment, a capacitor diagnosis device includes a sensor, a frequency spectrum analysis unit, a frequency component extraction unit, and a diagnosis processing unit. The sensor detects a physical quantity that changes with an current flowing through a capacitor in a power conversion unit (PCU) for converting DC power smoothed by the capacitor connected in parallel to DC link(s) into AC power according to a power running operation. The frequency spectrum analysis unit generates a frequency spectrum based on a detection result of the sensor detected during the power running operation of the PCU. The frequency component extraction unit extracts a component of a specific frequency band related to a frequency depending on a configuration of the PCU based on the frequency spectrum. The diagnosis processing unit diagnoses a state of the capacitor based on at least a magnitude of the extracted component of the specific frequency band.

Abstract: To provide a pressure sensor housing that is less likely to cause temperature distribution inside a pressure sensor when the pressure sensor is disposed inside a heater block, a pressure sensor housing includes a hollow cylindrical member extending along a predetermined axis core. A pressure sensor element that detects the pressure of a fluid is accommodated inside the cylindrical member. The entire circumference of a side surface thereof is surrounded by an air layer in the first posture in which an axis core of a space is aligned with the predetermined axis core with the hollow member disposed in the space. The side surface is in contact with a wall surface defining the space at a plurality of points at the same time in a second posture, which is at least one of postures in which the predetermined axis core is eccentric with the axis core of the space.

Abstract: A pressure sensor includes an input terminal configured to receive an electrical input signal and an output terminal configured to provide an electrical output signal in response to the electrical input signal. The pressure sensor also includes an acousto-mechanical diaphragm and an electrically conductive element formed on the acousto-mechanical diaphragm. The pressure sensor further includes a distributed element filter configured to capacitively couple the input terminal to the output terminal. The distributed element filter is spaced from the electrically conductive element by an air gap. The air gap changes in response to a deflection of the acousto-mechanical diaphragm caused by a change in pressure on the acousto-mechanical diaphragm.

Abstract: An article for use in a plasma processing apparatus includes a gas supply pipe, and a component disposed in the gas supply pipe. The component is configured to cause radicals of gas passing through the gas supply pipe to be deactivated in the component.

Abstract: The invention relates to a method for producing a sensor housing for a pressure sensor and to a sensor housing for a pressure sensor, to a pressure sensor having such a sensor housing, and to the use of an additive production device for producing such a sensor housing. A sensor body and/or at least one membrane stamp is applied to a provided metal plate by means of additive production. The additive production produces an integrally joined, in particular planar joint connection between the sensor body and/or the at least one membrane stamp, on the one side, and the metal plate, on the other side.

Abstract: Various embodiments include a capacitive pressure transducer for measuring the pressure of a medium adjacent to the transducer comprising: a measurement diaphragm including a first surface in contact with the medium and a second surface facing away from the medium; a measurement electrode integrated with the measurement diaphragm; a base body arranged opposite the second surface, the base body comprising a counter electrode forming a measurement capacitance with the measurement electrode; and an electrically insulating chamber bounded by the base body and the measurement diaphragm. The counter electrode is in contact with the electrically insulating chamber. At least one of the measurement electrode or the counter electrode comprises a meandering pattern layer in direct contact with the electrically insulating chamber.

Abstract: A piezoelectric pressure sensor is characterized by a piezoelectric transducer having substantially parallel piezoelectric plate faces oriented in planes that extend substantially parallel a principal longitudinal axis of the sensor, a pair of clamping members engaging the piezoelectric plate faces, a membrane cap covering the clamping members and mounted on a stem to define an enclosed protective chamber that isolates the piezoelectric transducer and the clamping members from an environment outside the membrane cap. The membrane cap has a membrane wall engaging outside faces of the clamping members. The membrane wall undergoes inward deflections in response to pressure increases in the environment outside the membrane cap. The clamping members undergo corresponding inward deflections in response to the inward deflections of the membrane wall.

Abstract: Disclosed is a first force sensing region of footwear. The first force sensing region includes a first force sensor unit. The first force sensor unit includes a first compliant capacitor disposed with respect to a first plane. The first force sensor unit also includes a strain transformation structure disposed with respect to the first plane. The strain transformation structure includes a first transformation element coupled to an outer surface of the first electrode of the first compliant capacitor and a second transformation element coupled to an outer surface of the second electrode of the first compliant capacitor.

Abstract: A sensor case of pressure sensor device includes a sensor housing portion, a first terminal housing portion that extends from the sensor housing portion in a first direction, and a second terminal housing portion that extends from the sensor housing portion in a second direction. The first terminal housing portion includes a first upper-side opening that opens upward, and a first lower-side opening that opens downward. The second terminal housing portion includes a second upper-side opening that opens upward, and a second lower-side opening that opens downward. A first terminal includes a first exposed portion including an upper surface exposed to outside of the first terminal housing portion through the first upper-side opening and a lower surface exposed to outside of the first terminal housing portion through the first lower-side opening.

Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.

Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.

Abstract: An actuator includes a first enclosure, a dielectric fluid in the first enclosure, and a second enclosure in fluid communication with the first enclosure. An elastic membrane defines at least a portion of the second enclosure. A first electrical conductor is positioned along a first side of the first enclosure. A second electrical conductor is positioned along a second side of the first enclosure opposite the first side. The second conductor is spaced apart from the first conductor. The conductors are connected to a power source. Application of electrical energy to the first and second conductors produces an attractive force between the conductors. Motion of the conductors toward each other pressurizes the dielectric fluid so as to force the dielectric fluid to flow from the first enclosure into the second enclosure. The flow of the dielectric fluid exerts a force on the elastic membrane which expands the elastic membrane.

Abstract: The present disclosure provides a method for manufacturing a thermal insulation film, a thermal insulation structure, and a display device. The method for manufacturing the thermal insulation film includes: providing a substrate; forming a sacrificial layer on the substrate; forming a thermal insulation layer on the sacrificial layer, the thermal insulation layer including at least one opening capable of exposing a portion of the sacrificial layer; and etching the sacrificial layer through the opening, so as to form a plurality of hollow holes between the thermal insulation layer and the substrate. A method for manufacturing the thermal insulation film according to the present disclosure is used for manufacturing a thermal insulation film.

Abstract: A detection device, for placement under or on a mattress, configured for the movements of a person lying on the mattress, includes a sensing portion having an inflatable chamber intended to be positioned under the individual, an electronic unit arranged at a distance from the sensing portion and having a pressure sensor, intended to be positioned outside of the bedding, a transmitting portion interposed between the sensing portion and the electronic unit, including a channel establishing a fluid connection between the inflatable chamber and the sensor, the channel having a transverse dimension (T) that is much smaller than the width (L1) of the chamber.

Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.

Abstract: A pressure introducing chamber is provided with a baffle plate which is positioned with one surface thereof facing in a direction orthogonal to a direction of travel of a measured medium introduced through a pressure introducing hole into the pressure introducing chamber. A first distance between a pressure receiving surface of a sensor diaphragm and an inner surface of the pressure introducing chamber facing the pressure receiving surface and a second distance between the pressure receiving surface of the sensor diaphragm and the other surface of the baffle plate facing the pressure receiving surface are both smaller than a mean free path of the measured medium in the entire region of the pressure receiving surface of the sensor diaphragm.

Abstract: A pressure-equalization element for equalization of pressure differences between at least two spatial areas assigned to a field device used in automation technology, comprising a main body, consisting of a securing element having an axial bore, that is used for securing the pressure-equalization element in a wall of the field device, and a disc-shaped carrier component having a lateral end surface. The disc-shaped carrier component is provided with a specified number (n, where n>2) of substantially radially-running recesses corresponding to the axial bore, wherein the radially-running recesses are offset from one another by a defined angular offset, and wherein the radially-running recesses are provided with a gas-permeable, liquid-barrier membrane in the region of the lateral end surface of the disc-shaped carrier components.

Abstract: A method for expanding the dynamic range of a capacitive pressure sensor and a capacitive pressure sensor having an expanded dynamic range are provided. The capacitive pressure sensor may comprise capacitive plates. At least one plate may be contoured to increase a surface area exposed to the other of the capacitive plates. The capacitive pressure sensor may comprise a diaphragm that is movably responsive to pressure. The diaphragm may have a hollowed volume within an interior of the diaphragm operative to increase a flexibility of the diaphragm in response to the pressure. The capacitive pressure sensor may be one of a plurality of capacitive pressure sensors in a pressure sensing device. The capacitive pressure sensors may have different capacitive responses and may each output a pressure measurement, whereby the device may select a pressure measurement to output based at least in part on the capacitive responses.

Abstract: A system, method and device for interrogating a downhole environment in a borehole beneath a surface includes a source of electromagnetic energy, operable to transmit an electromagnetic signal in the borehole, a sensor module, including a passive resonating circuit including a crystal oscillator having a resonant frequency that varies with changes in the condition in the downhole environment to reflect the electromagnetic signal and to modulate the electromagnetic signal in response to a condition in the downhole environment in the borehole and a detector positionable to receive the reflected modulated electromagnetic signal.

Abstract: According to one embodiment, a sensor includes a deformable film portion, a first sensing element and a second sensing element. The first sensing element is fixed to the film portion, and includes a first magnetic layer of a first material, a first opposing magnetic layer, and a first intermediate layer. The first intermediate layer is provided between the first magnetic layer and the first opposing magnetic layer. The second sensing element is fixed to the film portion, and includes a second magnetic layer of a second material, a second opposing magnetic layer, and a second intermediate layer. The second material is different from the first material. The second intermediate layer is provided between the second magnetic layer and the second opposing magnetic layer.

Abstract: A display device may include a display panel, a window member provided above the display panel, a housing accommodating the display panel and the window member and including at least one protrusion on an inner surface thereof, and a pressure sensor including a first conductive layer provided on the at least one protrusion and a second conductive layer provided at a peripheral area of the first conductive layer to be spaced apart from the first conductive layer.

Abstract: A pressure sensor chip according to the present invention includes a non-bonding region that is provided in a stopper member and connected to a periphery of a pressure introduction hole. A plurality of protrusions are discretely formed on at least one of a first surface and a second surface that face each other in the non-bonding region. Passages between the protrusions serve as channels between the periphery of the pressure introduction hole and a peripheral edge of the non-bonding region. Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.

Abstract: A physical quantity sensor includes a detection unit outputting a detection signal corresponding to a vibration of a vibrating element in an angular velocity sensor, and a self-diagnostic unit self-diagnosing a detection environment of an acceleration sensor and the angular velocity sensor on a basis of the detection signal outputted by the detection unit.

Abstract: A microfluidic chip comprising a microchannel fillable with a liquid, the microchannel comprises a pair of electrodes, and a liquid flow path defined between the electrodes, wherein each of the electrodes extends along the flow path and parallel to a direction of a liquid filling the microchannel, in operation, and an electrical circuitry connected to each of the electrodes and configured to continuously measure, via the electrodes, a capacitance of the electrodes being wet by a liquid continuously filling the flow path, as a function of time, in operation.

Abstract: A pressure sensor chip according to the present invention includes two static-pressure diaphragms (2, 3) formed by dividing an annular diaphragm arranged so as to surround a differential-pressure diaphragm (1). A reference pressure is applied to one surface of one static-pressure diaphragm (2), and a measurement pressure (Pa) for one surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (2) along a branched path. A reference pressure is applied to one surface of the other static-pressure diaphragm (3), and a measurement pressure (Pb) for the other surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (3) along a branched path. Accordingly, multiple differential-pressure measurement ranges can be provided.

Abstract: A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm (1) as a high-differential-pressure diaphragm (2). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm (1) is transmitted to one surface of the high-differential-pressure diaphragm (2) along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm (1) is transmitted to the other surface of the high-differential-pressure diaphragm (2) along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.

Abstract: In order to solve a problem occurring in a capacitance type pressure sensor adapted to measure absolute pressure, and thereby reduce error, a pressure type flowmeter includes a fluid resistance part in a flow path through which fluid flows and measures a flow rate by detecting the upstream and downstream pressures of the fluid resistance part. Respective pressure sensors for detecting the upstream and downstream pressures are configured to be gauge pressure sensors. Each of the gauge pressure sensors is a capacitance type pressure sensor adapted to measure gauge pressure by detecting a change in the capacitance between a diaphragm displaceable by pressure and a fixed electrode and has a main body part that supports the fixed electrode and the diaphragm and forms a space between them. Further, the internal space is adapted to communicatively connect to the outside through a communicative connection part.

Abstract: Dynamic pressure sensor of MEMS and/or NEMS type comprising a support and a rigid sensitive element anchored to the support by at least one anchoring zone, said sensitive element comprising a parallel first and a second face intended to be subjected to different pressures, said sensitive element being capable of having an out-of-plane displacement with respect to the support in a detection direction under the effect of a pressure difference, the pressure sensor also comprising a detector of a force applied to the sensitive element by the pressure difference.

Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.

Abstract: A pressure sensor has a substrate and a transistor structure. The substrate has a cavity formed in the substrate. The transistor structure is arranged above the cavity. The transistor structure has a flexible heterostructure and at least one source contact, drain contact, and gate contact each connected to the heterostructure in an electrically conductive manner. The heterostructure is configured to assume a position corresponding to a pressure ratio between a first pressure in the cavity and a second pressure on a side of the heterostructure opposite the cavity. The transistor structure is configured to provide an electrical signal corresponding to the position.

Abstract: A pressure sensor comprises a deformable measuring diaphragm, and a mating body connected in a pressure-tight manner and forms a measuring chamber in which a reference pressure is present. A pressure can be applied to an outside of the measuring diaphragm. The pressure sensor has a capacitive transducer having at least one mating body electrode and at least one diaphragm electrode. Above a pressure limit value for the pressure, at least one central surface section of the measuring diaphragm rests against the mating body with a contact surface area, the size of which is dependent on the pressure. The pressure sensor also has a resistive transducer for converting a pressure-dependent deformation of the measuring diaphragm, when pressed in a range of values above the pressure limit value, into an electrical signal using an electrical resistance which is dependent on the contact surface area of the measuring diaphragm on the mating body.

Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.

Abstract: Provided is a capacitive pressure sensor that prevents not only a change in temperature but also electromagnetic noise in the air from affecting the measurement value of pressure. In the capacitive pressure sensor, an electrode member includes: a measurement electrode fixed to an insulating positioning member and having an electrode face; a signal extraction electrode fixed with an insulating seal sealing the other end of the body; and a flexible connection member for electrically connecting the measurement electrode and the signal electrode. Moreover, the flexible connection member is accommodated in the accommodating depressed portion formed in the measurement electrode or the signal extraction electrode.

Abstract: A method for forming a pressure sensor includes forming a base of a sapphire material, the base including a cavity formed therein; forming a sapphire membrane on top of the base and over the cavity; forming a lower electrode on top of the membrane; forming a piezoelectric material layer on an upper surface of the lower electrode, the piezoelectric material layer being formed of aluminum nitride (AIN); and forming at least one upper electrode on an upper surface of the piezoelectric material layer.

Abstract: Systems and methods for an internally switched multiple range transducer are provided. In one embodiment, a method comprises receiving, at a first sensor, a pressure, wherein the first sensor is associated with a first pressure range; measuring, at the first sensor, the pressure to generate a first pressure signal; in response to determining that the first pressure signal is not associated with the first pressure range, activating a second sensor, wherein the second sensor is associated with a second pressure range that is different from the first pressure range; and measuring, at the second sensor, the pressure to generate a second pressure signal.

Abstract: A system and method detect the presence of an unacceptable quantity of gas molecules in the reference vacuum cavity of a capacitance diaphragm gauge (CDG). An independent pressure transducer has an active portion exposed to the reference vacuum cavity. The transducer includes a ring anode, a cylindrical inner wall surface that forms at least one cathode, and a magnet positioned with respect to the ring anode such that the magnetic flux of the magnet is generally aligned with the central axis of the ring anode. A high voltage source applies a voltage between the ring anode and the cathode. A current sensor senses a magnitude of any current flowing between the ring anode and the cathode via ionized gas molecules. A monitoring unit monitors the magnitude of the current sensed by the current sensor and activates an alarm when the magnitude of the current exceeds an acceptable magnitude.

Abstract: The present invention relates to an all-optical pressure sensor comprising a waveguide accommodating a distributed Bragg reflector. Pressure sensing can then be provided by utilizing effective index modulation of the waveguide and detection of a wavelength shift of light reflected from the Bragg reflector. Sound sensing may also be provided thereby having an all-optical microphone. One embodiment of the invention relates to an optical pressure sensor comprising at least one outer membrane and a waveguide, the waveguide comprising at least one core for confining and guiding light, at least one distributed Bragg reflector located in said at least one core, and at least one inner deflecting element forming at least a part of the core, wherein the pressure sensor is configured such that the geometry and/or dimension of the at least one core is changed when the at least one outer membrane is submitted to pressure.

Abstract: A touch-sensitive position sensor is disclosed. The sensor comprises an array of first electrodes and an array of second electrodes arranged in a pattern to provide a sensing surface, wherein at least some of the first electrodes and the second electrodes are arranged to follow paths which are non-linear within the sensing surface such that there are ends of the first electrodes and ends of the second electrodes which meet a common edge of the sensing surface. A controller is coupled to respective ones of the first electrodes and the second electrodes and arranged to determine a reported position for an object adjacent the sensing surface by measuring changes in an electrical parameter e.g. capacitance or resistance, associated with the first electrodes and the second electrodes which is caused by the presence of the object.

Abstract: A method for manufacturing a pressure sensor, comprising: providing a ceramic platform, a ceramic measuring membrane, and an intermediate ring; providing an active braze material by means of gas phase deposition at least on a first surface section of a first surface and on a second surface section of a second surface. The first surface is a platform surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the platform by means of the active hard solder, or braze. The second surface is a measuring membrane surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the measuring membrane by means of the active hard solder, or braze.

Abstract: The present invention relates to a display device including a panel which includes a plurality of electrodes which are arranged in parallel to each other, and a bending sensing unit that senses a bending of the panel by using a change in a capacitance between at least two electrodes among the plurality of electrodes.

Abstract: A MEMS element includes a substrate which includes a flexible portion, a fixation electrode which is provided on a principal surface of the substrate, and a movable electrode which includes a movable portion which is separated from the fixation electrode, overlaps with at least a portion of the fixation electrode in a plan view of the principal surface, and is driven in a direction intersecting the principal surface, and a fixation end connected to the principal surface. The fixation electrode and the movable electrode is disposed to correspond to the flexible portion.

Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

Abstract: Electronic devices, apparatus, systems, and methods of operating and constructing the devices, apparatus, and/or systems include a wireless sensor configured to measure strain of hardware implanted in a subject. In various embodiments, temporal measurement of the hardware strain includes monitoring changes of the resonant frequency of the sensor. The sensor can be realized as an inductively powered device that operates as an all-on-chip resonator, where the components of the sensor are biocompatible. Additional apparatus, systems, and methods are disclosed.

Abstract: In an embodiment, an apparatus may include a sense element that may measure a property such as, for example, pressure. The sense element may produce an output based on the measured property. Circuitry associated with the sense element may store a voltage that represents the output produced by the sense element. The circuitry may include, for example, a capacitor which may store the voltage. The stored voltage may include one or more parasitic components such as, for example, an offset voltage and/or voltage associated with current leakage. The circuitry may adjust the stored voltage to compensate for the parasitic components. The adjustment may occur over a series of phases of operation of the circuitry.

Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A method for manufacturing a semiconductor device includes: simultaneously forming first and second well regions on a semiconductor substrate, wherein the second well region becomes a fixed electrode; simultaneously forming a first gate insulating film on the first well region and a fixed electrode protective film on the second well region; simultaneously forming a floating gate electrode on the first gate insulating film and a sacrificial film on the fixed electrode protective film; simultaneously forming a second gate insulating film on the floating gate electrode and a movable electrode protective film on the sacrificial film; simultaneously forming a gate electrode on the second gate insulating film and a movable electrode on the movable electrode protective film; removing the sacrificial film to form a void by; and vacuum-sealing the void to form a vacuum chamber.

Abstract: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.

Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

Abstract: According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.