Capacitive Patents (Class 73/724)
  • Patent number: 10996120
    Abstract: A piezoelectric pressure sensor is characterized by a piezoelectric transducer having substantially parallel piezoelectric plate faces oriented in planes that extend substantially parallel a principal longitudinal axis of the sensor, a pair of clamping members engaging the piezoelectric plate faces, a membrane cap covering the clamping members and mounted on a stem to define an enclosed protective chamber that isolates the piezoelectric transducer and the clamping members from an environment outside the membrane cap. The membrane cap has a membrane wall engaging outside faces of the clamping members. The membrane wall undergoes inward deflections in response to pressure increases in the environment outside the membrane cap. The clamping members undergo corresponding inward deflections in response to the inward deflections of the membrane wall.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 4, 2021
    Assignee: Vibration Measurement Solutions, Inc.
    Inventor: George V. Zusman
  • Patent number: 10959644
    Abstract: Disclosed is a first force sensing region of footwear. The first force sensing region includes a first force sensor unit. The first force sensor unit includes a first compliant capacitor disposed with respect to a first plane. The first force sensor unit also includes a strain transformation structure disposed with respect to the first plane. The strain transformation structure includes a first transformation element coupled to an outer surface of the first electrode of the first compliant capacitor and a second transformation element coupled to an outer surface of the second electrode of the first compliant capacitor.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: March 30, 2021
    Assignee: Bend Labs Inc.
    Inventors: Shawn P. Reese, Jared K. Jonas, Colton Allen Ottley, Garvin Tran, Nathan Briggs
  • Patent number: 10948373
    Abstract: A sensor case of pressure sensor device includes a sensor housing portion, a first terminal housing portion that extends from the sensor housing portion in a first direction, and a second terminal housing portion that extends from the sensor housing portion in a second direction. The first terminal housing portion includes a first upper-side opening that opens upward, and a first lower-side opening that opens downward. The second terminal housing portion includes a second upper-side opening that opens upward, and a second lower-side opening that opens downward. A first terminal includes a first exposed portion including an upper surface exposed to outside of the first terminal housing portion through the first upper-side opening and a lower surface exposed to outside of the first terminal housing portion through the first lower-side opening.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: March 16, 2021
    Assignee: NIDEC TOSOK CORPORATION
    Inventors: Yoshihiro Kamimura, Yoshiyuki Kobayashi, Shigehiro Kataoka
  • Patent number: 10890553
    Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: January 12, 2021
    Assignee: EPISTAR CORPORATION
    Inventors: Kunal Kashyap, Kun-Wei Kao, Yih-Hua Renn, Meng-Lun Tsai, Zong-Xi Chen, Hsin-Mao Liu, Jui-Hung Yeh, Hung-Chi Wang
  • Patent number: 10822224
    Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: November 3, 2020
    Assignee: NXP USA, Inc.
    Inventors: Weng Foong Yap, Jinbang Tang, Sandeep Shantaram
  • Patent number: 10746206
    Abstract: An actuator includes a first enclosure, a dielectric fluid in the first enclosure, and a second enclosure in fluid communication with the first enclosure. An elastic membrane defines at least a portion of the second enclosure. A first electrical conductor is positioned along a first side of the first enclosure. A second electrical conductor is positioned along a second side of the first enclosure opposite the first side. The second conductor is spaced apart from the first conductor. The conductors are connected to a power source. Application of electrical energy to the first and second conductors produces an attractive force between the conductors. Motion of the conductors toward each other pressurizes the dielectric fluid so as to force the dielectric fluid to flow from the first enclosure into the second enclosure. The flow of the dielectric fluid exerts a force on the elastic membrane which expands the elastic membrane.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: August 18, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Michael Paul Rowe, Jillian M. Jakubiec
  • Patent number: 10734592
    Abstract: The present disclosure provides a method for manufacturing a thermal insulation film, a thermal insulation structure, and a display device. The method for manufacturing the thermal insulation film includes: providing a substrate; forming a sacrificial layer on the substrate; forming a thermal insulation layer on the sacrificial layer, the thermal insulation layer including at least one opening capable of exposing a portion of the sacrificial layer; and etching the sacrificial layer through the opening, so as to form a plurality of hollow holes between the thermal insulation layer and the substrate. A method for manufacturing the thermal insulation film according to the present disclosure is used for manufacturing a thermal insulation film.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: August 4, 2020
    Assignees: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xufei Xu, Na Zhao, Yijun Wang, Qiyu Shen
  • Patent number: 10722122
    Abstract: A detection device, for placement under or on a mattress, configured for the movements of a person lying on the mattress, includes a sensing portion having an inflatable chamber intended to be positioned under the individual, an electronic unit arranged at a distance from the sensing portion and having a pressure sensor, intended to be positioned outside of the bedding, a transmitting portion interposed between the sensing portion and the electronic unit, including a channel establishing a fluid connection between the inflatable chamber and the sensor, the channel having a transverse dimension (T) that is much smaller than the width (L1) of the chamber.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: July 28, 2020
    Assignee: WITHINGS
    Inventors: Florent Dusanter, Bastien Rechke, Pierre Barrochin, Nadine Buard, Eric Carreel, Lodie Julien
  • Patent number: 10712218
    Abstract: A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: July 14, 2020
    Assignee: InvenSense, Inc.
    Inventors: Johannes Schumm, Andreas Reinhard, Thomas Kraehenbuehl, Stefan Thiele, Rene Hummel, Chung-Hsien Lin, Wang Shen Su, Tsung Lin Tang, Chia Ming Lin
  • Patent number: 10670481
    Abstract: A pressure introducing chamber is provided with a baffle plate which is positioned with one surface thereof facing in a direction orthogonal to a direction of travel of a measured medium introduced through a pressure introducing hole into the pressure introducing chamber. A first distance between a pressure receiving surface of a sensor diaphragm and an inner surface of the pressure introducing chamber facing the pressure receiving surface and a second distance between the pressure receiving surface of the sensor diaphragm and the other surface of the baffle plate facing the pressure receiving surface are both smaller than a mean free path of the measured medium in the entire region of the pressure receiving surface of the sensor diaphragm.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: June 2, 2020
    Assignee: AZBILL CORPORATION
    Inventors: Takuya Ishihara, Masaru Soeda, Masashi Sekine
  • Patent number: 10634571
    Abstract: A pressure-equalization element for equalization of pressure differences between at least two spatial areas assigned to a field device used in automation technology, comprising a main body, consisting of a securing element having an axial bore, that is used for securing the pressure-equalization element in a wall of the field device, and a disc-shaped carrier component having a lateral end surface. The disc-shaped carrier component is provided with a specified number (n, where n>2) of substantially radially-running recesses corresponding to the axial bore, wherein the radially-running recesses are offset from one another by a defined angular offset, and wherein the radially-running recesses are provided with a gas-permeable, liquid-barrier membrane in the region of the lateral end surface of the disc-shaped carrier components.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: April 28, 2020
    Assignee: ENDRESS+HAUSER SE+CO.KG
    Inventor: Ioan-Mircea Pol
  • Patent number: 10612991
    Abstract: A method for expanding the dynamic range of a capacitive pressure sensor and a capacitive pressure sensor having an expanded dynamic range are provided. The capacitive pressure sensor may comprise capacitive plates. At least one plate may be contoured to increase a surface area exposed to the other of the capacitive plates. The capacitive pressure sensor may comprise a diaphragm that is movably responsive to pressure. The diaphragm may have a hollowed volume within an interior of the diaphragm operative to increase a flexibility of the diaphragm in response to the pressure. The capacitive pressure sensor may be one of a plurality of capacitive pressure sensors in a pressure sensing device. The capacitive pressure sensors may have different capacitive responses and may each output a pressure measurement, whereby the device may select a pressure measurement to output based at least in part on the capacitive responses.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: April 7, 2020
    Assignee: Fluke Corporation
    Inventor: Timothy Byron Brown
  • Patent number: 10488286
    Abstract: A system, method and device for interrogating a downhole environment in a borehole beneath a surface includes a source of electromagnetic energy, operable to transmit an electromagnetic signal in the borehole, a sensor module, including a passive resonating circuit including a crystal oscillator having a resonant frequency that varies with changes in the condition in the downhole environment to reflect the electromagnetic signal and to modulate the electromagnetic signal in response to a condition in the downhole environment in the borehole and a detector positionable to receive the reflected modulated electromagnetic signal.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: November 26, 2019
    Assignees: CHEVRON U.S.A. INC., LOS ALAMOS NATIONAL SECURITY LLC
    Inventors: M. Clark Thompson, Dipen N. Sinha, Don M. Coates, Jacobo R. Archuletta, Manuel E. Gonzalez
  • Patent number: 10481027
    Abstract: According to one embodiment, a sensor includes a deformable film portion, a first sensing element and a second sensing element. The first sensing element is fixed to the film portion, and includes a first magnetic layer of a first material, a first opposing magnetic layer, and a first intermediate layer. The first intermediate layer is provided between the first magnetic layer and the first opposing magnetic layer. The second sensing element is fixed to the film portion, and includes a second magnetic layer of a second material, a second opposing magnetic layer, and a second intermediate layer. The second material is different from the first material. The second intermediate layer is provided between the second magnetic layer and the second opposing magnetic layer.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: November 19, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshihiko Fuji, Michiko Hara, Kei Masunishi, Yoshihiro Higashi, Shiori Kaji, Akiko Yuzawa, Akio Hori, Tomohiko Nagata, Kazuaki Okamoto, Kenji Otsu, Shotaro Baba
  • Patent number: 10481713
    Abstract: A display device may include a display panel, a window member provided above the display panel, a housing accommodating the display panel and the window member and including at least one protrusion on an inner surface thereof, and a pressure sensor including a first conductive layer provided on the at least one protrusion and a second conductive layer provided at a peripheral area of the first conductive layer to be spaced apart from the first conductive layer.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: November 19, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: A Ra Jo, Sang Hyun Lim, Chang Sub Jung, Jae Woo Choi
  • Patent number: 10401248
    Abstract: A pressure sensor chip according to the present invention includes a non-bonding region that is provided in a stopper member and connected to a periphery of a pressure introduction hole. A plurality of protrusions are discretely formed on at least one of a first surface and a second surface that face each other in the non-bonding region. Passages between the protrusions serve as channels between the periphery of the pressure introduction hole and a peripheral edge of the non-bonding region. Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: September 3, 2019
    Assignee: AZBIL CORPORATION
    Inventors: Tomohisa Tokuda, Yoshiyuki Ishikura
  • Patent number: 10393523
    Abstract: A physical quantity sensor includes a detection unit outputting a detection signal corresponding to a vibration of a vibrating element in an angular velocity sensor, and a self-diagnostic unit self-diagnosing a detection environment of an acceleration sensor and the angular velocity sensor on a basis of the detection signal outputted by the detection unit.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: August 27, 2019
    Assignee: DENSO CORPORATION
    Inventors: Kiyomasa Sugimoto, Naoki Yoshida, Minekazu Sakai, Nobuaki Kuzuya
  • Patent number: 10369567
    Abstract: A microfluidic chip comprising a microchannel fillable with a liquid, the microchannel comprises a pair of electrodes, and a liquid flow path defined between the electrodes, wherein each of the electrodes extends along the flow path and parallel to a direction of a liquid filling the microchannel, in operation, and an electrical circuitry connected to each of the electrodes and configured to continuously measure, via the electrodes, a capacitance of the electrodes being wet by a liquid continuously filling the flow path, as a function of time, in operation.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: August 6, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Emmanuel Delamarche, Yuksel Temiz
  • Patent number: 10352802
    Abstract: A pressure sensor chip according to the present invention includes two static-pressure diaphragms (2, 3) formed by dividing an annular diaphragm arranged so as to surround a differential-pressure diaphragm (1). A reference pressure is applied to one surface of one static-pressure diaphragm (2), and a measurement pressure (Pa) for one surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (2) along a branched path. A reference pressure is applied to one surface of the other static-pressure diaphragm (3), and a measurement pressure (Pb) for the other surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (3) along a branched path. Accordingly, multiple differential-pressure measurement ranges can be provided.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: July 16, 2019
    Assignee: AZBIL CORPORATION
    Inventor: Tomohisa Tokuda
  • Patent number: 10352803
    Abstract: A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm (1) as a high-differential-pressure diaphragm (2). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm (1) is transmitted to one surface of the high-differential-pressure diaphragm (2) along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm (1) is transmitted to the other surface of the high-differential-pressure diaphragm (2) along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: July 16, 2019
    Assignee: AZBIL CORPORATION
    Inventor: Tomohisa Tokuda
  • Patent number: 10309810
    Abstract: In order to solve a problem occurring in a capacitance type pressure sensor adapted to measure absolute pressure, and thereby reduce error, a pressure type flowmeter includes a fluid resistance part in a flow path through which fluid flows and measures a flow rate by detecting the upstream and downstream pressures of the fluid resistance part. Respective pressure sensors for detecting the upstream and downstream pressures are configured to be gauge pressure sensors. Each of the gauge pressure sensors is a capacitance type pressure sensor adapted to measure gauge pressure by detecting a change in the capacitance between a diaphragm displaceable by pressure and a fixed electrode and has a main body part that supports the fixed electrode and the diaphragm and forms a space between them. Further, the internal space is adapted to communicatively connect to the outside through a communicative connection part.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: June 4, 2019
    Assignee: HORIBA STEC, Co., Ltd.
    Inventors: Takehisa Hataita, Hideaki Miyamoto
  • Patent number: 10254186
    Abstract: A bottom surface of a sensor chip (or a lower surface of a first retaining member) that introduces the pressure of a measured fluid is joined to a bottom surface of a sensor chamber (or to an inner wall surface of a base body) to allow an enclosing chamber (formed by a pressure receiving chamber and a pressure guiding passage) between a pressure receiving diaphragm and the bottom surface of the sensor chip to communicate with a pressure guiding hole in the first retaining member. The sensor chamber is made open to the atmosphere. Thus, a wire bonding portion of a sensor diaphragm from which wires extend is positioned outside the enclosing chamber, and electrode pins and an enclosed liquid in the enclosing chamber are separated from each other.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: April 9, 2019
    Assignee: AZBIL CORPORATION
    Inventors: Ayumi Tsushima, Yoshiyuki Ishikura, Hirofumi Tojo, Tatsuo Tanaka, Rina Ogasawara
  • Patent number: 10257615
    Abstract: Dynamic pressure sensor of MEMS and/or NEMS type comprising a support and a rigid sensitive element anchored to the support by at least one anchoring zone, said sensitive element comprising a parallel first and a second face intended to be subjected to different pressures, said sensitive element being capable of having an out-of-plane displacement with respect to the support in a detection direction under the effect of a pressure difference, the pressure sensor also comprising a detector of a force applied to the sensitive element by the pressure difference.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: April 9, 2019
    Assignee: Commissariat à l'énergie atomique et aux énergies alternatives
    Inventor: Loic Joet
  • Patent number: 10180370
    Abstract: A pressure sensor has a substrate and a transistor structure. The substrate has a cavity formed in the substrate. The transistor structure is arranged above the cavity. The transistor structure has a flexible heterostructure and at least one source contact, drain contact, and gate contact each connected to the heterostructure in an electrically conductive manner. The heterostructure is configured to assume a position corresponding to a pressure ratio between a first pressure in the cavity and a second pressure on a side of the heterostructure opposite the cavity. The transistor structure is configured to provide an electrical signal corresponding to the position.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: January 15, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Walter Daves, Michael Badeja
  • Patent number: 9989431
    Abstract: A pressure sensor comprises a deformable measuring diaphragm, and a mating body connected in a pressure-tight manner and forms a measuring chamber in which a reference pressure is present. A pressure can be applied to an outside of the measuring diaphragm. The pressure sensor has a capacitive transducer having at least one mating body electrode and at least one diaphragm electrode. Above a pressure limit value for the pressure, at least one central surface section of the measuring diaphragm rests against the mating body with a contact surface area, the size of which is dependent on the pressure. The pressure sensor also has a resistive transducer for converting a pressure-dependent deformation of the measuring diaphragm, when pressed in a range of values above the pressure limit value, into an electrical signal using an electrical resistance which is dependent on the contact surface area of the measuring diaphragm on the mating body.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: June 5, 2018
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventors: Andreas Rossberg, Olaf Textor, Elmar Wosnitza
  • Patent number: 9945746
    Abstract: According to an embodiment, a method of sensing motion includes receiving a first signal from a first pressure sensor and a second signal from a second pressure sensor, comparing the first signal and the second signal, and characterizing a motion based on the comparing.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 17, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Christian Mandl, Andreas Kopetz, Roland Helm
  • Patent number: 9897503
    Abstract: Provided is a capacitive pressure sensor that prevents not only a change in temperature but also electromagnetic noise in the air from affecting the measurement value of pressure. In the capacitive pressure sensor, an electrode member includes: a measurement electrode fixed to an insulating positioning member and having an electrode face; a signal extraction electrode fixed with an insulating seal sealing the other end of the body; and a flexible connection member for electrically connecting the measurement electrode and the signal electrode. Moreover, the flexible connection member is accommodated in the accommodating depressed portion formed in the measurement electrode or the signal extraction electrode.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 20, 2018
    Assignee: HORIBA STEC, CO., LTD.
    Inventors: Sotaro Kishida, Takehisa Hataita, Akira Kuwahara
  • Patent number: 9835511
    Abstract: A method for forming a pressure sensor includes forming a base of a sapphire material, the base including a cavity formed therein; forming a sapphire membrane on top of the base and over the cavity; forming a lower electrode on top of the membrane; forming a piezoelectric material layer on an upper surface of the lower electrode, the piezoelectric material layer being formed of aluminum nitride (AIN); and forming at least one upper electrode on an upper surface of the piezoelectric material layer.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: December 5, 2017
    Assignee: ROSEMOUNT AEROSPACE INC.
    Inventors: Weibin Zhang, Anita Fink, Kimiko Childress, Odd Harald Steen Eriksen
  • Patent number: 9766146
    Abstract: Systems and methods for an internally switched multiple range transducer are provided. In one embodiment, a method comprises receiving, at a first sensor, a pressure, wherein the first sensor is associated with a first pressure range; measuring, at the first sensor, the pressure to generate a first pressure signal; in response to determining that the first pressure signal is not associated with the first pressure range, activating a second sensor, wherein the second sensor is associated with a second pressure range that is different from the first pressure range; and measuring, at the second sensor, the pressure to generate a second pressure signal.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 19, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Louis DeRosa
  • Patent number: 9683908
    Abstract: A system and method detect the presence of an unacceptable quantity of gas molecules in the reference vacuum cavity of a capacitance diaphragm gauge (CDG). An independent pressure transducer has an active portion exposed to the reference vacuum cavity. The transducer includes a ring anode, a cylindrical inner wall surface that forms at least one cathode, and a magnet positioned with respect to the ring anode such that the magnetic flux of the magnet is generally aligned with the central axis of the ring anode. A high voltage source applies a voltage between the ring anode and the cathode. A current sensor senses a magnitude of any current flowing between the ring anode and the cathode via ionized gas molecules. A monitoring unit monitors the magnitude of the current sensed by the current sensor and activates an alarm when the magnitude of the current exceeds an acceptable magnitude.
    Type: Grant
    Filed: February 28, 2015
    Date of Patent: June 20, 2017
    Assignee: FERRAN TECHNOLOGY, INC.
    Inventors: David J. Ferran, Robert J. Ferran
  • Patent number: 9658123
    Abstract: The present invention relates to an all-optical pressure sensor comprising a waveguide accommodating a distributed Bragg reflector. Pressure sensing can then be provided by utilizing effective index modulation of the waveguide and detection of a wavelength shift of light reflected from the Bragg reflector. Sound sensing may also be provided thereby having an all-optical microphone. One embodiment of the invention relates to an optical pressure sensor comprising at least one outer membrane and a waveguide, the waveguide comprising at least one core for confining and guiding light, at least one distributed Bragg reflector located in said at least one core, and at least one inner deflecting element forming at least a part of the core, wherein the pressure sensor is configured such that the geometry and/or dimension of the at least one core is changed when the at least one outer membrane is submitted to pressure.
    Type: Grant
    Filed: June 4, 2014
    Date of Patent: May 23, 2017
    Assignee: Technical University of Denmark
    Inventors: Kasper Reck, Christian Østergaard, Ole Hansen, Erik Vilain Thomsen
  • Patent number: 9588614
    Abstract: A touch-sensitive position sensor is disclosed. The sensor comprises an array of first electrodes and an array of second electrodes arranged in a pattern to provide a sensing surface, wherein at least some of the first electrodes and the second electrodes are arranged to follow paths which are non-linear within the sensing surface such that there are ends of the first electrodes and ends of the second electrodes which meet a common edge of the sensing surface. A controller is coupled to respective ones of the first electrodes and the second electrodes and arranged to determine a reported position for an object adjacent the sensing surface by measuring changes in an electrical parameter e.g. capacitance or resistance, associated with the first electrodes and the second electrodes which is caused by the presence of the object.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 7, 2017
    Assignee: TouchNext Limited
    Inventors: Stephen William Roberts, Peter Timothy Sleeman, Christopher Kyle Ard
  • Patent number: 9459169
    Abstract: A method for manufacturing a pressure sensor, comprising: providing a ceramic platform, a ceramic measuring membrane, and an intermediate ring; providing an active braze material by means of gas phase deposition at least on a first surface section of a first surface and on a second surface section of a second surface. The first surface is a platform surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the platform by means of the active hard solder, or braze. The second surface is a measuring membrane surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the measuring membrane by means of the active hard solder, or braze.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: October 4, 2016
    Assignee: ENDRESS + HAUSER GMBH + CO. KG
    Inventors: Peter Selders, Andreas Rossberg, Elke Schmidt, Andrea Berlinger
  • Patent number: 9436224
    Abstract: The present invention relates to a display device including a panel which includes a plurality of electrodes which are arranged in parallel to each other, and a bending sensing unit that senses a bending of the panel by using a change in a capacitance between at least two electrodes among the plurality of electrodes.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: September 6, 2016
    Assignee: LG Display Co., Ltd.
    Inventor: IlDoo Jeong
  • Patent number: 9360312
    Abstract: A MEMS element includes a substrate which includes a flexible portion, a fixation electrode which is provided on a principal surface of the substrate, and a movable electrode which includes a movable portion which is separated from the fixation electrode, overlaps with at least a portion of the fixation electrode in a plan view of the principal surface, and is driven in a direction intersecting the principal surface, and a fixation end connected to the principal surface. The fixation electrode and the movable electrode is disposed to correspond to the flexible portion.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 7, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Yusuke Matsuzawa, Yuji Chino
  • Patent number: 9360387
    Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.
    Type: Grant
    Filed: October 14, 2013
    Date of Patent: June 7, 2016
    Assignee: AZBIL CORPORATION
    Inventors: Tomohisa Tokuda, Yuuki Seto
  • Patent number: 9326728
    Abstract: Electronic devices, apparatus, systems, and methods of operating and constructing the devices, apparatus, and/or systems include a wireless sensor configured to measure strain of hardware implanted in a subject. In various embodiments, temporal measurement of the hardware strain includes monitoring changes of the resonant frequency of the sensor. The sensor can be realized as an inductively powered device that operates as an all-on-chip resonator, where the components of the sensor are biocompatible. Additional apparatus, systems, and methods are disclosed.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: May 3, 2016
    Assignee: INNOVATIVE IN VIVO SENSING, LLC
    Inventors: Hilmi Volkan Demir, Christian Matthew Puttlitz, Rohat Melik
  • Patent number: 9310269
    Abstract: In an embodiment, an apparatus may include a sense element that may measure a property such as, for example, pressure. The sense element may produce an output based on the measured property. Circuitry associated with the sense element may store a voltage that represents the output produced by the sense element. The circuitry may include, for example, a capacitor which may store the voltage. The stored voltage may include one or more parasitic components such as, for example, an offset voltage and/or voltage associated with current leakage. The circuitry may adjust the stored voltage to compensate for the parasitic components. The adjustment may occur over a series of phases of operation of the circuitry.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: April 12, 2016
    Assignee: Sensata Technologies, Inc.
    Inventors: Eric Visser, Keith Kawate
  • Patent number: 9274016
    Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: March 1, 2016
    Assignee: AZBIL CORPORATION
    Inventors: Tomohisa Tokuda, Yuuki Seto
  • Patent number: 9187315
    Abstract: A method for manufacturing a semiconductor device includes: simultaneously forming first and second well regions on a semiconductor substrate, wherein the second well region becomes a fixed electrode; simultaneously forming a first gate insulating film on the first well region and a fixed electrode protective film on the second well region; simultaneously forming a floating gate electrode on the first gate insulating film and a sacrificial film on the fixed electrode protective film; simultaneously forming a second gate insulating film on the floating gate electrode and a movable electrode protective film on the sacrificial film; simultaneously forming a gate electrode on the second gate insulating film and a movable electrode on the movable electrode protective film; removing the sacrificial film to form a void by; and vacuum-sealing the void to form a vacuum chamber.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: November 17, 2015
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Kimitoshi Sato
  • Patent number: 9146170
    Abstract: An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: September 29, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Jian Wen, William G. McDonald
  • Patent number: 9133018
    Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
    Type: Grant
    Filed: October 2, 2009
    Date of Patent: September 15, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Lung-Tai Chen, Yu-Wen Hsu, Sheah Chen, Jing-Yuan Lin, Li-Chi Pan, Tzong-Che Ho
  • Patent number: 9126824
    Abstract: According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: September 8, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventor: Tomohiro Saito
  • Patent number: 9116063
    Abstract: A sensor unit may include a ceramic member including a first face and a second face opposite to each other with a predetermined interval, a sensor part mounted on the first face, a plurality of metal pins fixed to the second face, a plurality of internal wirings passing through the ceramic member, each of the plurality of internal wirings connecting the sensor part with one of the plurality of metal pins, and a metal member formed on a circumferential end of the second face and joined with a housing by welding.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: August 25, 2015
    Assignee: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Hideki Fujiwara, Akihiro Ooshima, Tomotaka Morikawa
  • Patent number: 9117933
    Abstract: A capacitive pressure sensing semiconductor device is provided, which has pressure resistance against pressure applied by a pressing member and can detect the pressure surely and efficiently. The pressure sensing semiconductor device includes a pressure detecting part, which detects pressure as a change in capacitance, and a package that receives the pressure detecting part within. The pressure detecting part includes a first electrode and a second electrode disposed to oppose the first electrode, with a determined distance therebetween. Capacitance is formed between the first electrode and the second electrode, and changes according to a change in said distance caused by pressure transmitted to the first electrode by a pressing member. The package also includes a pressure transmitting member that transmits, to the first electrode of the pressure detecting part, the pressure applied by the pressing member.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: August 25, 2015
    Assignee: Wacom Co., Ltd.
    Inventors: Toshihiko Horie, Hidetaka Takiguchi
  • Patent number: 9068899
    Abstract: The present invention relates to a pressure sensor, which may include a first electrode plate, a second electrode plate, a third electrode plate, a fourth electrode plate and a fifth electrode plate, which are successively laminated on a substrate, wherein the first electrode plate, the third electrode plate and the fourth electrode plate are fixed to the substrate, the first electrode plate and the second electrode plate are disposed opposite to each other and have a gap formed therebetween, the second electrode plate is suspended over the first electrode plate to constitute a first capacitor; the second electrode plate and the third electrode plate are disposed opposite to each other and have a gap formed therebetween, to constitute a second capacitor; and the fifth electrode plate is suspended over the fourth electrode plate to constitute a third capacitor, and can move along a direction perpendicular to the substrate.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: June 30, 2015
    Assignee: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD.
    Inventors: Zhiwei Wang, Jianhong Mao, Lei Zhang, Deming Tang
  • Publication number: 20150135844
    Abstract: An assembly, comprising two ceramic bodies, which are connected by means of a joint, which contains an active hard solder, or braze, wherein the active hard solder, or braze, has a continuous core volume, which is spaced from the ceramic bodies, in each case, by at least 1 ?m, especially at least 2 ?m, and wherein the joint has bounding layers, which border on the ceramic body. The the core volume, which includes at least 50% of the volume of the joint, is free of crystalline phases of size greater than 6 ?m, especially greater than 4 ?m, preferably greater than 2 ?m.
    Type: Application
    Filed: June 7, 2013
    Publication date: May 21, 2015
    Inventors: Nils Ponath, Andreas Rossberg, Elke Schmidt
  • Publication number: 20150122041
    Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Chung-Hsien LIN, Rene HUMMEL, Ulrich BARTSCH, Marion HERMERSDORF, Tsung Lin TANG, Wang Shen SU, Chia Min LIN
  • Publication number: 20150122040
    Abstract: A pressure measuring device, comprising: a pressure measuring cell having a measuring membrane, at least one platform and a pressure chamber formed therebetween. An electrical transducer for transducing a deflection of the measuring membrane into a pressure dependent, primary signal; a cylindrical housing having a measuring cell chamber, in which the pressure measuring cell is arranged, and an end face pressure receipt opening in communication with the pressure duct; and an electronic circuit in the housing for operating the electrical transducer, and for processing the primary signal, and for outputting a measurement signal. The cylinder axis of the pressure measuring cell forms with the cylinder axis of the housing an angle, which amounts to not less than 80°, and which is especially preferably a right angle.
    Type: Application
    Filed: March 19, 2013
    Publication date: May 7, 2015
    Inventors: Ulfert Drewes, Nils Ponath, Michael Hugel, Thomas Uehlin
  • Patent number: 9016133
    Abstract: Various embodiments relate to a pressure sensor and related methods of manufacturing and use. A pressure sensor may include an electrical contact included in a flexible membrane that deflects in response to a measured ambient pressure. The electrical contact may be separated from a signal path through a cavity formed using a sacrificial layer and PVD plugs. At one or more defined touch-point pressure thresholds, the membrane of the pressure sensor may deflect so that the state of contact between an electrical contact and one or more sections of a signal path may change. In some embodiments, the change of state may cause the pressure sensor to trigger an alarm in the electrical circuit. Various embodiments also enable the operation of the electrical circuit for testing and calibration through the use of one or more actuation electrode layers.
    Type: Grant
    Filed: January 5, 2011
    Date of Patent: April 28, 2015
    Assignee: NXP, B.V.
    Inventors: William Frederick Adrianus Besling, Peter Gerard Steeneken, Olaf Wunnicke