Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

Abstract: A method for cleaning a receptor layer of a surface stress sensor according to an embodiment of the present invention includes, in a surface stress sensor that detects a change in surface stress of a thin film, the change being caused by a receptor layer disposed on a surface of the thin film, causing at least a part of a surface region of the thin film to generate heat or supplying heat to the receptor layer from the outside of the surface stress sensor. This makes it possible to easily perform efficient cleaning of a surface stress sensor such as a sensor that performs detection using a piezoresistor while avoiding structural complications as much as possible.

Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.

Abstract: An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

Abstract: Semiconductor structures and methods of testing the same are provided. A semiconductor structure according to the present disclosure includes a substrate, a semiconductor device over the substrate, wherein the semiconductor device includes an interconnect structure, and the interconnect structure includes a plurality of metallization layers disposed in a dielectric layer; and a delamination sensor. The delamination sensor includes a connecting structure and a plurality of contact vias in at least one of the plurality of metallization layers. The connecting structure bonds the semiconductor device to the substrate and does not functionally couple the semiconductor device to the substrate. The plurality of contact vias fall within a first region of a vertical projection area of the connecting structure but do not overlap a second region of the vertical projection area.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) structure including an epitaxial layer overlying a MEMS substrate. The method includes bonding a MEMS substrate to a carrier substrate. The epitaxial layer is formed over the MEMS substrate, where the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts is formed over the epitaxial layer.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including an epitaxial layer overlying a MEMS substrate. The MEMS substrate comprises a moveable element arranged over a carrier substrate. The epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts overlies the epitaxial layer. A first subset of the plurality of contacts overlies the moveable element. The plurality of contacts respectively has an ohmic contact with the epitaxial layer.

Abstract: According to some aspects of the subject technology, an apparatus includes a first electrode, a second electrode and a dielectric membrane disposed between the first electrode and the second electrode. The first electrode and the second electrode include a number of pores within a region of an input port of the apparatus. The first electrode, the second electrode and the dielectric membrane form a capacitor that is configured to enable detection of occlusion of the input port by water.

Abstract: A pressure sensor for an evaporated fuel leak detector is used for checking a leak in a fuel tank and a canister. The pressure sensor includes a sensor unit, a case, and a sealing resin. The sensor unit includes a pressure receiving portion for detecting a pressure of a fluid applied to a pressure receiving surface, and a mold resin portion covering a surface of the pressure receiving portion except for the pressure receiving surface. The case has a fluid flow path for introducing the fluid to the pressure receiving surface, and a housing recess in which the sensor unit is accommodated. The sealing resin is arranged in the housing recess, to at least cover a back surface of the mold resin portion located on an opposite side of the pressure receiving surface.

Abstract: Timepiece display mobile component (1) comprising at least one resilient strip (4) returned to a display axis (DA), to cooperate in a friction drive with an arbor (2) of a drive mobile component (3) of a movement (100) or a mechanism, about the axis (DA), this mobile component (1) includes a flange (5) comprising, facing each resilient strip (4), an aperture (6) for the insertion and guidance of a manual or robotic tool to allow the tool to move the resilient strip (4) away from its rest position, and to insert the mobile component (1) on an arbor (2) when the resilient strip (4) is sufficiently far away to allow this mobile component to pass, and to ensure a constant friction value of all the resilient strips (4) on the arbor (2) when they are in frictional cooperation with the arbor (2) and when the tool is no longer in contact with the resilient strips (4).

Abstract: Disclosed are a pressure sensor for sensing pressure in a vertical direction, a strain sensor for sensing tension in a horizontal direction, and a method for manufacturing the sensors. The disclosed pressure sensor includes a plurality of pressure sensor units stacked in multiple layers, and at least one of a pressure elastic modulus and an amount of conductive particles per unit area of each of the plurality of pressure sensor units is different from each other.

Abstract: A sensing film includes a base layer, a piezoelectric layer formed on the base layer, and a first electrode and a second electrode formed on the piezoelectric layer. The first and second electrodes are spaced apart and electrically insulated from each other. The first electrode includes a first connecting portion and a number of first extending portions coupled to the first connecting portion. The second electrode includes a second connecting portion and a number of second extending portions coupled to the second connecting portion. The first connecting portion and the second connecting portion are spaced apart and face each other. The first extending portions extend from a side of the first connecting portion toward the second connecting portion. The second extending portions extend from a side of the second connecting portion toward the first connecting portion. The first extending portions and the second extending portions are alternately arranged.

Abstract: An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

Abstract: A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

Abstract: A sensor assembly includes a sensor and an overload stop disposed on a surface of the sensor. The sensor has a resilient central region and an outer region surrounding the central region. The overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

Abstract: Solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate and at least two electrodes forming an electrode pair. The at least two electrodes may include a first electrode and a second electrode. The first and second electrodes may be offset from each other in a direction substantially parallel to the first surface. The sensing material may be a piezoelectric material and the sensor system may be configured to generate an output signal in response to shear stress experienced by the sensing material.

Abstract: A subtractive forming method for piezoresistive material stacks includes applying an etch chemistry to an exposed first portion of a piezoresistive material stack. The etch chemistry includes a citric acid component for removing a first element of a piezoelectric layer of the piezoresistive material stack selectively to a surface oxide. At least one second element of the piezoelectric layer remains. The method further includes heating the piezoresistive material stack after said applying the etch chemistry to vaporize the at least one second element. A second portion of the piezoresistive material stack is protected from the removal and the heating by a mask.

Abstract: A photosensitive force sensor is provided. An example photosensitive force sensor comprises a force sensing device configured to be disposed on a surface of a substrate; a housing configured to be disposed on at least a portion of the surface of the substrate; and an actuator configured to be disposed partially within the housing and partially within the aperture defined by the housing. The housing is configured to enclose the force sensing device. The aperture is configured to provide a coupling interface. The actuator is in mechanical contact with the force sensing device. The actuator is a rigid body that is configured to provide a light path from a light source external to/outside of the housing to the force sensing device.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A method of making a therapy delivery element configured for at least partial insertion in a living body is disclosed. A conductor structure is coiled around a mandrel. A segment of the conductor structure is secured to the mandrel. After this, an outer tubular structure is positioned around the conductor structure. Portions of the conductor structure that are not secured are free to expand to an inside surface of the outer tubular structure. A lumen is formed by removing at least a portion of the mandrel.

Abstract: A pneumatic artificial muscle (PAM) actuator body can be formed from an elastic material that includes an inflatable chamber and a restraining component, such as flexible, but inextensible fibers, that causes the actuator to contract when the chamber is inflated with fluid (e.g., air or water). The actuator body can be cylindrical or flat. The actuator body can include a sensor layer formed of an elastic material including a microchannel filled with a conductive fluid to sense the expansion of the actuator body. The sensor layer can be configured to expand when the actuator body is inflated causing the electrical resistance of the conductive fluid to change. A sensor layer between the actuator body and restraining component can be used to measure changes in the contraction force of the actuator and a sensor layer outside of the restraining component can be used to measure changes in the length of the actuator.

Abstract: A multi-axis MEMS gyroscope includes a micromechanical detection structure having a substrate, a driving-mass arrangement, a driven-mass arrangement with a central window, and a sensing-mass arrangement which undergoes sensing movements in the presence of angular velocities about a first horizontal axis and a second horizontal axis. A sensing-electrode arrangement is fixed with respect to the substrate and is set underneath the sensing-mass arrangement. An anchorage assembly is set within the central window for constraining the driven-mass arrangement to the substrate at anchorage elements. The anchorage assembly includes a rigid structure suspended above the substrate that is elastically coupled to the driven mass by elastic connection elements at a central portion, and is coupled to the anchorage elements by elastic decoupling elements at end portions thereof.

Abstract: A number of variations may involve a method that may include providing a non-conductive layer. A conductive layer may be provided overlying the non-conductive layer with the conductive layer to form a sensor device. An opposition to electrical current through the conductive layer may be monitored. The location of a status of the non-conductive layer or of the conductive layer may be determined through a change in the opposition.

Abstract: A stretchable sensing device includes at least one first unit structure, at least one second unit structure and a stretchable material layer. The first unit structure includes a first substrate and a first sensing element layer, wherein the first substrate includes multiple first slits and multiple first distribution regions defined by the first slits. The first sensing element layer includes multiple first sensing electrodes being electrically isolated to each other and located on the first substrate. The second unit structure is located on the first unit structure and includes a second substrate and a second sensing element layer located on the second substrate. The stretchable material layer is located between the first unit structure and the second unit structure, and provides a changeable spacing between at least two of the first sensing electrodes located on adjacent first distribution regions. A sensing method of the stretchable sensing device is also provided.

Abstract: The disclosure relates to a strain sensing element provided on a deformable substrate. The strain sensing element includes: a first magnetic layer; a second magnetic layer; and an intermediate layer. The second magnetic layer includes Fe1?yBy (0<y?0.3). Magnetization of the second magnetic layer changes according to deformation of the substrate. The intermediate layer is provided between the first magnetic layer and the second magnetic layer.

Abstract: A force/torque sensor comprising a Tool Adapter Plate (TAP) connected to a Mounting Adapter Plate (TAP) by one or more radially-spaced, deformable beams features a pair of strain gages affixed to only one surface of each beam. The two strain gages are affixed to, e.g., the top surface on either side of, and spaced away from, a neutral axis of the beam. This enables a very compact sensor design, in one embodiment, machined from a single piece of metal stock. The two sensors may be connected in a quarter bridge topology. In one embodiment, another pair of strain gages is affixed to the same side of the beam, and the four gages are wired in a half-bridge topology.

Abstract: Embodiments of solid-state stress sensors are presented herein. A sensor system may include a substrate, a first layer of sensing material disposed on a first surface of the substrate, and at least three electrodes forming a first and second electrode pair. The at least three electrodes may include a first electrode, a second electrode, and a third electrode. The first electrode may be disposed in a first plane and the second electrode and the third electrode may be disposed in a second plane, the first and second planes associated with a first direction parallel to the first surface. The first and second electrodes may be at least partially offset in the first direction. The first and third electrodes may be at least partially offset in the first direction. The sensor system may be configured to generate an output signal in response to a shear stress within the sensing material.

Abstract: A force detection device includes: a substrate; and a force transmission block. The substrate includes: a mesa gauge arranged on a principal plane of the substrate and providing a bridge circuit; a connection region arranged on the principal plane; and a sealing portion surrounding all around the mesa gauge and connected to the force transmission block. The mesa gauge includes: a first mesa gauge extending in a first direction; and a second mesa gauge extending in a second direction and spaced apart from the first mesa gauge. The connection region electrically connects the one end of the first mesa gauge and the one end of the second mesa gauge.

Abstract: A control valve monitoring system is disclosed. The control valve monitoring system includes at least one sensor connected to one of a valve stem or valve shaft, and the at least one sensor detects a change in mechanical integrity of one of the valve stem or valve shaft. A device for providing data regarding the change in mechanical integrity of one of the valve stem or valve shaft is provided, allowing maintenance of the valve shaft or valve stem to be conducted in an efficient manner.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A printed stretchable strain sensor comprises a seamless elastomeric body and a strain-sensitive conductive structure embedded in the seamless elastomeric body. The strain-sensitive conductive structure comprises one or more conductive filaments arranged in a continuous pattern. A method of printing a stretchable strain sensor comprises depositing one or more conductive filaments in a predetermined continuous pattern into or onto a support matrix. After the depositing, the support matrix is cured to embed a strain-sensitive conductive structure in a seamless elastomeric body.

Abstract: A thin film material residual testing structure comprises two groups of structures. The first group of structures comprises an electrostatic driven polysilicon cantilever beam, an asymmetrical cross beam made of thin film material to be tested and having an alignment structure, and a double-end fixed support beam made of the thin film material to be tested. The second group of structures is similar to the structure of the first group with the fixed support beam removed. A residual stress testing method includes separating the loading drive part of force from a residual stress testing structure made of the thin film material to be tested, designing the bending deflection of a control testing structure according to geometrical parameters, extracting the force applied on the residual stress testing structure and utilizing force and deflection to calculate the residual stress of the thin film material to be tested.

Abstract: In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed.

Abstract: A pressure sensor includes a ceramic sensor that is accommodated between a body and a holder. On an end surface of the sensor, plural resistive bodies are printed and fired in a straight line using a thick-film resistive paste material by screen printing.

Abstract: A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.

Abstract: The present disclosure relates in general to devices, systems and methods for wireless communication, and in particular to communication using a proximity integrated circuit card (PICC). Example embodiments include a circuit (100) for a PICC, the circuit comprising an input stage (101), a decoding module (106) and a bias adjustment module (117), the bias adjustment module (117) configured to receive an output code from the decoding module and provide a bias adjustment signal to the input stage (101), the bias adjustment module (117) configured to iteratively tune the bias adjustment signal based on a measurement of the output code, with successive steps tuning the bias adjustment signal by a smaller amount until the output code is within a decoding range.

Abstract: The method of making a flexible elastic conductive material for strain sensor and resistance applications using rubbing-in technology is shown. The thin rubber or any conductive material (substrates) is fixed at strained condition on the solid plate, by rubbing-in technology. Nanopowder of nanomaterials (organic semiconductors, carbon nanotubes, copper doped tin oxide, manganese doped tin oxide) at room temperature are embedded into the rubber conductive material to make built-in structure of conductive flexible elastic substrates that can be used for strain sensors, gages and resistance applications. The resultant product showed good sensitivity, stability and reliability during and after the rubbing-in operation.

Abstract: A structure is provided having a substrate and a direct write deposited lead zirconate titanate (PZT) nanoparticle ink based piezoelectric sensor assembly deposited on the substrate. The PZT nanoparticle ink based piezoelectric sensor assembly has a PZT nanoparticle ink based piezoelectric sensor with a PZT nanoparticle ink deposited onto the substrate via an ink deposition direct write printing process. The PZT nanoparticle ink does not require a high temperature sintering/crystallization process once deposited. The PZT nanoparticle ink based piezoelectric sensor assembly further has a power and communication wire assembly coupled to the PZT nanoparticle ink based piezoelectric sensor. The power and communication wire assembly has a conductive ink deposited onto the substrate via the ink deposition direct write printing process.

Abstract: This document describes a wireless sensor comprising a MEMS resonator and an antenna directly matched thereto. Also a method of reading the wireless sensor is described. The method comprises illuminating the wireless sensor with electromagnetic energy at a first and second frequencies and receiving an intermodulation signal emitted by the wireless sensor in response to said electromagnetic energy at the first and second frequencies.

Abstract: A driving force transmission apparatus includes: an electric motor; a multi-disc clutch including outer clutch plates and inner clutch plates that are disposed coaxially with each other so as to be rotatable relative to each other and that are frictionally engaged with each other by being pressed in an axial direction; an input rotary member that rotates together with the outer clutch plates; an output rotary member that rotates together with the inner clutch plates; a cam mechanism that generates cam thrust force for pressing the multi-disc clutch in the axial direction upon reception of torque generated by the electric motor; a strain sensor that detects reaction force against the cam thrust force; and a spring member that is disposed between the cam mechanism and the strain sensor and that buffers an impact transmitted from the cam mechanism to the strain sensor.

Abstract: A method for manufacturing an integrated circuit includes forming in a substrate a measuring circuit sensitive to mechanical stresses and configured to supply a measurement signal representative of mechanical stresses exerted on the measuring circuit. The measuring circuit is positioned such that the measurement signal is also representative of mechanical stresses exerted on a functional circuit of the integrated circuit. A method of using the integrated circuit includes determining from the measurement signal the value of a parameter of the functional circuit predicted to mitigate an impact of the variation in mechanical stresses on the operation of the functional circuit, and supplying the functional circuit with the determined value of the parameter.

Abstract: The inventors disclose a new high performance optical sensor, preferably of nanoscale dimensions, that functions at room temperature based on an extraordinary optoconductance (EOC) phenomenon, and preferably an inverse EOC (I-EOC) phenomenon, in a metal-semiconductor hybrid (MSH) structure having a semiconductor/metal interface. Such a design shows efficient photon sensing not exhibited by bare semiconductors. In experimentation with an exemplary embodiment, ultrahigh spatial resolution 4-point optoconductance measurements using Helium-Neon laser radiation reveal a strikingly large optoconductance property, an observed maximum measurement of 9460% EOC, for a 250 nm device. Such an exemplary EOC device also demonstrates specific detectivity higher than 5.06×1011 cm?Hz/W for 632 nm illumination and a high dynamic response of 40 dB making such sensors technologically competitive for a wide range of practical applications.

Abstract: Provided is a high-capacity and highly-flexible electrode group for thin batteries, a thin battery including the electrode group, and an electronic device in which the thin battery is incorporated. The electrode group for thin batteries includes: a sheet-like first electrode, a sheet-like second electrode being laminated on each of both surfaces of the first electrode, and an electrolyte layer interposed between the first electrode and the second electrode. The second electrode has a polarity opposite to that of the first electrode. The second electrode has a flexural modulus lower than that of the first electrode. The thin battery includes the electrode group, and a pouch-like housing accommodating the electrode group. The electronic device includes an electronic device main body with flexibility, and the thin battery is incorporated in the electronic device main body.

Abstract: A system and method is presented for a multi-sensor component for an HVAC system. The multi-sensor component comprises a sensor assembly, having a temperature detector for measuring a temperature of an object or medium, a presence detector to detect the presence of the object or medium against the sensor, and a pressure detector for measuring a pressure of the medium. The temperature, presence and pressure detectors may also be affixed within a single sensor housing. In a heating mode the multi-sensor component is heated by a heater, and in a cooling mode the multi-sensor component cools toward a temperature of the object or medium, and the temperature detector provides temperature data indicative of a temperature response comprising one of a temperature change, a rate of change and a time constant of a thermal decay rate of the multi-sensor component and the presence of the object or medium.

Abstract: A package for a device to be inserted into a solid structure may include a building material that includes particles of one of micrometric and sub-micrometric dimensions. The device may include an integrated detection module having at least one integrated sensor and the package arranged to coat at least one portion of the device including the integrated detection module. A method aspect includes a method of manufacturing the device. A system aspect is for monitoring parameters in a solid structure that includes the device.

Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.

Abstract: A stress sensor (1) for detecting mechanical stress in a semiconductor chip (2) has a Wheatstone bridge formed by four integrated resistors R1 to R4, the resistors R1 and R4 being p-type resistors and the resistors R2 and R3 being n-type resistors.

Abstract: Embodiments provide a MEMS including a MEMS device and an detector circuit. The MEMS device includes a membrane, wherein a material of the membrane comprises a band gap and a crystal structure with structural elements (unit cells) connected by covalent bonds in two dimensions only. The detector circuit is configured to determine a deformation of the membrane based on a piezoresistive resistance of the material of the membrane.

Abstract: In one general aspect, an apparatus comprises a material including a non-layered mixture of an elastomeric polymer with a plurality of voids; and a plurality of conductive fillers disposed in the elastomeric polymer. The apparatus may produce an electrical response to deformation and, thus, function as a strain gauge. The conductive fillers may include conductive nanoparticles and/or conductive stabilizers. In another general aspect, a method of measuring compression strain includes detecting, along a first axis, an electrical response generated in response to an impact to a uniform composite material that includes conductive fillers and voids disposed throughout an elastomeric polymer, and determining a deformation of the impact based on the electrical response. The impact may be along a second axis different from the first axis.