Abstract: Provided is a system for detecting a poor weld in a welded portion of a battery module, the system including a battery module fixation unit fixing the battery module to be inspected, an inspection position movement unit moving the battery module fixation unit to a welding inspection position, a welding inspection unit including a frictional reaction force measurement unit inducing a slight movement of the welded portion of the battery module and measuring a frictional reaction force generated thereby and a vision inspection camera detecting an amount of change in a position of the welded portion of the battery module, and a control unit determining whether the welded portion of the battery module is poorly welded based on the frictional reaction force and the amount of position change, measured by the welding inspection unit.

Abstract: A uniaxial bidirectional synchronous control electromagnetic loaded dynamic shear test system and method, a test apparatus thereof including a support platform, a loading bar system, an electromagnetic pulse generation system, a servo-controlled normal pressure loading system, and a data monitoring and acquisition system. The test apparatus can be used to conduct a dynamic shear test research on a rock-like material under a constant normal pressure close to an actual operating condition, and can also be applied to carry out dynamic shear tests on intact rock-like test specimens in various sizes or jointed rock-like test specimens containing a single structural surface to study dynamic shear mechanical property and shear failure behavior under strain rate of 101?103 s?1, thereby providing an important theoretical and technical support for the design, construction, protection, and safety and stability evaluation of geotechnical engineering, structural engineering.

Abstract: A bond tester apparatus arranged for determining a strength of a bond and/or a material present on a base, said bond tester apparatus comprising a force measurement module for applying a shear force to said bond and/or said material, and a displacement module and a controller arranged for controlling the distance between the force measurement module and the displacement module such that the shear height of a shear tool can be set.

Abstract: Disclosed is a testing device for measuring interfacial shear properties between fibers and media, including a main body, which is a rectangular plate-like structure with L-shaped plates provided at the bottom ends of the main body, a connecting rod provided at a top right of the main body, a groove provided at the top of the main body; and four rotating grooves are provided inside the groove. The rotating grooves are cylindrical structures with raised centers at both ends; and a mounting piece is installed above the left end of the main body; a magnet of a displacement micrometer is connected to a tension trolley, a high-definition camera is turned on, weights are added into a loading bucket and the fiber movement is observed until the fiber is pulled out or sliding friction occurs, and then the camera is stopped and accurate data is tested.

Abstract: Disclosed are a testing device and a testing method for adhesive strength of an inner hole coating. A pull rod of the testing device for the adhesive strength of the inner hole coating may apply an axial tension to the inner hole coating via a guide ring and an assisting assembly, and may also apply radial pressure to the inner hole coating via a tapered surface and the assisting assembly. And the press rod may apply a radial tension to the inner hole coating via the pull hook and the assisting assembly. The testing method for the adhesive strength of the inner hole coating adopts the above-mentioned testing device for adhesive strength of an inner hole coating, a tensile adhesive strength test and a shear adhesive strength test may be performed on a same device.

Abstract: A weld coupon destructive test device includes a support base. A plunger is connected to the support base and is movable along a length of the support base by a handle mounted to rotate on a pivot base on the support base. A header on the support base has a guide surface configured to press a weld coupon between the guide surface and the head of the plunger. A guide shoe is configured to fit against the guide surface of the header, the curved guide shoe has a first face and a second face, the first face is curved to conform to the head on the plunger, and the second face is curved to conform to the curved guide surface of the header. The handle is operable in a slotted bar to break a weld coupon under pressure.

Abstract: An automatic and manual welding apparatus includes an operation changeover switch which is provided to be capable of switching a manual input mode for switching off power supplied to an infeed motor to and from an automatic input mode for applying power supplied to the infeed motor, so as to switch the rotation of the infeed motor automatically and manually. A control unit controls the infeed motor such that the power supplied to the forward and backward transfer motor is switched off when the input of the operation changeover switch is in a manual input mode and the power to the infeed motor is applied when the input of the operation changeover switch is in an automatic input mode.

Abstract: The present invention relates to a method for analyzing the length of sulfur crosslinking bonds in a vulcanized rubber using NMR spectrum. In some embodiments, the method comprises obtaining, independently, a carbon-13 nuclear magnetic resonance (13C NMR) spectrum of a standard substance, wherein the standard substance containing carbon atoms, and a 13C NMR spectrum of the vulcanized rubber, wherein the 13C NMR spectrum of the standard substance and the 13C NMR spectrum of the vulcanized rubber are obtained under the same conditions; obtaining, independently, free induction decay (FID) amplification values of characteristic peaks in the 13C NMR spectrum of the standard substance, and FID amplification values of characteristic peaks in the 13C NMR spectrum of the vulcanized rubber; and measuring the length of sulfur crosslinking bonds in the vulcanized rubber.

Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.

Abstract: Apparatus for testing adhesion of an adhesive tape to a bonding surface under an applied load includes a test surface of a predetermined configuration to which a test tape may be adhered, a clamping device for grasping a free edge of the test tape, a guide for constraining the clamping device to move linearly relative to the test surface, and an actuator arrangement for driving the clamping device along the guide at a selected speed and with a selected force to apply the force to the test tape. The actuator arrangement includes a first and second linear actuators operable to generate differing ranges of force values, a motor for driving the linear actuators, and a selector arrangement for connecting the motor alternately to the first and second linear actuators according to the selected force to be applied.

Abstract: An apparatus and method for determining the adhesive strength of a biofilm formed on an underwater optical surface and for determining the pressure, velocity and configuration of a water jet directed at the biofilm to wash away the biofilm and restore hydrophobicity to the optical surface, with a view to providing removal of such biofilms by underwater travel of a submarine without a need to surface for biofilm removal.

Abstract: A test fixture for determining circumferential shear properties of an arcuate test specimen may include an outer fixture and an inner fixture. The outer fixture may be coupled to an outer side of the test specimen, and may be rotatably mounted on a central pin and may include a rocker arm. The inner fixture may be coupled to an inner side of the test specimen, and may be rotatably mounted on the central pin and may include a load arm extending in a direction opposite the rocker arm. The inner fixture and the outer fixture may be configured such that application of a test load to the rocker arm and the load arm causes rotation thereof about the central pin producing circumferential movement of the inner side relative to the outer side and inducing a circumferential shear load in the test specimen.

Abstract: A cartridge suitable for use in a bond testing machine includes a plurality of a different test tools. A rotary mechanism is provided and each of the plurality of different test tools is mounted to the rotary mechanism angularly spaced from one another. A drive unit is coupled to the rotary mechanism and is configured to rotate the rotary mechanism to move each of the plurality of different test tools to and from a use position. An air interface receives compressed air from a corresponding air interface on a positioning assembly of the bond testing machine.

Abstract: Methods and systems to method to determine an adhesion force of an underfill material to a chip assembled in a flip-chip module are provided. A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate. The method also includes forming a block from the layer of underfill material. The method further includes measuring a force required to shear the block from a surface of the flip-chip module.

Abstract: A shearing force test device comprises a substrate mounted with an elastomer having a free end capable of moving toward or away from the substrate; the free end is connected with a test head; the elastomer is installed with two U-shaped elastic arms arranged at a distance and capable of mutually neutralizing horizontal position offsets; the free ends of the two U-shaped elastic arms are connected together; the test head is fixedly installed on the free end; the two U-shaped elastic arms are provided with the fixed end of the elastomer there between; the fixed ends of the two U-shaped elastic arms are connected together, and are fixedly connected with the substrate; and the other ends of the two U-shaped elastic arms away from the free ends are fixedly connected together via a connecting plate.

Abstract: Maximum allowable load values of a welded portion in respective fracture modes of a load fracture, a moment fracture, and a nugget interior fracture are found based on at least one of a sheet thickness t, a tensile strength TS, an elongation El, and a chemical composition of a nugget portion in each of spot-welded steel sheets, a nugget diameter d of a welded portion, an effective width B of the welded portion determined by a distance between adjacent welded portions, edges or ridge lines, and a sectional height H. Then, according to these fracture modes, an allowable load value at every moment after the maximum allowable load value of the welded portion is reached is found, and a displacement or a time at which the allowable load value becomes 0, that is, at which a complete fracture occurs is found, thereby finding a fracture limit.

Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate.

Abstract: The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterized in that it includes the combined application of a laser radiation and a plasma onto the coating initially covering the integrated circuit.

Abstract: A method for detecting the integrity of a bond of a multi-piece work piece includes capturing a first image of the work piece, stressing the work piece, capturing a stressed image of the work piece, and comparing the first image of the work piece with the stressed image of the work piece to determine the integrity of the bond.

Abstract: A binding force testing device for testing the binding force of a hinge, includes a control chassis for controlling the binding force testing device; a platform mounted on the control chassis; a support mounted on the control chassis above the platform; a first driving device mounted on the support; a main holder mounted on the first driving device facing the platform; and a second driving device mounted on the support and connected to the first driving device. The first driving device drives the main holder to move relative to the platform in a first direction; the second driving device drives the first driving device to move relative to the platform in a second direction perpendicular to the first direction.

Abstract: The different advantageous embodiments provide a method and apparatus for inspecting a structure. In one advantageous embodiment, an electromagnetic force is generated on a portion of a bond line for a plurality of parts in the structure. The structure contains a conductive material. A determination is made as to whether an inconsistency is present in the portion of the bond line after generating the electromagnetic force on the portion of the bond line.

Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.

Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.

Abstract: The disclosed embodiments concerns a traction pad to be bonded for coating adhesion or surface cohesion tests by tearing including a counterbore designed to control the thickness of the adhesive film. Support elements such as wedges or a border maintain the base of the counterbore at the required distance from the tested surface and openings are provided for evacuating the adhesive prior to its controlled hardening when the traction pad is applied on the tested surface.

Abstract: An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever positioned on the vertical drive, and a test head connected in a rotational manner with the cantilever. A frictionless calibration device for shear force testing comprises a base, two supporters positioned on the base, a shaft having two tapering ends positioned between the two supporters, and a calibration member fixed on the shaft, wherein the shaft and the calibration member contact the supporters in a rotational manner.

Abstract: A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.

Abstract: A tack adhesion testing device for quantitatively measuring tack adhesion between a material and an object with a planar surface for contact with the material. The device has a material mount for mounting a quantity of the material such that the quantity of material presents an exposed flat face, an object mount for securely holding the object such that the planar surface is in flat contact with the exposed flat surface, the material mount and the object mount being movable relative to each other, a contact force applicator for applying a known force urging the exposed flat face and the planar surface into contact and, separation mechanism for applying a variable force to the material mount and the object mount to slide the flat face and the planar surface relative to each other such that the variable force can be increased until the flat face and the planar surface slide relative to each other.

Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Abstract: A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.

Abstract: Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.

Abstract: In order to conduct tests designed to determine the adherence properties of a coating on a substrate, a pull plate of a hardenable material is molded directly to the surface of a coating applied to a substrate. The pull plate geometry is determined by the mold cavity and is made of a material that adheres to the coating surface during the molding process. The pull plate therefore, is only used once, while the mold may be reused.

Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Abstract: An apparatus for adhering coupons together for adhesive shear testing may include a first member, a second member, at least one alignment device, and at least one separation device. The first member may have at least one first member cavity for holding at least one first member coupon. The second member may have at least one second member cavity for holding an overlapping area of at least one second member coupon adjacent to and separate from the at least one first member coupon. The overlapping area of the at least one second member coupon may be adhered to the at least one first member coupon. The at least one alignment device may control a size of the overlapping area. The at least one separation device may control a separation distance between the overlapping area of the at least one second member coupon and the at least one first member coupon.

Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Abstract: An object of the present invention is to provide an adhesion inspection apparatus and method that can provide a reliable detection even for defect without the need of any complicated works, such as adjusting of an optical axis of instrument. An adhesion inspection apparatus 1 for inspecting adhesion of a package box 3 constructed with use of an adhesive, said apparatus characterized in that a vacuum pad 5 to be affixed for sucking on an outer surface of the package box 3 at an area proximal to an adhered region thereof; an inspection arm 9 carrying the vacuum pad 5 at one end thereof; a rotating shaft 11 joined to the other end of the inspection arm 9; a driving device 13 for driving the rotating shaft 11 to make a rotational movement; and a torque sensor 15 for detecting a torque induced in the driving device 13.

Abstract: A high speed ball shear machine is adapted for removing a metal bump fixed on a substrate. The high speed ball shear machine includes a fixing base, a shear tool, and a metal bump catcher. The substrate is fixed on the top surface of the fixing base. The shear tool is disposed above the top surface. The fixing base is adapted for being translated along a translation path relative to the shear tool, wherein the translation path is a straight path. When the fixing base translates along the path, the metal bump is driven to strike the shear tool so as to separate itself from the substrate. The metal bump catcher, which is adapted for catching the drop bump after the striking, is disposed on the side wall of the fixing base. The bump catcher has a fillister with a configuration depicted in the figures of this invention.

Abstract: The different advantageous embodiments provide a method and apparatus for inspecting a structure. In one advantageous embodiment, an electromagnetic force is generated on a portion of a bond line for a plurality of parts in the structure. The structure contains a conductive material. A determination is made as to whether an inconsistency is present in the portion of the bond line after generating the electromagnetic force on the portion of the bond line.

Abstract: A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool (18) having a tip (24) for contact with the deposit, and a back face having a piezo-electric crystal thereon. In use, the back face is subject to a compressive force, as well as other forces, and a corresponding electrical output from said crystal which is proportional to those forces. In one embodiment, the portion of the shear tool which contacts the deposit is offset rearwardly from the front face of the shear tool to improve the accuracy of the signal produced by the piezo-electric crystal. The apparatus is useful in testing the strength of bonds between deposits and substrates typically found in semiconductor devices.

Abstract: An apparatus for testing bonding strength of electrical connection comprises a platform including a two-axis drive, a device holder positioned on the two-axis drive and configured to receive an electronic device, a vertical drive positioned on the platform, a cantilever positioned on the vertical drive, and a test head connected in a rotational manner with the cantilever. A frictionless calibration device for shear force testing comprises a base, two supporters positioned on the base, a shaft having two tapering ends positioned between the two supporters, and a calibration member fixed on the shaft, wherein the shaft and the calibration member contact the supporters in a rotational manner.

Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.

Abstract: A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.

Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.

Abstract: The invention relates to a method for exposing an integrated circuit by ablating the polymer coating initially covering the integrated circuit, characterised in that it comprises the combined application of a laser radiation and a plasma onto the coating initially covering the integrated circuit.

Abstract: Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element (21) on which is provided a piezo electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Abstract: A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool (18) having a tip (24) for contact with the deposit, and a back face having a piezo-electric crystal thereon. In use, the back face is subject to a compressive force, as well as other forces, and a corresponding electrical output from said crystal which is proportional to those forces. In one embodiment, the portion of the shear tool which contacts the deposit is offset rearwardly from the front face of the shear tool to improve the accuracy of the signal produced by the piezo-electric crystal. The apparatus is useful in testing the strength of bonds between deposits and substrates typically found in semiconductor devices.

Abstract: An object of the present invention is to provide an adhesion inspection apparatus and method that can provide a reliable detection even for defect without the need of any complicated works, such as adjusting of an optical axis of instrument. An adhesion inspection apparatus 1 for inspecting adhesion of a package box 3 constructed with use of an adhesive, said apparatus characterized in that a vacuum pad 5 to be affixed for sucking on an outer surface of the package box 3 at an area proximal to an adhered region thereof; an inspection arm 9 carrying the vacuum pad 5 at one end thereof; a rotating shaft 11 joined to the other end of the inspection arm 9; a driving device 13 for driving the rotating shaft 11 to make a rotational movement; and a torque sensor 15 for detecting a torque induced in the driving device 13.

Abstract: A method for measuring a bonding force between a substrate (50) and a carbon nanotube array (40) formed thereon, wherein the carbon nanotube array includes a plurality of carbon nanotubes. A force gauge (1) including a cantilever (10), a flat-surface probe (20), a movement mechanism (60), and a force sensor (70) is provided. The probe is secured at one end of the cantilever. An adhesive layer (30) is formed on the flat surface of the probe. The probe is moved toward the substrate and is brought into bonding contact with the carbon nanotube array by the movement mechanism. The probe is pulled away from the substrate by the movement mechanism, causing the carbon nanotubes adhered thereto to separate from the substrate. The force at separation is detected by the force sensor, and that force can be converted into an average nanotube/substrate bonding force/strength.

Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.

Abstract: A rubber specimen-stretching jig including a jig body has a disk-shaped pedestal; a columnar rubber specimen-fitting support erected on the pedestal; and a columnar retaining ring-fitting support projected from an upper end surface of the rubber specimen-fitting support; and an annular retaining ring removably fixedly fitted around the retaining ring-fitting support. The jig body is inserted into the cylindrical rotor, with one or more stretched annular rubber specimens wound around the rubber specimen-fitting support of the jig body; and with an inner surface of the rotor fixedly pressed against an outer surface of the pedestal and that of the retaining ring and brought into contact with the annular rubber specimens, a solid NMR of each of the annular rubber specimens is measured while the stretched annular rubber specimens are being rotated at a high speed by interlocking the stretched annular rubber specimens to the rotor rotated at a high speed.