Abstract: Performance-enhancing, reduced-area metalization adhesion areas in force-sensing transducers are described.

Abstract: This invention describes fabrication procedures to construct MEMS devices, specifically band-pass filter resonators, in a manner compatible with current integrated circuit processing. The final devices are constructed of single-crystal silicon, eliminating the mechanical problems associated with using polycrystalline silicon or amorphous silicon. The final MEMS device lies below the silicon surface, allowing further processing of the integrated circuit, without any protruding structures. The MEMS device is about the size of a SRAM cell, and may be easily incorporated into existing integrated circuit chips. The natural frequency of the device may be altered with post-processing or electronically controlled using voltages and currents compatible with integrated circuits.

Abstract: To reduce the risk of breakage of the moving parts of an integrated microstructure during manufacture steps causing mechanical stresses to the moving parts, a temporary immobilization and support structure is formed, whereby a moving region of the microstructure is temporarily integral with the fixed region. The temporary structure is removed at the end of the assembly operations by non-mechanical removal methods. According to one solution, the temporary structure is formed by a fusible element removed by melting or evaporation, by applying a sufficient quantity of energy thereto. Alternatively, a structural region of polymer material is formed in the trench separating the moving part from the fixed part, or an adhesive material layer sensitive to ultraviolet radiation is applied.

Abstract: In a weighing cell a load receiver is constrained in a mode of planar translatory motion in relation to a stationary part (1). The stationary part (1), configured in the shape of a solid H-profile, has two side plates (3) to which the guide links of a parallelogram mechanism are attached. A base plate (2) connects the side plates (3) and supports the parts, that are required for transmitting a force to be measured from the load receiver to a measuring cell. The force-transmitting parts can be configured either as a monolithic material block or as individually assembled components. (FIG.

Abstract: A microelectric flow sensor including a deformable mechanical element is disclosed. The sensor includes a beam element mounted to a substrate. The beam element is anchored to the substrate on a first end, and deformed to a position normal to the surface of the substrate. An electrode is positioned on the substrate below a portion of the beam, such that when the beam is deflected, an electrical connection is established between the beam and the electrode. An alternate flow sensor includes a sensing beam surrounded by at least two cantilever beams which act as switches. The sensing beam is defined with two mechanically weak points which allow the sensing beam to be mechanically deformed to a new position approximately perpendicular to the cantilever beams and the top surface of the substrate. The substrate also includes electrodes which are positioned underneath the ends of the cantilever beams.