Copper(cu) Recovered Patents (Class 75/373)
-
Patent number: 11920215Abstract: Provided is a copper powder manufactured by means of a wet method, wherein the absolute value of the zeta potential of the copper powder is at least 20 mV. The copper powder can be manufactured so as to reduce the burden of the steps of crushing a dry cake and classification, and there is a sufficient reduction in residual secondary particles.Type: GrantFiled: July 24, 2019Date of Patent: March 5, 2024Assignee: JX Metals CorporationInventor: Hideki Furusawa
-
Patent number: 10870587Abstract: Provided is a photosintering composition including cuprous oxide particles containing at least one additive element selected from the group consisting of tin, manganese, vanadium, cerium and silver, and a solvent. It is preferable that the cuprous oxide particle contain 1 ppm to 30,000 ppm of tin as the additive element. It is also preferable that the photosintering composition contain 3% by mass to 80% by mass of the cuprous oxide particles and 20% by mass to 97% by mass of the solvent.Type: GrantFiled: November 2, 2017Date of Patent: December 22, 2020Assignee: NIPPON CHEMICAL INDUSTRIAL CO., LTD.Inventors: Mari Tokutake, Shinji Abe
-
Patent number: 10850330Abstract: A process for producing nickel powder capable of obtaining inexpensive, and also, high-performance nickel powder, even when using wet process. A process for producing nickel powder, including a crystallization step for obtaining nickel crystal powder by reductive reaction in reaction solution in which at least water-soluble nickel salt, metal salt of metal more noble than nickel, reducing agent, alkali hydroxide, amine compound, and water are mixed, wherein the reducing agent to be mixed in the crystallization step is hydrazine, the amine compound is autolysis inhibitor of hydrazine, and contains two or more primary amino groups in molecule, or contains one primary amino group and one or more secondary amino groups in molecule, and ratio of molar number of the amine compound with respect to molar number of nickel in the reaction solution is in a range of 0.01 mol % to 5 mol %.Type: GrantFiled: October 14, 2016Date of Patent: December 1, 2020Assignee: SUMITOMO METAL MINING CO., LTD.Inventors: Junji Ishii, Hiroyuki Tanaka, Shingo Murakami, Yuki Kumagai, Masaya Yukinobu, Yoshiaki Matsumura
-
Patent number: 10563080Abstract: Copper inks are provided that include a plurality of core-shell nanostructures, with each nanostructure including a copper core and a barrier metal shell, a diameter of less than about 500 nm, and a distinct boundary between the copper core and the barrier metal shell. Methods of forming a copper ink are further provided and include an initial step of synthesizing an amount of copper nanoparticles in an aqueous solution. An amount of a barrier metal is then added to the copper nanoparticles to form a dispersion of the barrier metal and the copper nanoparticles, and a reducing agent is subsequently added to the dispersion to produce a copper ink comprising core-shell nanostructures having a copper core and a barrier metal shell. Copper films are then formed by applying that copper ink to a substrate and sintering the copper ink.Type: GrantFiled: August 28, 2015Date of Patent: February 18, 2020Assignee: UNIVERSITY OF LOUISVILLE RESEARCH FOUNDATION, INC.Inventors: Theodore Druffel, Ruvini Dharmadasa, Menaka Jha, Delaina Amos
-
Patent number: 10220446Abstract: Provided is a method for producing fine nickel powder used as suitable seed crystals for producing nickel powder from a solution containing a nickel ammine sulfate complex. The method for producing nickel powder sequentially comprises: a mixing step of adding, to a solution containing a nickel ammine sulfate complex, an insoluble solid which is insoluble in the solution to form a mixed slurry; a reduction and precipitation step of charging a reaction vessel with the mixed slurry and then blowing hydrogen gas into the mixed slurry in the reaction vessel to reduce nickel complex ions contained in the mixed slurry to form nickel precipitate on a surface of the insoluble solid; and a separation step of separating the nickel precipitate on the surface of the insoluble solid from the surface of the insoluble solid to form nickel powder.Type: GrantFiled: February 17, 2015Date of Patent: March 5, 2019Assignee: Sumitomo Metal Mining Co., Ltd.Inventors: Kazumichi Yanagisawa, Junhao Zhang, Shin-ichi Heguri, Yoshitomo Ozaki, Kazuyuki Takaishi, Hideki Ohara, Tomoaki Yoneyama, Osamu Ikeda, Yohei Kudo
-
Patent number: 9339870Abstract: The present invention provides a method of manufacturing a phosphorus-doped nickel nanoparticle. The method includes the steps of: mixing a nickel solution including a nickel compound and a solvent, a seed particle, and a phosphorus-containing reductant in an arbitrary order to prepare a mixed solution; and adjusting pH of the mixed solution such that the mixed solution becomes acidic. According to the method, a phosphorus-doped nickel nanoparticle that is suitable to be applied to solar cell electrodes requiring low contact resistance can be manufactured.Type: GrantFiled: December 4, 2012Date of Patent: May 17, 2016Assignee: HANWHA CHEMICAL CORPORATIONInventors: Won Il Son, You-Jin Sim, Eui-Duk Kim
-
Patent number: 9067262Abstract: The present invention provides a novel process for synthesis of a copper-alloy particle with improved grain boundary properties. The process comprises the steps of: forming a solution from an alcoholic agent and a branched dispersing agent; forming a reaction mixture with the solution and a copper precursor and optionally a nickel precursor; heating the reaction mixture; cooling the reaction mixture; adding an additional amount of copper precursor and at least one precursor selected from the group consisting of: nickel, zinc, and bismuth; heating the reaction mixture; and maintaining the reaction mixture for a time sufficient to reduce the reaction mixture to copper-alloy particles.Type: GrantFiled: November 19, 2012Date of Patent: June 30, 2015Assignee: ENERGETIC MATERIALS LLCInventor: Joshua M. Deinzer
-
Publication number: 20150147584Abstract: Fibrous copper microparticles having a minor axis of 1 ?m or less and an aspect ratio of 10 or more, wherein the content of the copper particles having a minor axis of 0.3 ?m or more and an aspect ratio of 1.5 or less is 0.1 or less copper particle per one fibrous copper microparticle.Type: ApplicationFiled: June 11, 2013Publication date: May 28, 2015Applicant: UNITIKA LTD.Inventors: Munenori Yamada, Kou Takeuchi, Mutsumi Matsushita, Akira Shigeta, Masahiro Hosoda, Yoshiaki Echigo
-
Publication number: 20150118496Abstract: The present application provides a method for fabricating hollow metal nano particles and hollow metal nano particles fabricated by the same.Type: ApplicationFiled: January 9, 2015Publication date: April 30, 2015Inventors: Jun Yeon CHO, Sang Hoon KIM, Gyo Hyun HWANG, Kwanghyun KIM
-
Publication number: 20150098883Abstract: The present invention disclosed use of lactam as a solvent in the preparation of nanomaterials by precipitation method, sol-gel method or high temperature pyrolysis. These methods are able to recycle lactam solvent, which meet requirements of environmental protection.Type: ApplicationFiled: January 19, 2012Publication date: April 9, 2015Applicant: SHANGHAI GENIUS ADVANCED MATERIAL (GROUP) CO., LTD.Inventors: Housheng Xia, Guisheng Yang
-
Publication number: 20150024204Abstract: The present invention relates a process of preparing a nanopowder by using a natural source starting material wherein the nano powder is a nano metal or nano alloy or nano metal oxide or nano metal carbide or nano compound or nano composite or nanofluid. The nano product produced by the process has novel properties such as enhanced hardness, antibacterial properties, thermal properties, electrical properties, abrasive resistant, wear resistant, superior frictional properties, sliding wear resistance, enhanced tensile strength, compression strengths, enhanced load bearing capacity and corrosion properties.Type: ApplicationFiled: January 9, 2013Publication date: January 22, 2015Inventor: Sudhakara Sastry AMANCHI BALA
-
Patent number: 8764878Abstract: Claimed methods do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.Type: GrantFiled: February 12, 2013Date of Patent: July 1, 2014Inventor: David R. Whitcomb
-
Patent number: 8721763Abstract: A method for separating metal nanoparticles from colloidal metal solution includes providing a colloidal metal solution, including a plurality of metal nanoparticles; mixing a precipitating agent with the colloidal metal solution for maintaining the power of hydrogen value (pH) of the colloidal metal solution in a specific value; keeping the colloidal metal solution stationary for a static time at an environmental temperature such that the metal nanoparticle precipitates from the colloidal metal solution, and the colloidal metal solution forms a supernatant and a precipitating liquid; separating a precipitate from the precipitating liquid by a filtering process; and liquid blasting the precipitate by a first solvent to obtain the metal nanoparticles.Type: GrantFiled: August 1, 2012Date of Patent: May 13, 2014Assignee: Chung Shan Institute of Science and TechnologyInventors: Ming-Tseh Tsay, Seng-Min Chang
-
Patent number: 8535573Abstract: A method for producing copper fine particles by heating and reducing an oxide, hydroxide, or salt of copper included in a solution of ethylene glycol, diethylene glycol, or triethylene glycol, the method comprising controlling a total halogen content of the solution to be less than 20 ppm by mass relative to copper and adding a water-soluble polymer as a dispersant such as polyethyleneimine and a noble metal compound or noble metal colloid for nucleation to the solution. This method makes it possible to provide copper fine particles for use in a wiring material, which are very fine as small as 50 nm or less in average particle size and high dispersibility, extremely low undesirable halogen content, and can be sintered at a low temperature.Type: GrantFiled: October 31, 2008Date of Patent: September 17, 2013Assignee: Sumitomo Metal Mining Co., Ltd.Inventors: Kazuomi Ryoshi, Yasumasa Hattori, Hiroko Oshita
-
Publication number: 20130221287Abstract: A metal particle which is a non-nucleated, spherical porous material having continuous open pores, and which is formed from dendritic crystals which have grown uniformly outward from the center without requiring a nucleating agent. A method for producing a metal particle which includes the steps of: mixing a metal salt and a polycarboxylic acid in a liquid phase; adding a reducing agent to the resultant mixture to deposit metal particles; and drying the deposited metal particles. The metal particle produced by the method, which is a non-nucleated, spherical porous material having continuous open pores, is unlikely to suffer bonding or aggregation of the metal particles and exhibits excellent dispersibility, and, when the metal particle is used in a conductive composition, such as a conductive paste, a cured product having satisfactory conduction properties can be obtained at a relatively low temperature, making it possible to easily control the specific gravity or resistance.Type: ApplicationFiled: November 4, 2011Publication date: August 29, 2013Inventors: Tomoyuki Takahash, Akito Yoshii
-
Patent number: 8460428Abstract: In various embodiments, methods for synthesizing single-crystalline zero-valent metal nanorings, such as single-crystalline copper nanorings, are described herein. The methods include providing a solution containing a metal cation, a complexing agent bound to the metal cation, thereby forming a metal complex that is at least partially soluble in the solution, and a reducing agent operable for reducing the metal complex to a zero-valent metal and then heating the solution for a sufficient time and at a sufficient temperature until zero-valent metal nanorings form. The solution may be an aqueous solution in an embodiment. Single-crystalline metal nanorings produced by the methods described herein may have a diameter less than about 100 ?m and a wall thickness between about 10 nm and about 500 nm.Type: GrantFiled: April 30, 2010Date of Patent: June 11, 2013Assignee: William Marsh Rice UniversityInventors: Jun Lou, Yongjie Zhan
-
Patent number: 8398740Abstract: The invention relates to a method for leaching a material containing a valuable metal and precipitating the valuable metal as a fine-grained powder by changing the electrochemical potential of an intermediary metal in the solution. In the leaching stage the intermediary metal or substance of the electrolyte solution is at a high degree of oxidation and in the precipitation stage another electrolyte solution is routed into the solution, in which the intermediary metal or substance is at a low degree of oxidation. After the precipitation stage the solution containing the intermediary is routed to electrolytic regeneration, in which part of the intermediary is oxidised in the anode space back to a high potential value and part is reduced in the cathode space to its low value.Type: GrantFiled: August 9, 2007Date of Patent: March 19, 2013Assignee: Outotec OyjInventors: Seppo Heimala, Mikko Ruonala
-
Patent number: 8313551Abstract: The present invention provides a novel process for synthesis of a copper-alloy particle with improved grain boundary properties. The process comprises the steps of: forming a solution from an alcoholic agent and a branched dispersing agent; forming a reaction mixture with the solution and a copper precursor and optionally a nickel precursor; heating the reaction mixture; cooling the reaction mixture; adding an additional amount of copper precursor and at least one precursor selected from the group consisting of: nickel, zinc, and bismuth; heating the reaction mixture; and maintaining the reaction mixture for a time sufficient to reduce the reaction mixture to copper-alloy particles.Type: GrantFiled: March 17, 2010Date of Patent: November 20, 2012Assignee: Energetic Materials LLCInventor: Joshua M. Deinzer
-
Patent number: 8308842Abstract: Pyrophoric nanoparticles and methods of producing the same are provided herein. An exemplary method of producing pyrophoric nanoparticles can include providing a first aqueous solution comprising at least one metal salt and an aliphatic polyether; providing a second solution comprising a metal hydride reducing agent; continuously combining the first and second solutions to produce nanoparticles in a liquid phase; separating the nanoparticles from the liquid phase; and drying the nanoparticles to form pyrophoric nanoparticles. The pyrophoric nanoparticles can have a diameter ranging from about 1 nm to about 50 nm.Type: GrantFiled: December 8, 2010Date of Patent: November 13, 2012Assignee: Xerox CorporationInventors: Kimberly D. Nosella, Santiago Faucher, Ke Zhou, Paul J. Gerroir, Richard P. N. Veregin, Karen A. Moffat
-
Patent number: 8236089Abstract: A preparation method of a copper particle composition includes dissolving a copper carboxyl compound, or a carboxyl group-containing compound and a copper salt, in a solvent to prepare a copper(II) precursor solution; putting a weak reducing agent with a standard reduction potential of ?0.2 to ?0.05V to the prepared copper(II) precursor solution to assemble a plurality of Cu2O fine particles having an average diameter of 1 to 100 nm with a standard deviation of 0 to 10%, thereby forming spherical Cu2O assembly particles having an average diameter of 0.1 to 10 ?m with a standard deviation of 0 to 40%; reducing the spherical Cu2O assembly particles into copper particles by using a reducing agent; and separating the copper particles from the result product. Thus, copper particles can be produced fast, economically, and the obtained copper particles have good crystallinity and good resistance against oxidation.Type: GrantFiled: July 24, 2008Date of Patent: August 7, 2012Assignee: LG Chem, Ltd.Inventors: Woo-Ram Lee, Sang-Ho Kim, Sung-Ho Yoon
-
Patent number: 8216340Abstract: Dispersed, crystalline, stable to oxidation copper particles are prepared in the absence of polymeric dispersants by rapidly reducing a Cu(I) salt with an Fe(II) carboxylic acid complex in water. The resulting microns sized copper powders contain only organics which decompose at temperatures low enough not to interfere with sintering processes and the formation of conductive copper structures.Type: GrantFiled: March 3, 2009Date of Patent: July 10, 2012Assignees: E. I. du Pont de Nemours and CompanyInventors: Daniel V. Goia, Ionel Halaciuga, Sylas LaPlante, Howard David Glicksman
-
Patent number: 8211205Abstract: A method for the synthesis and manufacture of metal nanoparticles using metal inorganic salts. The method is simple and uses inexpensive chemicals. The procedure produces nanometals in 100% yields. Method is scalable and produces nanoparticles in unlimited quantities. In this method, a metal inorganic salt is dissolved in a reaction medium, comprised of a solvent and organic amine to create a metal/amine complex. A reducing agent, comprised of a solvent and Sodium Borohydride (NaBH4), is then mixed with the metal/amine complex through titration or through a continuous flow process. The resulting nanoparticles are then precipitated through the addition of methanol and centrifugation and decanted. The decanted nanoparticles can then be suspended in a solvent for storage.Type: GrantFiled: July 28, 2009Date of Patent: July 3, 2012Assignee: UT Dots, Inc.Inventors: Yuri Trofimovich Didenko, Yuhua Ni
-
Patent number: 7998239Abstract: A method of forming stable nanoparticles comprising substantially uniform alloys of metals. A high dose of ionizing radiation is used to generate high concentrations of solvated electrons and optionally radical reducing species that rapidly reduce a mixture of metal ion source species to form alloy nanoparticles. The method can make uniform alloy nanoparticles from normally immiscible metals by overcoming the thermodynamic limitations that would preferentially produce core-shell nanoparticles.Type: GrantFiled: November 18, 2009Date of Patent: August 16, 2011Assignee: Sandia CorporationInventors: Tina M. Nenoff, Dana A. Powers, Zhenyuan Zhang
-
Patent number: 7988761Abstract: The present invention relates to a method for manufacturing metal nanoparticles containing rod-shaped nanoparticles, the method including: producing metal oxide nanoparticle intermediates having at least rod-shaped metal oxide nanoparticles by heating a mixture of a nonpolar solvent, a metal precursor and an amine including secondary amine at 60-300° C.; producing metal nanoparticles by adding a capping molecule and a reducing agent to the mixture and heating the result mixture at 90-150° C.; and recovering the metal nanoparticles. According to the present invention, the shape of metal nanoparticle can be controlled by mixing primary amines or secondary amines as proper ratio without using apparatus additionally, as well as, the size of metal nanoparticle can be controlled to several nm.Type: GrantFiled: November 28, 2007Date of Patent: August 2, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Ho Jun, Jae-Woo Joung
-
Publication number: 20110110723Abstract: The present invention relates to methods of making and using and compositions of metal nanoparticles formed by green chemistry synthetic techniques. For example, the present invention relates to metal nanoparticles formed with solutions of fruit extracts and use of these metal nanoparticles in removing contaminants from soil and groundwater and other contaminated sites.Type: ApplicationFiled: September 29, 2010Publication date: May 12, 2011Applicant: VeruTEK Technologies, Inc.Inventors: Rajender S. Varma, Babita Baruwati, George E. Hoag, John B. Collins
-
Patent number: 7935169Abstract: The present invention relates to an apparatus and a method of manufacturing metal nanoparticles, and more particularly to an apparatus including: a precursor supplying part which supplies a precursor solution of metal nanoparticles; a first heating part which is connected with the precursor supplying part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where any particle is not produced; a second heating part which is connected with the first heating part, includes a reactor channel having a diameter of 1 to 50 mm, and is heated to the temperature range where particles are produced; and a cooler which is connected with the second heating part and collects and cools metal nanoparticles produced at the second heating part which allows continuous mass production of metal nanoparticles.Type: GrantFiled: May 7, 2008Date of Patent: May 3, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Il Lee, Jae-Woo Joung, Byung-Ho Jun, Joon-Rak Choi, Kwi-Jong Lee
-
Patent number: 7935170Abstract: The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C. According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.Type: GrantFiled: November 28, 2007Date of Patent: May 3, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Ho Jun, Jae-Woo Joung, Joon-Rak Choi
-
Patent number: 7909908Abstract: A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 ?m and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.Type: GrantFiled: October 17, 2008Date of Patent: March 22, 2011Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Tomoya Yamada, Koji Hirata
-
Patent number: 7867316Abstract: The present invention relates to a method for manufacturing metal nanoparticles including: preparing a first solution including a metal precursor and a non-polar solvent; preparing a second solution with adding a capping molecule presented by the following Formula 1 into the first solution; and stirring the second solution with applying heat, wherein R1 and R2 are independently —COOH, —NH2 or —CH3 but R1 and R2 cannot be —COOH at the same time, and x and y is independently an integer from 3 to 20 respectively and x+y is 20 to 40.Type: GrantFiled: April 14, 2008Date of Patent: January 11, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Ho Jun, Dong-Hoon Kim, Kwi-Jong Lee
-
Patent number: 7858025Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.Type: GrantFiled: August 24, 2007Date of Patent: December 28, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Young-Soo Oh, Jae-Woo Joung
-
Patent number: 7846233Abstract: A method of leaching copper from copper sulphide-containing concentrates, such as chalcopyrite, includes using pyrite as a catalyst for ferric reduction in order to eliminate passivation of the chalcopyrite surface, the process being carried out under conditions whereby the pyrite is not materially oxidized, for example by maintaining the operating solution potential at a suitable level. The leaching is carried out in an acidic sulphate medium and may include oxidation by oxygen-containing gas. The leached copper is then recovered, for example by solvent extraction and electrowinning. The leaching process can result in the virtually complete extraction of copper at atmospheric pressure in as little as four hours.Type: GrantFiled: June 1, 2005Date of Patent: December 7, 2010Assignee: The University of British ColumbiaInventors: David G. Dixon, Alain F. Tshilombo
-
Patent number: 7828872Abstract: There is provided a process comprising mixing a divalent copper oxide with a reducing agent in the presence of a complexing agent and a protective colloid in a liquid medium to thereby produce copper microparticles without formation of a univalent copper oxide from the divalent copper oxide. Further, there is provided a process comprising reducing a divalent copper oxide in the presence of a complexing agent and a protective colloid, such as a protein, to thereby form metallic copper microparticles, adding a protective colloid scavenger, such as a protease, to thereby remove the protective colloid and effect agglomeration of metallic copper microparticles, and filtering the mixture by means of a pressure filter, a vacuum filter, a suction filter, etc.Type: GrantFiled: August 18, 2005Date of Patent: November 9, 2010Assignee: Ishihara Sangyo Kaisha, Ltd.Inventors: Masanori Tomonari, Masatoshi Honma, Yoshiyuki Kunifusa
-
Publication number: 20100224027Abstract: Dispersed, crystalline, stable to oxidation copper particles are prepared in the absence of polymeric dispersants by rapidly reducing a Cu(I) salt with an Fe(II) carboxylic acid complex in water. The resulting microns sized copper powders contain only organics which decompose at temperatures low enough not to interfere with sintering processes and the formation of conductive copper structures.Type: ApplicationFiled: March 3, 2009Publication date: September 9, 2010Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Daniel V. Goia, Ionel Halaciuga, Sylas Laplante, Howard David Glicksman
-
Patent number: 7789935Abstract: A method of forming an ink, including photochemically producing stabilized metallic nanoparticles and formulating the nanoparticles into an ink.Type: GrantFiled: May 23, 2008Date of Patent: September 7, 2010Assignee: Xerox CorporationInventors: Michelle N. Chretien, Naveen Chopra, Matthew Heuft, Peter M. Kazmaier
-
Patent number: 7785392Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.Type: GrantFiled: May 15, 2007Date of Patent: August 31, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Keun Shim, Jae-Woo Joung
-
Publication number: 20100180727Abstract: The invention relates to a method for leaching a material containing a valuable metal and precipitating the valuable metal as a fine-grained powder by changing the electrochemical potential of an intermediary metal in the solution. In the leaching stage the intermediary metal or substance of the electrolyte solution is at a high degree of oxidation and in the precipitation stage another electrolyte solution is routed into the solution, in which the intermediary metal or substance is at a low degree of oxidation. After the precipitation stage the solution containing the intermediary is routed to electrolytic regeneration, in which part of the intermediary is oxidised in the anode space back to a high potential value and part is reduced in the cathode space to its low value.Type: ApplicationFiled: August 9, 2007Publication date: July 22, 2010Applicant: OUTOTEC OYJInventors: Seppo Heimala, Mikko Ruonala
-
Patent number: 7749300Abstract: A method of forming bimetallic core-shell metal nanoparticles including a core of a first metal material and a shell of a second metal material, the method including photochemically producing metallic nanoparticle cores of the first metal material, and forming a shell of the second metal material around the cores. The shell can be formed by adding shell-forming precursor materials to a solution or suspension of the cores and photochemically forming the shells around the cores, or by separately photochemically producing metallic nanoparticles of the second metal material and mixing the metallic nanoparticles of the second metal material and the metallic nanoparticle cores to cause the metallic nanoparticles of the second metal material to form a shell around the metallic nanoparticle cores.Type: GrantFiled: June 5, 2008Date of Patent: July 6, 2010Assignee: Xerox CorporationInventors: Michelle N. Chretien, Yiliang Wu, Naveen Chopra
-
Publication number: 20090288517Abstract: A method of forming an ink, including photochemically producing stabilized metallic nanoparticles and formulating the nanoparticles into an ink.Type: ApplicationFiled: May 23, 2008Publication date: November 26, 2009Applicant: XEROX CORPORATIONInventors: Michelle N. CHRETIEN, Naveen CHOPRA, Matthew HEUFT, Peter M. KAZMAIER
-
Patent number: 7566357Abstract: Methods for producing finely divided copper or copper alloy powders are described, from compositions containing metal ions and an alkanolamine, preferably monoethanolamine, wherein the alkanolamine acts as a primary reducing agent. In preferred embodiments the methods for producing micron and submicron copper powder utilize precursor compositions containing copper ions in the form of submicron particles of copper carbonate, copper hydroxide, copper oxides, or any combination thereof, and utilize monoethanolamine (or optionally but less preferably hydrazine), and preferably additionally containing caustic and a reducing sugar.Type: GrantFiled: March 14, 2007Date of Patent: July 28, 2009Assignee: Phibro Wood, LLCInventor: Gang Zhao
-
Patent number: 7534283Abstract: A method of producing copper powder is provided that uses electrolytic cuprous oxide as the starting material for the production of copper powder suitable for a conductive filler whose particles have an average particle diameter of not greater than 1 ?m or even not greater than 0.5 ?m and are of uniform size. In one aspect, the method comprises a step of mixing cuprous oxide with a reducing agent in a liquor in which a protective colloid is present and to which a water-soluble copper salt has been added and in another aspect comprises a step of reducing a water-soluble copper salt in a liquor in which a protective colloid is present, thereby forming a slurry, and a step of reducing cuprous oxide in the presence of the slurry. As the water-soluble copper salt can be used, for example, 0.1-20 moles of a monovalent copper salt such as cuprous chloride per 100 moles of the cuprous oxide. As the protective colloid can be used 1-40 parts by mass of a water-soluble polymer per 100 parts by mass of the cuprous oxide.Type: GrantFiled: March 17, 2006Date of Patent: May 19, 2009Assignee: Dowa Electronics Materials., Ltd.Inventors: Tomoya Yamada, Koji Hirata
-
Patent number: 7517382Abstract: A process for producing sub-micron-sized copper powder comprising the steps of: providing a precursor composition comprising a solution of copper monoethanolamine complex; and heating the precursor composition to a temperature wherein copper monoethanolamine complex is converted to copper powder. A process for producing nickel powder comprising the steps of: providing a precursor composition comprising a solution of nickel monoethanolamine complex; and heating the precursor composition to a temperature wherein nickel monoethanolamine complex is converted to nickel powder.Type: GrantFiled: January 31, 2006Date of Patent: April 14, 2009Inventors: Gang Zhao, Michael P. Pompeo
-
Patent number: 7422620Abstract: The present invention provides a process for producing copper nanoparticles, comprising steps of: a) reacting an aqueous solution containing a reductant with an aqueous solution of a copper salt while stirring for 1-8 min, wherein the reductant being one or more selected from a group consisting of hydrazine hydrate, sodium borohydride and sodium hypophosphite; b) adding an apolar organic solution containing the extracting agent and continuing the stirring for 0.5-1.5 hrs, said extracting agent being one or more selected from the group consisting of alkyl dithiocarbonic acid and salts thereof, O,O?-dialkyl dithiophosphoric acid and salts thereof, and dialkylamino dithioformic acid and salts and said apolar organic solution being one selected from the group consisting of benzene, toluene and straight or branched alkanes having 6-12 carbon atoms, wherein the alkyl having 6-20 carbon atoms; and c) post-treating the reaction product to obtain copper nanoparticles.Type: GrantFiled: November 23, 2004Date of Patent: September 9, 2008Assignee: Lanzhou Institute of of Chemical PhysicsInventors: Weimin Liu, Xiaobo Wang, Singgou Fu
-
Publication number: 20080159902Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.Type: ApplicationFiled: August 24, 2007Publication date: July 3, 2008Inventors: In-Keun SHIM, Young-Soo Oh, Jae-Woo Joung
-
Publication number: 20070180954Abstract: The present invention relates to copper nano-particles having controlled particle size, high monodispersity, and oxidation stability, a method of preparing the copper nano-particles, and a method of forming a copper coating film using the copper nano-particles. The present invention provides a method of preparing copper nano-particles, comprising mixing a copper salt solution with a mixture of a reducing agent and a solvent; where the copper salt solution is added to the mixture at a temperature of 300° C. or less so that the copper salt solution can react with the mixture. It is thus possible to obtain copper nano-particles with controlled particle size and monodispersity by inducing uniform nucleation and nucleus growth through control of the reaction rate and/or the amount of copper ions during synthesis of the copper nano-particles.Type: ApplicationFiled: December 5, 2006Publication date: August 9, 2007Applicants: SAMSUNG ELECTRONICS, CO. LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jang Sub KIM, Joo Ho MOON, Sun Ho JEONG, Dong Jo KIM, Bong Kyun PARK
-
Patent number: 7235119Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.Type: GrantFiled: March 21, 2005Date of Patent: June 26, 2007Assignee: Dowa Mining Co., Ltd.Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
-
Patent number: 7041151Abstract: An electrochemical displacement-deposition method for making composite metal powders is described. The method is carried out by combining tungsten or molybdenum metal particles with particles of silver oxide or copper oxide in an aqueous hydroxide solution. Heat is applied to the solution to cause the oxide particles to convert to silver or copper metal particles which are substantially adhered to the refractory metal particles. Unlike conventional methods, it is not necessary to heat the oxide powders to a very high temperature in a reducing atmosphere in order to form the composite metal powder.Type: GrantFiled: January 20, 2004Date of Patent: May 9, 2006Assignee: Osram Sylvania Inc.Inventors: Raj Pal Singh Gaur, Scott A. Braymiller, Thomas A. Wolfe, Michael R. Pierce, David L. Houck
-
Patent number: 6929675Abstract: A method for providing an anhydrous route for the synthesis of amine capped coinage-metal (copper, silver, and gold) nanoparticles (NPs) using the coinage-metal mesityl (mesityl=C6H2(CH3)3-2,4,6) derivatives. In this method, a solution of (Cu(C6H2(CH3)3)5, (Ag(C6H2(CH3)3)4, or (Au(C6H2(CH3)3)5 is dissolved in a coordinating solvent, such as a primary, secondary, or tertiary amine; primary, secondary, or tertiary phosphine, or alkyl thiol, to produce a mesityl precursor solution. This solution is subsequently injected into an organic solvent that is heated to a temperature greater than approximately 100° C. After washing with an organic solvent, such as an alcohol (including methanol, ethanol, propanol, and higher molecular-weight alcohols), oxide free coinage NP are prepared that could be extracted with a solvent, such as an aromatic solvent (including, for example, toluene, benzene, and pyridine) or an alkane (including, for example, pentane, hexane, and heptane).Type: GrantFiled: April 24, 2003Date of Patent: August 16, 2005Assignee: Sandia CorporationInventors: Scott D. Bunge, Timothy J. Boyle
-
Patent number: 6887297Abstract: The invention relates to methods of making monodisperse nanocrystals comprising the steps of reducing a copper salt with a reducing agent, providing a passivating agent comprising a nitrogen and/or an oxygen donating moitey and isolating the copper nanocrystals. Moreover, the invention relates to methods for making a copper film comprising the steps of applying a solvent comprising copper nanocrystals onto a substrate and heating the substrate to form a film of continuous bulk copper from said nanocrystals. Finally, the invention also relates to methods for filling a feature on a substrate with copper comprising the steps of applying a solvent comprising copper nanocrystals onto the featured substrate and heating the substrate to fill the feature by forming continuous bulk copper in the feature.Type: GrantFiled: November 8, 2002Date of Patent: May 3, 2005Assignee: Wayne State UniversityInventors: Charles H. Winter, Zhengkun Yu, Charles L. Dezelah, IV
-
Patent number: 6881240Abstract: When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.Type: GrantFiled: December 16, 2002Date of Patent: April 19, 2005Assignee: Dowa Mining Co., Ltd.Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi
-
Patent number: 6858318Abstract: A nanowire comprising only metal having an average length of 1 ?m or more which could not be produced in the prior art, and a method of manufacturing this wire. This invention provides a method of manufacturing a metal nanowire, which comprises the step of reducing a nanofiber comprising a metal complex peptide lipid formed from the two-headed peptide lipid represented by the general formula (I): in which Val is a valine residue, m is 1-3 and n is 6-18, and a metal ion, using 5-10 equivalents of a reducing agent relative to the two-headed peptide lipid. It further provides a metal nanowire having an average diameter of 10-20 nm and average length of 1 ?m or more. It is preferred that the metal is copper.Type: GrantFiled: September 17, 2001Date of Patent: February 22, 2005Assignees: Japan Science and Technology Corporation, National Institute of Advanced Industrial Science and TechnologyInventors: Masaki Kogiso, Toshimi Shimizu