Abstract: The present invention relates to a method for manufacturing a nano-scaled copper powder by a wet reduction process, comprising adding appropriate amounts of sodium hydroxide (NaOH) and hydrazine (N2H4) to an aqueous copper chloride (CuCl2) solution to finally obtain a copper powder having a particle size of 100 nm (0.1 nm) grade via an intermediate product such as a copper complex.

Abstract: Nanostructured metallic powders and coatings are processed by suspending a metal precursor in a glycol solution containing the constituent metal salts and using a millimeter wave beam as the heating source. The mixture is then heated to reduce the metal precursor to a metal precipitate. The precipitated metal may then be isolated.

Abstract: Ultrafine composite metal particles comprising a surfactant sheath and an organic compound sheath that surround a metal core in which metal atoms obtained by reduction precipitation from an organic metal compound have agglomerated, the particle diameter being 1 to 100 nm. The ultrafine composite metal particle may comprise a surfactant sheath that surrounds a metal core in which metal atoms obtained by reduction precipitation from an inorganic metal compound have agglomerated. The ultrafine composite metal particles are obtained by forming an ultrafine particle precursor by producing a colloidal solution of an organic metal compound or an inorganic metal compound in a nonaqueous solvent using a surfactant, and by reducing the ultrafine particle precursor by adding a reducing agent to this colloidal solution, thus forming ultrafine composite metal particles with a diameter of 1 to 100 nm and having at least a surfactant sheath around a metal cored.

Abstract: A process for forming metal nanocrystals involves complexing a metal ion and an organic ligand in a solvent and introducing a reducing agent to reduce a plurality of metal ions to form the metal nanocrystals associated with the organic ligand. The nanocrystals are optionally doped or alloyed with other metals.

Abstract: A metal powder is formed by the steps of preparing a reducing agent solution, preparing a mixed metallic salt solution by dissolving a nickel salt and a copper salt in a solvent, and mixing the reducing agent solution and the mixed metallic salt solution so that the copper salt is reduced to precipitate copper particle nuclei and then the nickel salt is reduced to precipitate nickel around the copper particle nuclei. A metal power produced by this production method, a conductive paste containing the metal powder and a monolithic ceramic electronic component in which internal electrodes are formed using the conductive paste are also disclosed.

Abstract: A metal powder is formed by the steps of preparing a reducing agent solution, preparing a mixed metallic salt solution by dissolving a nickel salt and a copper salt in a solvent, and mixing the reducing agent solution and the mixed metallic salt solution so that the copper salt is reduced to precipitate copper particle nuclei and then the nickel salt is reduced to precipitate nickel around the copper particle nuclei. A metal power produced by this production method, a conductive paste containing the metal powder and a monolithic ceramic electronic component in which internal electrodes are formed using the conductive paste are also disclosed.

Abstract: When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.

Abstract: A process is described for the production of metal powder and alloy powders containing at least one of the metals iron, copper, tin, cobalt or nickel, by mixing aqueous metal salt solutions with an aqueous carboxylic acid solution, separating the precipitation product from the mother liquor and reducing the precipitation product to the metal.

Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 &mgr;m to less than 1.5 &mgr;m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C.

Abstract: Provided is a method for manufacturing a metal powder by providing a reducing solution by dispersing caustic alkali, and hydrazine and/or hydrazine hydrate into a solvent; providing a metal salt solution comprising a salt of electroconductive metal, a rare earth metal salt and a solvent; and mixing the reducing solution with the metal salt solution to form a metal powder by depositing a hydroxide derived from the rare earth metal salt and by reducing the salt of electroconductive metal. With this metal powder manufacturing method, the sintering of the metal powder is restricted at a low temperature, the sintering initiation temperature is shifted to a higher level, and rapid sintering shrinkage is restricted, while ceramic grain growth is not accelerated.

Abstract: The invention concerns ultrafine polymetallic particles obtained from reducing a mixture of salts dissolved in an organic solvent by an alkali or alkaline earth metal hydride, at a temperature not higher than the solvent reflux temperature, the mixture of dissolved salts comprising at least a salt of a metal having a standard oxidant potential E°Mn+/M at 25° C. higher than −1.18 V. The invention is applicable to the hydrogenation of olefins and the coupling of halogenated aromatic derivatives.

Abstract: Copper fine powder has an electrical resistance in its powdery state of not more than 1×10−3 &OHgr;·cm; a BET specific surface area ranging from 0.15 to 0.3 m2/g; a tap density of not less than 4.5 g/cc; a product of the tap density and the particle size, of not less than 13, the particle size being calculated from the specific surface area and; a particle size distribution observed in the microtrack measurement as expressed in terms of D50 and D90 ranging from 4 to 7 &mgr;m and 9 to 11 &mgr;m, respectively; and a weight loss through hydrogen-reduction of not more than 0.30%. The copper fine powder is prepared by adding an alkali hydroxide to an aqueous copper salt solution containing divalent copper ions maintained at not less than 55° C. in an amount of not less than the chemical equivalent to form cupric oxide; then gradually adding a reducing sugar to the reaction system while maintaining the temperature of the system to not less than 55° C.

Abstract: A metal powder is formed by the steps of preparing a reducing agent solution, preparing a mixed metallic salt solution by dissolving a nickel salt and a copper salt in a solvent, and mixing the reducing agent solution and the mixed metallic salt solution so that the copper salt is reduced to precipitate copper particle nuclei and then the nickel salt is reduced to precipitate nickel around the copper particle nuclei. A metal power produced by this production method, a conductive paste containing the metal powder and a monolithic ceramic electronic component in which internal electrodes are formed using the conductive paste are also disclosed.

Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 &mgr;m to less than 1.5 &mgr;m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C.

Abstract: A process for manufacturing of metal powder from a halogen containing chemical compound of the metal. The process involves thermal treatment of the compound within a closed reactor and in non-oxidizing atmosphere so as to induce decomposition of the compound and formation therefrom of a metal halide and a reduction agent capable to reduce the metal halide to elemental metal which can be collected in the form of fine powder. By variation of condition of the thermal treatment like temperature, pressure, duration and by choosing particular type of the compound it is possible to control the size and purity of the powder as well the powder particles shape.

Abstract: X-ray amorphous and nanocrystalline elemental metal powders of groups IB to VIIIB of the Periodic Table are prepared by reacting halides of these metals with alkali metal hydrides or alkaline earth metal hydrides in an organic solvent with continual milling.

Abstract: Metal copper powder having excellent dispersibility and small particle diameter deviation is manufactured by adding a reducing agent into a solution containing a copper compound and a dispersion agent to precipitate metal copper powder. The solution may further include ammonia so that copper ammonia complex ions exist in the solution. The dispersion agent is either a phosphate such as pyrophosphate, tripolyphosphate, tetrapolyphosphate, metaphosphate and hexametaphosphate or a water-soluble polymer such as naphthalenesulfonate formaldehyde polycondensate, polyvinyl alcohol, carboxymethylcellulose salts, arabic gum, adipate and polycarboxylate.

Abstract: Nanostructured metal powders and films are made by dissolving or wetting a metal precursor in an alcoholic solvent. The resulting mixture is then heated to reduce the metal precursor to a metal precipitate. The precipitated metal may be isolated, for example, by filtration.

Abstract: A method for stably producing a copper powder having a low degree of oxidation comprises generating copper hydroxide by adding an alkali to an aqueous solution containing copper ions, and reducing the copper hydroxide to obtain copper powder as a precipitate by adding hydrazine or a hydrazine compound to the aqueous solution until the aqueous solution yield a pH value in a range of from about 7 to 9.

Abstract: The copper powder contains at least one substance, which is not soluble in copper, e.g. Al.sub.2 O.sub.3, TiO.sub.2, SiO.sub.2 or B.sub.2 O.sub.3. For the production of this copper powder, a surplus of copper metal granulate is mixed with an ammonium salt and/or ammonium hydroxide, together with a saline solution in an aqueous solution, while a gas containing oxygen is added, and at a pH-value of at least 4. A copper-containing precipitate is produced, which is separated and treated at a temperature in the range from 150.degree. to 500.degree. C. in a reducing atmosphere. During this process, Cu(OH).sub.2 and Cu-oxide are transformed into metallic copper powder, which contains the dispersoid. The dispersoid content of the copper powder is preferably in the range from 0.1 to 5% by weight.

Abstract: Oxidation resistant particles composed of copper and at least one metal hng a valence of +2 or +3 and having an intermediate lattice energy for the metal in its hydroxide form. The metal is selected from nickel, cobalt, iron, manganese, cadmium, zinc, tin, magnesium, calcium and chromium. In one embodiment, the phases of copper and at least one metal in the particles are separate and the concentration of the metal is greater near the surface of the particles than inwardly thereof. Process for making the oxidation resistant copper particles includes the steps of dissolving a copper salt and a salt of at least one of the metals in a suitable solvent or diluent; forming primary particles of copper and at least one metal in basic form by mixing a base and the salt solution; separating, washing and drying the primary particles; reducing the primary particles to metallic form; and heat treating the particles in metallic form at an elevated temperature.

Abstract: Finely divided copper powder suitable for the preparation of copper catalyst for the synthesis of methylchlorosilane is prepared by adding an aqueous copper salt solution to an aqueous suspension of iron powder. Copper salt solutions obtained as process residues from the synthesis of methylchlorosilane can be used in the process of this invention.

Abstract: A novel method is proposed for concurrently producing a metallic copper powder and a valuable chloride of a metal other than copper, e.g., manganese, zinc, cobalt, nickel and tin, from a depleted aqueous etching solution containing copper (II) chloride as discharged from the etching process in the manufacture of copper-foiled printed circuit boards. The inventive method also contributes to solve the problem for the disposal of such a waste solution without causing the troubles in connection with environmental pollution. The inventive method comprises the steps of: treating the waste solution with an active carbon so as to remove organic impurities; admixing the solution with a powder, granules or flakes of the above mentioned metal so as to precipitate the copper value in the metallic form, instead, giving an aqueous solution of the chloride of the added metal; and separating the copper metal powder and the chloride solution.

Abstract: The invention relates to a method for producing metal powders, where the employed raw materials are metal ions in a liquid phase. According to the invention, at a preliminary stage of the method the liquid phase containing metal ions is reduced with hydrogen at an increased pressure and raised temperature in order to produce porous, sponge-like metal powder. The obtained porous, sponge-like metal powder is further processed at a high temperature, for instance by means of plasma, in order to improve the qualities of the metal powder.

Abstract: A process for producing a copper fine powder, which comprises thermally decomposing anhydrous copper formate in a solid phase in a non-oxidizing atmosphere at a temperature in the range of from 150.degree. to 300.degree. C., thereby yielding a copper fine powder having a primary particle diameter of from 0.2 to 1 .mu.m, a specific surface area of from 5 to 0.5 m.sup.2 /g and small agglomerating properties, said anhydrous copper formate being an anhydrous copper formate powder 90 wt % or more of which undergoes thermal decomposition within a temperature range of from 160.degree. to 200.degree. C. when the anhydrous copper formate powder is heated in a nitrogen or hydrogen gas atmosphere at a heating rate of 3.degree. C./min.