Abstract: A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.
Type:
Grant
Filed:
July 28, 2008
Date of Patent:
January 11, 2011
Assignee:
Korea Institute of Geoscience and Minderal Resources
Inventors:
Jae Chun Lee, Jae Min Yoo, Jin Ki Jeong, Manis Kumar Jha