Abstract: A bakery cutting guide includes a rim for surrounding baked goods with a plurality of spaced apart pins extending upwardly from the rim. A bar is provided and postionable for engaging pairs of opposing pins for guiding a knife or scorer across the baked goods in order to cut or mark the baked goods in a selected geometric pattern and a plurality of legs extend downwardly from the rim for supporting the rim in an elevated position above a top of the baked goods.

Abstract: Integrated circuit package separator for separating integrated circuit packages from a board. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board and cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

Abstract: An integrated circuit package separator for separating integrated circuit packages from a board includes a base, a support over the base, and a pair of pneumatic actuators including first and second lift members laterally spaced from the base and beneath respective ends of a pair of opposing ends of the support. The first and second lift members are configured to vertically displace the support and lift the support off the base by contacting the support. Individual actuators of the pair include release valves configured to equilibrate a back-pressure of the individual actuators to ambient during lifting of the support. The separator includes a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.

Abstract: In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: A process for forming small stacks from an initial stack of sheet material by cutting includes providing a single guillotine cutter machine which comprises a rear table part for receiving the material to be cut and a front table part for receiving the cut material, separating the initial stack into partial stacks by a plurality of cuts in a first direction perpendicular to a direction of feed thereof, and pushing back and rotating 90° at least a portion of the partial stacks from the front table part onto the rear table part for further cutting. The process also includes installing a first movable guide plate above the front table part, placing the partial stacks such that the partial stacks abut the guide plate, and cutting the partial stacks to produce small stacks.

Abstract: The present invention provides a miter guide for a table saw that allows the operator to make a miter cut with a slope in a single pass of the workpiece past the cutting blade. The miter guide includes a base within a pivotally attached guide bar that slidably engages the alignment groove in the work table of a table saw. The base is thus pivotably about a vertical axis to one of a selected number of angular orientations with respect to the cutting blade to provide the miter cut desired. A work platform that receives the workpiece to be cut is pivotally attached to the base about a horizontal axis and is thereby adjustable to a number of angular orientations with respect to the base to provide the desired slope to the miter cut.

Abstract: A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

Abstract: In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: A paper sheet decorative punching device is disclosed. In the punching device, a cap-shaped pressure member is movably received in an opening of a housing with two longitudinal guide pieces vertically extending from the lower edge of the pressure member. A punching blade unit, allowing the pressure member to be rotatable within a range, has two punching blade parts. The two blade parts have different punching patterns and different lengths. Both the pressure unit and the punching blade unit are biased upwardly by a compression coil spring, and so the pressure unit is normally projected from the top of the housing. Two edge guide members are symmetrically hinged to a base plate and are adjustable between a closed position for guiding a sheet's corner and an open position for guiding a sheet's side. A jig unit, seated on the base plate, consists of an upper holder member and a lower cutting member, with a paper sheet insert gap being formed between the two members.