Abstract: An ergonomically designed, auto-retracting utility knife that can safely remain in the user's hand while performing non cutting tasks. This invention allows a person to continue with the jobs they were performing by having the ability to use both hands and not having to set the utility knife down between manual tasks, thus saving time and increasing efficiency. An auto-retracting blade decreases the risk lacerations and other hand/wrist injuries to the user and others during routine use of the knife.

Abstract: Embodiments of the present invention include a coping apparatus and method of operation that automates the process of forming coped butt joints on strips of molding for placement on internal wall angles that alleviates at least some of the problems associated with the use of miter joints or time consuming hand or powered coping using conventional coping saws.

Abstract: An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch located below the weakened area. The positioning member maintains the position of the substrate on a moveable support. A cutting mechanism having at least one blade is provided for contacting the substrate and inducing a cleaving wave therein. The cutting mechanism is operatively associated with the positioning member so that the as at least one blade contacts the annular notch, the positioning member prevents movement of the substrate and the moveable support moves away from the substrate to allow the cleaving wave to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.

Abstract: An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The cutting device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch that is located below the weakened area. The positioning member maintains a predetermined position of the substrate on a support. The device also includes cutting means having at least one blade for contacting the substrate and for inducing a cleaving wave into the substrate. The cutting means is operatively associated with the positioning member so that the at least one blade contacts the annular notch and the positioning member prevents movement of the substrate. The at least one blade induces a cleaving wave of sufficient intensity to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.

Abstract: A band saw attachment for working in conjunction with a band saw for cutting arcuate panels from a piece of stock. The attachment includes a frame structure and a carriage movably mounted on the frame structure and movable back and forth between selected cutting positions. A rotating support is pivotally mounted to the carriage and pivotally movable back and forth relative to the blade of the band saw. In operation, the rotating support receives and holds a piece of stock and by rotating the support the blade of the band saw functions to cut arcuate shaped panels from the piece of stock.