Abstract: A block of a solid lubricant material, such as PTFE, is biased continuously or intermittently against the cutting edge of a rotary slitting blade for corrugated paperboard. The solid lubricant block prevents the build up of starch adhesive and biasing movement compensates for wear of the block and wear of the cutting blade edge.

Abstract: A machine for slitting metal sheet into strips includes a fixed upper beam and a lower beam that is displaceable vertically. Both beams support slitter heads that move along the beams. Each beam carries an arbor that rotates in it and extends through the slitter heads on it. Each beam also has a fixed threaded shaft and lock rods that extend through the slitter heads on it. Each slitter head carries a knife that rotates with the arbor for its beam. Each slitter head also has a motor-driven nut that engages the threaded shaft extending through the beam and, when rotated, moves the slitter head along its beam. The slitter heads have clamps, which clamp down on the lock rods to secure the slitter heads in fixed positions. The knives rotate about axes that are skewed slightly relative to the axes of the arbors that drive them.

Abstract: A machine for slitting metal sheet into strips includes a fixed upper beam and a lower beam that is displaceable vertically. Both beams support slitter heads that move along the beams. Each beam carries an arbor that rotates in it and extends through the slitter heads on it. Each beam also has a fixed threaded shaft and lock rods that extend through the slitter heads on it. Each slitter head carries a ring-like knife that rotates with the arbor for its beam. Each slitter head also has a motor-driven nut that engages the threaded shaft extending through the beam and, when rotated, moves the slitter head along its beam. The slitter heads have clamps, which clamp down on the lock rods to secure the slitter heads in fixed positions. The knives rotate about axes that are skewed slightly relative to the axes of the arbors that drive them.

Abstract: A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.

Abstract: There is provided a slitting-material slitting apparatus including: a rotatable male blade; a female blade that is provided below the male blade; and a wrap section that wraps a slitting-material around the female blade such that the slitting-material makes contact with the female blade on a coated layer side of the slitting-material configured by a support body with a coating layer on the support body harder than the support body; wherein the relative position of the male blade and the female blade are determined such that the male blade slits the slitting-material in a state in which the coating layer is wrapped against the female blade by the wrap section and in contact with the female blade.

Abstract: An electric saw device having two saw blades being arranged for allowing the two saw blades to be driven to rotate in opposite directions. The two saw blades are respectively formed with circular grooves on their inner surfaces at positions corresponding to each other while enabling the centers of the two circular grooves to aligned with the rotation axes of corresponding saw blades. The electric saw device has a plurality of steel balls, each being sandwiched between the two saw blades while insetting into the circular grooves simultaneously, by that the saw blades are separated from each other by a specific interval. Accordingly, when the two saw blades are rotating in opposite direction, each of the steel balls is acting as a roller bearing for maintaining the two saw blades to be properly separated from each other, and thus preventing the two saw blades from overheating and softened by friction.

Abstract: The invention relates to a device for extracting a liquid (14) contained in a container (12, 13, 15) of non-brittle material such as a container containing a liquid or pasty cosmetic or food product. The device comprises two wheels (1, 2) rotating about parallel axes (AX1, AX2) and separated from each other by a gap (E), together with motor means (3) for driving the two wheels (1, 2) in rotation in opposite directions. At least one of the wheels (1, 2) includes spikes (7, 11) projecting radially from an outer base diameter of the wheel (D1, D2) and engaging in corresponding recesses in the other wheel (1, 2; 21). The device serves simultaneously to compress and to pierce the containers (12, 13, 15) when they pass through the gap (E) between the two wheels.

Abstract: A tissue harvesting method and device for obtaining micrograft tissue particles within the size range of 50-1500 microns, and more preferably 500-1000 microns, and most preferably 600 microns. The particles may be processed after a piece of donor tissue has been excised from the donor site, or processed into the desired size directly at the donor site, and thereafter excised. Cutters having blades or cutting edges spaced in the range of 50-1500 microns are utilized to obtain particles within the desired size range. An elastomer is positioned between the cutting edges to push the excised particles out of the blades for ease of use.

Abstract: An arrangement for covering a flat lying blank, preferably made of paperboard, with a cover, as is in particular applicable in the manufacture of book cases. The arrangement comprises fixing means for simple coupling of a circular cutting device. This circular cutting device comprises transport means for direct feeding of the cut blank to the arrangement.

Abstract: A device of double saw blades includes a first saw blade, a second saw blade, a driving device and security system. The first saw blade and the second saw blade rotate around a rotation axis oppositely, and respectively include a blade body and a cutting element mounting on a periphery of the blade body. The driving device connects with the first saw blade and the second saw blade, and has a driving diameter. The security system has a security distance provided between the blade bodies. The security system includes two rigidity enhancers. The rigidity enhancers respectively include a saw blade adapter mounting on an outer side of the blade bodies. The saw blade adapters respectively have a predetermined diameter to enhance a rigidity of the blade bodies, so as to reduce deformation thereof when working. The diameters are no more than the driving diameter.

Abstract: The invention relates to a driver (1) for a twin cutting device (2), which comprises a first blade (4), which is non-rotatably arranged on a drive shaft (11) to be rotated about an axis of rotation (r) in a first direction, and a second blade (3), which is non-rotatably arranged on a drive socket (15), which encloses the drive shaft (11), to be rotated about the same axis of rotation (r) in a second direction opposite to said first direction.

Abstract: A cutting apparatus of a type where two juxtaposed blades are caused to move through sequential approximately elliptical paths and having teeth at respective outer edges of the two juxtaposed blades the relatively moving teeth on the edge of the respective blades being adapted to be urged against a surface to b cut, and at least one anchoring locator which is positioned beyond a periphery of the respective blades and thereby adapted to engage with a work piece while it is being cut and provide thereby a potential anchoring position for a work piece.

Abstract: A panel saw machine (2) for panels (1) made of wood or similar materials comprises: a horizontal table (3) for supporting the panels (1); means (4) for advancing the panels (1) along a feed line (A) and mobile in a direction parallel to and along the horizontal table (3); a straight cutting unit (5) transversal to the feed line (A) and comprising a base (10), presser means (6) for holding down the panels (1), and a first saw blade (7) mobile in both directions and protruding lengthways from a slot made in the horizontal table (3) in such a such a way as to cut the panels (1) along a line (T) transversal to the feed line (A); the cutting unit (5) also comprises a carriage (8) which rotatably mounts the first blade (7) and which is slidably connected to guide means (9) associated with the base (10) and adjustment means (14) acting on the carriage (8) and designed to enable the carriage (8) to move vertically in both directions along a line (Z) perpendicular to the transversal line (T).

Abstract: A case cutter apparatus for cutting a container has a conveyor for moving the container in a single direction, a measuring device measuring a length, a width, and a height of the container, a controller for controlling the apparatus and for receiving information from the measuring device, and a first cutting assembly and a second cutting assembly positioned along the conveyor. The first cutting assembly includes an indexing assembly holding the container in a predetermined position during cutting, a carriage moveable in a cutting direction transverse to the direction of the conveyor, and two cutting blades attached to the carriage. The second cutting assembly includes two belts each having a cleat thereon for pushing the container through the second cutting assembly in the direction of the conveyor, and two cutting blades.

Abstract: There is provided a punching unit that is readily adjusted, is capable of always punching high quality holes through sheets and is steadily capable of discharging punch chips. A punch shaft and a die shaft are disposed vertically in parallel between side plates and these very punch shaft and the die shaft compose structural members (reinforcing members) of the punching unit. The die shaft has a die shaft body formed into a hollow cylinder and is provided with dies that correspond to the punches of the punch shaft at an outer peripheral surface thereof while fitting into die holes penetrating to the hollow section. A chip discharging screw plate fixed to the right side plate is disposed in the hollow section of the die shaft. Punch chips are transported along slopes of the chip discharging screw plate and discharged out of an opening when the die shaft rotates.

Abstract: A longitudinal cutting machine having a bottom knife mounting plate disposed on the motor shaft of a motor, wherein the mounting plate is rotated by the motor shaft. A bottom knife is mounted on the mounting plate and cooperates with a top knife. At least one air bearing is mounted on an air bearing mounting plate, and is adapted to provide a gap between the air bearing and the bottom knife mounting plate.

Abstract: The present invention provides a planographic printing plate manufacturing apparatus comprising: a cutting process section which cuts a web in a thickness direction of the web by pinching the web with at least a pair of an upper knife and a lower knife, wherein the lower knife includes a flat part supporting a center of the web, a decline part gradually declined an upper end toward outside from the flat part and a cutting edge part having an upper end gradually raised toward outside from the decline part to be a cutting edge, an angle of the lower knife at a boundary point between the decline part and the flat part is 135° or more, a boundary point between the decline part and the cutting edge part is provided so as to be greater or equal to a droop width of a lower surface of a cut product.

Abstract: Cutting tool comprising a structural member (1, 1?) provided with means (301, 401) for engagement with operating means, and a plurality of cutting edges (201, 201?) connected to said structural member (1, 1?), intended to follow a given cutting path; said cutting edges (201, 201?) are each connected to said structural member (1, 1?) by means of a suitable support part (101, 101?) connected at one end to said structural member (1, 1?), oriented in a manner substantially perpendicular to the plane of said cutting path and having said cutting edge (201, 201?) at its free end, the cutting edges (201, 201?) connected to two adjacent support parts being arranged in substantial opposition to each other with respect to said cutting path.

Abstract: A device for cutting corrugated cardboard to defined sizes in a corrugating apparatus comprises at least one device for production of an at least single-faced corrugated web which is transported along a transport direction, at least one longitudinal-cutting device for creating cuts parallel to the transport direction in the corrugated web, at least one cross-cutting device for creating cuts perpendicular to the transport direction in the corrugated web and at least one diverter unit for controllably guiding the corrugated web along different, defined paths.

Abstract: The present invention provides a planographic printing plate manufacturing apparatus comprising: a cutting process section which cuts a web in a thickness direction of the web by pinching the web with at least a pair of an upper knife and a lower knife, wherein the lower knife includes a flat part supporting a center of the web, a decline part gradually declined an upper end toward outside from the flat part and a cutting edge part having an upper end gradually raised toward outside from the decline part to be a cutting edge, an angle of the lower knife at a boundary point between the decline part and the flat part is 135° or more, a boundary point between the decline part and the cutting edge part is provided so as to be greater or equal to a droop width of a lower surface of a cut product.

Abstract: A cutting tool for cutting a workpiece. The cutting tool can include a tool body having a first end and a second end and defining an axis extending through the first and second ends, a rim extending circumferentially around the first end of the tool body, and a blade having a base supported on the tool body for movement relative to the rim.

Abstract: A knife and knife assembly for a planer side head. An L or an LV type side planer head is retro-fitted with knives having substantially less mass than the knives originally provided for these heads.

Abstract: A sheet finisher for performing preselected processing with a sheet or a sheet stack conveyed thereto of the present invention includes a cutter unit configured to cut the sheet or the sheet stack in a direction perpendicular to a direction of sheet conveyance. A guide member is positioned upstream of the cutter unit in the direction of sheet conveyance for guiding the sheet or the sheet stack being conveyed. A moving device moves the guide member in a direction parallel to the direction of sheet conveyance.

Abstract: The apparatus for trimming sheet material includes a top knife and an opposing bottom knife for trimming sheet or web material passing between the top and bottom knives. The top knife defines a negative rake angle with a substantially vertical plane passing through a cutting edge of the bottom knife. The negative rake angle may be between about ?10° and ?30° and, more preferably, between about ?12° and ?20°. The top and bottom knives may be disk or block knives.

Abstract: A cutting- and creasing-wheel assembly according to the invention comprises a cutting tool, such as a circular disc (1) having a continuous or a serrated cutting edge (2). The disc is rotatable and supported between a pair of rotatable creasing-wheel halves (3 and 4), the creasing-wheel halves being of equal radial dimension. The disc is controllable for movement between a non-operative position wherein said cutting edge is withdrawn radially inside the outer peripheries (5) of the creasing-wheel halves, and an operative position wherein the cutting edge (2) is projecting radially outside said peripheries (5). The method of slitting a corrugated or otherwise compressible material involves the provision and control of a cutting tool, preferably a circular disc having a continuous or serrated cutting edge. The disc is arranged to be rotatable and movably supported between a pair of rotatable creasing-wheel halves of equal radial dimension in a cutting- and creasing wheel assembly.

Abstract: An apparatus for cutting a workpiece sheet is provided that includes a support frame, a cutter head assembly, and a clamp assembly. The cutter head assembly is mounted on a track attached to the support frame, and can be selectively moved along the track. The clamp assembly includes a bar that is selectively operable between a retracted position and a deployed position.

Abstract: A sheet finisher includes means for cutting a non-folded edge of at least one folded sheet. Means are used for setting a cutting position in accordance with a preselected length of the at least one folded sheet in a direction of sheet conveyance and a sensed length of the at least one folded sheet in the direction of sheet conveyance. An image forming system includes an image forming apparatus having means for forming a toner image on a sheet in accordance with image data, and the sheet finisher.

Abstract: A cutting machine for cutting a flat cardboard plate 2 includes first and second rotary cutters 7 and 8 rotatable in respective directions counter to each other for cutting upper and lower portions of a thickness of the flat cardboard plate 2, respectively. The first and second rotary cutters 7 and 8 and the flat cardboard plate 2 are moved relative to each other in a direction conforming to a single cutting line b to cut the flat cardboard plate 2 along the cutting line b. In this way, the flat cardboard plate 2 having a relatively great thickness can be cut with high cutting accuracy.

Abstract: The apparatus for trimming sheet material includes a top knife and an opposing bottom knife for trimming sheet or web material passing between the top and bottom knives. The top knife defines a negative rake angle with a substantially vertical plane passing through a cutting edge of the bottom knife. The negative rake angle may be between about −10° and −30° and, more preferably, between about −12° and −20°. The top and bottom knives may be disk or block knives.

Abstract: An improved rotary pressure cutting apparatus that cuts, perforates, and scores plies of paper, window materials, label stock, and plastic laminates in conjunction with soft, discontinuous, and/or non-cylindrical anvil surfaces. A light weight, low mass anvil in the form of a metallic sheet is supported in a strike position beneath a rotating blade. The anvil is biased by springs or elastomeric members toward the strike position and moves with the material being cut and the moving cutting blade during a cut. The anvil is returned to the strike position by the biasing member upon completion of the cut.

Abstract: An apparatus for slitting a running paperboard web includes a thin high speed rotary slitting blade that is plunged through the moving web and into a slot between a pair of anvil rollers supporting the web on the opposite side. Because the slitting blade and the anvil rollers are vertically separated and pre-positioned before order change, an adjustment apparatus is provided to spread the anvil rollers axially apart to provide an open gap with a large target for blade edge when it is plunged through the web and into the slot. The anvil rollers are then closed against the opposite faces of the blade for running operation. Preferably, the anvil rollers are mounted on brackets hinged together below the rollers to move the opposite upper edges of the rollers between the opened and closed position in the manner of a clam shell. The anvil roller assembly is also adjustable in the machine direction to compensate for reduction in rotary slitting blade diameter with blade wear.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A chopper for chopping fibers or fiber strands having a back up roll and a blade roll containing blades that work against a peripheral surface of the back up roll and a method of using is disclosed. The chopper has a number of improved features for reducing the frequency of long fibers or long fiber strands and fuzz from getting into the chopped product. The chopper can have one or any combination of the improvements. The improvements include a strand guide located at least two feet up stream of the chopper, a first starting roll for starting a new strand that runs on a fluid bearing that can be adjusted to control the RPM of the first starting roll, a mount for a roll that runs against the peripheral surface of said back up roll, a strand guide insert for reducing fuzz generation and for preventing fuzz from getting into the product, and a deflector plate for catching and deflecting chopped strands thrown off the back up roll into a chopped strand product chute.

Abstract: An object of the invention is to provide a blade for cutting a copper foil being capable of further decreasing the amount of slivers generated at the time of processing, e.g., cutting, punching, and perforating a copper foil and also capable of making the size of the slivers smaller. To achieve the purpose, a disk-like blade to be employed for a copper foil-slitting apparatus is coated with diamond-like carbon (DLC) or diamond-like carbon soft (DLC-soft) on at least a part to be brought into contact with a copper foil at the time of cutting. The coating reduces the unevenness of a blade surface, thereby providing a face being scarcely scratched with the copper foil. Subsequently, the amount of the slivers generated is remarkably decreased and the cutting property is improved.

Abstract: A support for a material web for use with a longitudinal cutting device for cutting the material web, includes a support shaft having an axis of rotation. At least one bearing mechanism positions the at least one support shaft, wherein the at least one bearing mechanism has an axis of rotation outside of the axis of rotation of the support shaft.

Abstract: Improved aperturing of a web can be obtained by providing pins with an extended tapered section that is substantially convex in shape. When the tapered section is longer than the penetration depth of the pins into the receiving recesses of a female roll, frictional forces in the nip between layers are reduced. Pins with extended tapered sections can be used in devices for producing apertured composite web assemblies comprising sections of absorbent matter attached to a nonwoven web or other carrier layer.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: This invention provides patterned tread strips of uniform shape and dimension from salvaged tire carcass tread strips adapted for producing products requiring stacked layers of tread strips. Novel methods of and apparatus for shaping the tread strips in one embodiment results in trimming edges of substantially rectangular shaped tread strips salvaged from tire carcasses having two shorter ends and two longer sides to produce precisely uniform width between the longer sides. Thus the longitudinal tread strips may be passed from one end longitudinally through a power actuated strip feeder which establishes slicing means operable at designated spacings near opposite edges of the tread strips to cut away edges and produce uniform longitudinal strip widths between said two shorter ends as the strips pass through the strip feeder. Other shaping embodiments of the invention include tread surface shavers for producing strips of precise thickness, and length cutters to provide specified lengths.

Abstract: The present invention relates to a single shaft rotary grinder with an improved cutter and combination “comb” rotor and counter knife configuration for reducing film, fibrous material and other material which has a tendency to wrap around the rotor, rubber, solid plastics and wood. Reducing this type of material, such as plastic film, into small pieces has been problematic. This invention provides one or more comb shaped counter knives and a rotor having a plurality of geometrically shaped cutters mounted in a plurality of partial or full rows longitudinally along the rotor. The comb shaped counter knives and the rows of cutters work in cooperation to reduce film and other material into small pieces.

Abstract: A winding device has a drive shaft having a flange, and a holder rotatably mounted on the drive shaft in covering relation to the flange, for winding the web therearound. The holder has a first torque adjustment plate rotatably mounted on the drive shaft and having a surface disposed in facing relation to a surface of the flange, the first torque adjustment plate supporting a plurality of magnets on the surface thereof, and a second torque adjustment plate rotatably mounted on the drive shaft and having a surface disposed in facing relation to an opposite surface of the flange, the second torque adjustment plate supporting a plurality of magnets on the surface thereof. The winding device is capable of winding relatively wide webs having a large thickness ranging from 100 to 150 &mgr;m, e.g., photographic photosensitive webs (films), with a low tension fluctuation ratio of ±5% or less, while producing large tension easily and stably. The winding device is constructed for easy maintenance.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: In a method of cutting roofing shingles, multiple webs of roofing material are moved to a cutter. The webs are positioned in stacked relationship prior to the cutter. The webs have distinct portions such as tabs. The locations of the distinct portions of the moving webs are sensed by sensors. End cuts are simultaneously cut through the multiple stacked webs with the cutter to produce separate roofing shingles from the webs. The movements of the webs are controlled, based on the sensed locations of the distinct portions, so that the end cuts of the roofing shingles are positioned at predetermined locations relative to the distinct portions.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A cutting apparatus includes a first annular member having a center eccentric from an axis of a rotating shaft and fixed to the rotating shaft. The cutting apparatus further includes a bearing with its inner race fixed to the first annular member, a disk cutter fixed relative to an outer race of the bearing, and a balancer fixed to the rotating shaft in a state being eccentric in the direction opposite to the eccentric direction of the first annular member.

Abstract: The present invention is directed to a tool for cutting sandwich type plaster boards such as gypsum plaster boards. It is an object of the present invention to provide a tool which allows the exact cutting of those boards in a time saving manner. According to the present invention this object is performed by a tool for working board-like workpieces, in particular sandwich type plaster boards, comprising a guide means for guiding the tool, a handle means, a blade means for forming a cut in the workpiece, and a coupling means for coupling the blade means with the guide means in an adjustable manner. A spacing between the handle means and the blade means may be adjusted by said coupling means in a direction transversely to a moving direction of the blade means.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A tire cutter apparatus including a rotatable anvil wheel assembly and a cutter wheel assembly connected to a frame. The anvil wheel assembly has an anvil wheel with a smooth circumferential anvil surface. The cutter wheel assembly includes a cutter wheel having a peripheral edge. The cutter wheel assembly and the anvil wheel assembly are movable between a closed position in which the cutter wheel edge is adjacent the anvil surface to define a cutting site, and an open position in which the cutter wheel edge and the anvil surface are spaced apart. A gripping wheel having an articulated peripheral edge is connected to the cutter wheel assembly and/or to the anvil wheel assembly, so that the gripping wheel engages a portion of a tire to move the tire through the cutting site. The apparatus may be a compression cutter defining a nip, and multiple overlapping gripping wheels may be driven to drive the tire through the cutter.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.