Abstract: Provided is a thin film depositing apparatus. The thin film depositing apparatus includes: a loading chamber loading a plurality of substrates; a first process chamber connected to the loading chamber and including a plurality of sputter guns inducing a first plasma on the plurality of substrates; a buffer chamber connected to the other side of the first process chamber facing the loading chamber; and a substrate transfer module simultaneously passing the plurality of substrates between the plurality of sputter guns during a process using the first plasma and transferring the plurality of substrates from the first process chamber to the buffer chamber.

Abstract: A processing system according to embodiments has an article supplier which supplies an article; a first conveyor which conveys an object to be processed; a workbench which is provided on the downstream side of the first conveyor and places thereon the object to be processed, conveyed by the first conveyor; a robot which takes out the article from the article supplier and subjects the object to be processed, placed on the workbench, to an operation using the article according to a previously instructed operation movement; and a second conveyor which is provided on the downstream side of the workbench and conveys the object to be processed, which has been subjected to the operation by the robot.

Abstract: A device for non-cooperatively capturing an object is provided. The device includes a boom having a fixed end coupled to a structure and a free end. The boom also includes boom deployers for moving the fixed end of the boom relative to the structure. The device also includes a capture head, coupled to the free end of the boom, and a control apparatus. The control apparatus controls the boom deployers and capture head to move the capture head in close proximity to the object. The control apparatus moves the capture head in closer proximity to the object if the capture head is not close enough to the object to capture the object. The control apparatus minimizes forces applied to the object, and activates a non-cooperative capture device. The non-cooperative capture device makes initial contact with the object, establishes intimate contact with the object, and captures the object.

Abstract: A robot according to the present invention cleans the outer surface of a window/wall by performing automatic movement along the outer surface of the window/wall while being vacuum-sucked onto the outer surface. The robot includes a moving unit for moving the robot in a first direction, a direction changing unit for rotating the moving unit to change a movement direction of the robot, and a cleaning unit mounted on at least one side of the robot. The robot can prevent water used to clean the window or outer wall of a building from being dropped toward a lower story. Also, the robot can run smoothly so that it can achieve a satisfactory cleaning operation without forming spots. The robot uses a turntable system, so that it can also freely change the movement direction thereof about the center thereof up to 360° without requiring any radius of rotation, to easily approach even a dead zone.

Abstract: A robotic arm is for holding a molded item. The robotic arm includes a mount; a suction cup assembly r for holding the molded item; and a rotating assembly mounted between the mount and the suction cup assembly to adjust the angle between the suction cup assembly and to the mount.

Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: This invention relates to a work edge detection mechanism that enables an edge of a work to be viewed clearly through an aligning camera without adding an illumination device, and to a work transfer mechanism that uses the work edge detection mechanism. The work edge detection mechanism formed from a tubular body provided with an opening at one end thereof, the tubular body having a blocking member provided at the other end thereof, includes light-reflecting means on a lower surface side of the blocking member in order to reflect any light entering from the opening, is constructed so that the tubular body has an inside diameter (?1) at the opening of the tubular body and an inside diameter (?2) at a side of the blocking member, the inside diameter (?2) being greater than the inside diameter (?1), and enables vacuum suction transfer of the work.

Abstract: Provided is a substrate processing apparatus for loading substrates such as solar cell substrates on a tray in substrate processing equipment for processing a large number of substrates. The substrate processing apparatus includes: a tray carrying unit configured to receive and carry a tray; a substrate loading conveyor unit on which substrates to be loaded on a tray are arranged in a line; a substrate unloading conveyor unit on which substrates unloaded from a tray are arranged in a line; a first substrate carrying robot configured to pick up substrates from the substrate loading conveyor unit and carry the substrates to a tray placed on the tray carrying unit; and a second substrate carrying robot configured to pick up substrates from a tray placed on the tray carrying unit and carry the substrates to the substrate unloading conveyor unit.

Abstract: In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.

Abstract: An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.

Abstract: End of arm tool (10) is used to load goods A and B in two layers in a packing container (8), with a packing insert positioned between the layers. The tool (10) also grasps a packing insert in the form of a flat sheet, bends the ends of the packing sheet downwardly to form an inverted U shape, and then inserts the packing insert in a straddling relationship about the lower layer of goods A, to protect the lower layer of goods from the weight applied by the upper layer of goods.

Abstract: A method and apparatus for deployment and retrieval of ocean bottom seismic receivers. In one embodiment, the apparatus comprises a carrier containing a plurality of receivers attached to a remotely operated vehicle (ROV). The carrier comprises a frame in which is mounted a structure for seating and releasing said receivers. The structure may comprise a movable carousel or a movable conveyor or fixed parallel rails or a barrel. In the case of the barrel, the receivers are axially stacked therein. The structure is disposed to deliver said receivers to a discharge port on said frame, where the receivers are removable from said carrier. The apparatus includes a discharge mechanism for removing said receivers from said carrier.

Abstract: An assembly system and method for assembling an aircraft wing box or other structure that may define an interior area accessible through at least one access opening are provided. The method includes inserting a robot having an assembly tool mounted thereto into the interior area through the at least one access opening. The assembly tool may be positioned at a fastener location, and may be clamped to the structure. A hole may be made through the structure, and a fastener may be installed in the hole.

Abstract: A managing structure for an umbilical member includes a flexible conduit for leading an umbilical member inserted therein from a front arm of a robot to a working tool mounted on a wrist of the robot, a first conduit mounting portion provided adjacent to the front arm, and a second conduit mounting portion provided adjacent to a point where the umbilical member is connected to the working tool. One end of the conduit is attached to the first conduit mounting portion, while the other end of the conduit is attached to the second conduit mounting portion. The conduit is laid so that a section thereof between the first conduit mounting portion and the second conduit mounting portion does not contact the body of the robot.

Abstract: A control system for and methods of controlling a product delivery system are provided.

Abstract: An air retriever, such as a bellows (24) is used in an end effector (18) for lifting work products (22) in prearranged configurations, and delivery to a container (20) in a predetermined pattern. An air flow control valve (50) is positioned in each bellows (24) for individually controlling the flow of air through each bellows so that the bellows in a pick zone may draw air for picking up work products while air flow is not applied to the other bellows out of the pick zone.

Abstract: Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.

Abstract: A ratcheting end-of-arm (EOM) tool having a spring-loaded level compensator, a distally mounted gripper, and a ratcheting mechanism. In operation, upon a selectively adequate contact between the gripper and a payload, the ratcheting mechanism is engaged which holds the position of the gripper with respect to the robot arm at a fixed position, independent of spring biasing. Upon conclusion of robotic movement of the payload, the gripper is deactivated, the ratcheting mechanism is disengaged, and the spring returns the ratcheting EOA tool to its nominal configuration.

Abstract: A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

Abstract: A robot arm, which is driven by an elastic body actuator and has a plurality of joints, is provided with an arm-end supporting member that supports the robot arm when made in contact with a supporting surface that is placed on an arm-end portion of the robot arm and a control unit that controls a force by which the arm-end supporting member and the supporting surface are made in contact with each other, and further controls a position and orientation of the arm-end portion of the robot arm.

Abstract: A suction head including a first transmission part, a second transmission part and a suction nozzle is provided. The second transmission part is magnetically attracted by the first transmission part to permit a displacement of the second transmission part relative to the first transmission part. The suction nozzle is disposed on the second transmission part and transmitted by the first transmission part via the second transmission part. Additionally, a transporting machine including a shuttle, a transporting mechanism and the aforementioned suction nozzle is provided. The shuttle is capable of carrying an object being transported, and the suction head is driven by the transporting mechanism to take the object being transported. The suction head and the transporting machine applying the same provide high transporting efficiency and ensuring a normal operation in transporting process.

Abstract: The invention is a monitoring apparatus for monitoring a condition of an end-effector of a robot having a vacuum absorption pad to hold an article. The pad is elastically supported by the end-effector. The apparatus includes a pad receiving part having a front surface and a through hole, the pad receiving part being movable in a direction perpendicular to the front surface; an elastically supporting unit for elastically supporting the pad receiving part in a direction perpendicular to the front surface; a movement detection unit for detecting a movement of the pad receiving part; a vacuum sensor connected to the through hole; and a judging unit for judging conditions of an elastic support of the pad and a vacuum absorption of the pad based on detection results of the movement detection unit and the vacuum sensor.

Abstract: A robot control unit that turns off a holding unit for a plate member, while the plate member is placed on an end effector, and lower the end effector, by a predetermined distance, from an initial position higher than a preset temporary placing position toward the temporary placing position. Then the robot control unit switches the holding member, from an OFF state to an ON state, while the end effector is stopped, and determines whether the plate member is held by the holding unit, with a holding-state detection unit. When the plate member is held by the holding unit, the robot control unit will turn turns off the holding unit while further lowering the end effector by the predetermined distance. When the plate member is not held by the holding unit, the robot control unit detects a position of the end effector at this point of time, as a normal placing position.

Abstract: In a robotic assembly, a body adapted for mounting on an arm is provided. A connection is adapted to couple the body and an end effector to allow deflection of the end effector with respect to the body between an open position and a closed position. A conduit allows fluid flow between the body and the end effector. A seal is adapted to engage the conduit to provide a fluid seal when the end effector is in the closed position and allow fluid flow when the end effector is in the open position. Further, end effector deflection can be detected based on the fluid flow and utilized to regulate movement of the robotic assembly.

Abstract: A vacuum device for a material handling system includes a vacuum device body and a sealing element. The vacuum device body has a vacuum passageway in which a vacuum is generated in response to activation of a pressurized air supply that forces pressurized air through a venturi device. The sealing element moves to a sealing position to substantially seal the vacuum passageway when the air supply is activated, and is urged toward the sealing position via pressurized air that is diverted from an inlet of the vacuum device to the sealing element. The sealing element moves to substantially vent the vacuum passageway when the air supply is deactivated. The vacuum passageway may be in fluid communication with a vacuum cup, which seals against the object when the sealing element is at the sealing position and the vacuum generating device generates at least a partial vacuum in the vacuum passageway.

Abstract: An end effector for a robot having an array of suction cups includes an air control valve connected to each suction cup. Each valve can be individually operated so that specific zones of suction cups may be activated while others are dormant. The dormant suction cups are closed to the sub-atmospheric pressure, so that leakage of air through unused suction cups is avoided, while only the suction cups of the selected zone perform the picking of the work products. This allows the end effector to provide accurate and constant sub-atmospheric pressure to the work products during the picking process.

Abstract: The present disclosure provides a system for fabricating a semiconductor device. The system includes a semiconductor fabrication tool. The semiconductor fabrication tool has an integrated inter interface that measures a first process parameter of the fabrication tool. The system also includes a wireless sensor. The wireless sensor is detachably coupled to the fabrication tool. The wireless sensor measures a second process parameter of the fabrication tool. The second process parameter is different from the first process parameter.

Abstract: A vacuum type pickup apparatus may include an absorption pad having an absorption inlet for contacting and/or picking up an object. A pad holder may be connected to the absorption pad. The pad holder may also have a vacuum line. A separator may be provided in the pad holder for forcibly releasing the object from the absorption inlet of the absorption pad. During the forcible release of the object, the air around the absorption pad may be drawn into the pad holder, thus reducing or preventing the potential contamination by impurities of the object as well as the equipment around the object. Also, an additional vacuum extinguisher may not be required, thus simplifying the structure of the vacuum type pickup apparatus and reducing installation costs. Furthermore, the object may be picked up and released in a relatively expedient, safe, and accurate manner, despite the suction force of the vacuum that may be maintained in the pad holder.

Abstract: A method and apparatus generating and tracing a cleaning trajectory of a home cleaning robot the method including: controlling the home cleaning robot to straightly travel as much as a set distance from the docking station and then rotationally travel, maintaining the set distance from the docking station, until the home cleaning robot reaches one of two walls; controlling the home cleaning robot to travel as much as the set distance along the wall if the home cleaning robot reaches the wall and resume rotational-traveling around the docking station, maintaining a distance between the docking station and the home cleaning robot increased by the set distance until it reaches one of the two walls; and repeatedly controlling the home cleaning robot to travel as much as the set distance along the wall if the home cleaning robot reaches the wall and resume rotational-traveling around the docking station, maintaining a distance between the docking station and the home cleaning robot increased by the set distance un

Abstract: Embodiments of the present invention provide an end effector for a substrate handling robot. In one embodiment, the end effector comprises one or more Bernoulli chucks surrounded by a plurality of suction cup devices. In one embodiment, the suction cup devices are configured in the form of a bellows to provide both cushioning and lateral stability to the substrate. In one embodiment, the suction cup devices further include an air pressure device to provide light positive pressure to the substrate during release. Embodiments of the end effector described herein provide a small vacuum pressure over a large area of ultra-thin substrates to minimize damage during handling.

Abstract: A mooring system for receiving and exercising at least partial control over the approach of a vessel approaching a mooring facility. An array of mooring robots are mounted to the mooring facility. Each robot has at least one vessel contact member supported by a moving mechanism in a manner to thereby be (i) movable relative to the mooring facility and (ii) presentable to engage the side of said vessel. A sensor can sense the position of the vessel relative the mooring facility. A processor can calculate movement instructions based on information received by the processor to calculate instructions for the movement of the contact member during the receipt of the vessel by the mooring system. A controller can preposition the contact member and then control the condition of each mooring robot such as to reduce the approach speed of the vessel at least in a direction towards the mooring facility.

Abstract: A method and apparatus for handling an article in semiconductor fabrication in which the article is completely separated from a gripper by a frozen liquid. The gripper includes a feeding device for introducing a liquid such as a high-purity water or a decontaminating liquid. The gripper also includes a cooling device for freezing the liquid. A suction take-in device applies negative pressure to hold the article against the frozen liquid.

Abstract: An apparatus and associated method is provided for individually positioning first and second input links of a four-bar linkage to move first and second follower links pivotally joined therebetween in order to move a chuck supported by one of the follower links between a retracted position and an extended position.

Abstract: A partial surface of a total surface, divided into several partial surfaces, is allocated to one of several mobile units by determining the partial surface of the total surface and allocating one of the several mobile units with a reservation. The mobile unit transmits allocation information indicating the allocation of the partial surface. The reservation is lifted and the allocation of the partial surface is validated when the one of the several mobile units receives no allocation rejection information from at least one of the other mobile units, indicating a rejection of the allocation of the partial surface. If rejection information is received, the reservation is lifted and the allocation of the partial surface is invalidated.

Abstract: A conveyance device (10) constructed from a multijoint robot having first to sixth arms (15A-15F) that are each numerically controlled. A suction arm (12) for sucking and holding a semiconductor wafer (W) is provided on the free end side of the conveyance device (10). The suction arm (12) has a suction section (12C) on the forward end side of the arm and is mounted so as to be movable in three perpendicular axes (X, Y, Z axes) through the arms (15A-15F) and so as to be rotatable in the direction tilting relative to an imaginary plane (S). Accordingly, even if the semiconductor wafer (W) is tilted relative to the imaginary plane (S), the suction section (12C) can be brought to intimate contact with the wafer (W) by changing the angle of the suction arm (12).

Abstract: A method for manipulating an object with a remote vehicle having a manipulator attached to a manipulator arm. The manipulator comprises a jamming or other phase change material in a housing. The method comprises pressing the manipulator housing to the object, activating the jamming or other phase change material to cause the manipulator to grasp the object, and moving one or more of the manipulator arm and the remote vehicle to manipulate the object.

Abstract: An attachment for a telescopic material handler supplies five degrees of freedom (DOF) for the task of picking, manipulating and aiding in the installation of vertical and horizontal wall cladding and other construction materials. The cladding can be of a size up to 1.3×8.0 m and a mass of 350 kg. The control and positioning of the load is accomplished through standard operation of the telehandler in conjunction with wireless control of the five DOF of the device. Hydraulic power for the device functions may be supplied through the telehandler auxiliary circuit. The auxiliary flow also powers a hydraulic generator, which supplies the device with electrical power for both system logic and control and vacuum generation. The cladding panels are handled by the vacuum system.

Abstract: Device and method to pick up and remove from a bundle one or more bars in order to arrange them for use in an operating machine. The device comprises first magnetic means to separate from the bundle an end segment of a plurality of bars and to arrange at least the end segments of plurality bars on a plane distanced with respect to the bundle. The device comprises second magnetic means to pick up, from the first magnetic means, at least one bar at a time from the plurality of bars and to unload the at least one bar in a desired release position.

Abstract: A robot tool for machining workpieces, includes a connecting element for connection to a robot. A cutting blade is maintained in a predetermined position by a retaining element, the retaining element being connectible to the robot by a connecting element.

Abstract: A gripper grasps irregular and deformable work pieces so as to lift and hold packaged, processed, or raw, and manipulate the work pieces for the purpose of material handling, assembly, packaging, and other robotic and automated manipulative functions. A vacuum is induced at multiple points through a flexible gripping hood to provide lifting force to, and facilitate rapid movement of, work pieces. An array of lighting devices and a double ring array of segmented mirrors provide uniform illumination to ensure accurate positioning of the gripping hood with respect to the work piece to be manipulated.

Abstract: A robotic end-effector for high-speed precision alignment and assembly of components has a holding device operable for temporarily holding a second component. The second component is to be aligned and assembled to a first component. The robotic end-effector has a course alignment device operable for locating the holding device with respect to a locating feature that is coupled with the first component. The robotic end-effector has a retractor operable for disengaging the course alignment device from the locating feature. The robotic end-effector has a moveable base whereby lateral compliance is provided for the holding device, enabling motion of the second component with respect to the first component, thereby enabling fine alignment of the second component with the first component when the second component touches the first component.

Abstract: An exemplary apparatus capable of picking and placing a workpiece into a container includes a suction device and a hollow body. The suction device is configured for providing a suction force for picking up the workpiece. The hollow body has a picking portion configured for picking and placing the workpiece into the container under the suction force, wherein a plurality of air slots are defined in an outer wall of the hollow body, the air slots are configured for providing an air passage between an interior of the container and an exterior thereof so as to facilitate movement of the hollow body into and out of the container, whereby the workpiece can be steadily placed in the container.

Abstract: Device for turning over electronic components, comprising a turntable (1) for driving the electronic components to be turned over in succession between the following stationary locations: a location (A) for loading them onto the turntable; a start of turning over location (B); an end of turning over location (C); and a location (D) for unloading the turntable. A turning-over device (2) actuated by a fixed rotating motor (21), not linked to said turntable, allows the electronic components to be turned over between the start of turning over position and the end of turning over position.

Abstract: An end effector for a robot having an array of suction cups includes an air control valve connected to each suction cup. Each valve can be individually operated so that specific zones of suction cups may be activated while others are dormant. The dormant suction cups are closed to the sub-atmospheric pressure, so that leakage of air through unused suction cups is avoided, while only the suction cups of the selected zone perform the picking of the work products. This allows the end effector to provide accurate and constant sub-atmospheric pressure to the work products during the picking process.

Abstract: The invention concerns an underpressure surface gripping device with an extruded profile having a hollow chamber, a vacuum plate which is mounted parallel to the extruded profile, at least one flow through opening which connects the extruded profile to the vacuum plate, and with an ejector as a vacuum generator, wherein the ejector is inserted into the hollow chamber of the extruded profile and the suction opening of the ejector communicates with the flow through opening.

Abstract: Embodiments of the present invention relate to apparatus and method for supporting and transferring large area substrate in a vacuum condition. One embodiment of the present invention provides an apparatus comprising one or more end effectors having a plurality of end effector pads disposed thereon without mechanically joining to the one or more end effectors. In one embodiment, a plurality of end effector pad assemblies are coupled to one or more end effectors by magnetic force.

Abstract: Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.

Abstract: A composite support arm for an automated handling device includes an elongated tubular body having an outer metal layer and an inner fibrous reinforcement layer adjacent to the outer metal layer.

Abstract: An end effector for a robot arm couples to the arm at a mounting fixture. The end effector includes a first paddle head assembly, the assembly including a paddle head and a solenoid controlling extension and retraction of the paddle head away from and toward the mounting fixture. In addition, the effector includes a vacuum region positioned in the first paddle head assembly adapted to receive a disk and coupled to an extendable vacuum arm. A method for operating a dual paddle end effector includes the steps of: connecting at least a first paddle head assembly including a paddle head to a robotic arm; positioning the arm adjacent to a disk in a carrier; and providing a vacuum suction to a vacuum region in the paddle head assembly sufficient to lift the disk into the vacuum region in the paddle head assembly.

Abstract: An end of arm tool has a mounting bracket mounting the end of arm tool to the robot arm for movement therewith and has a plurality of operating mechanisms mounted to the mounting bracket, a plurality of gripping devices each operatively connected to a respective operating mechanism and movable along a path, and a plurality of individual motors each operatively connected to a respective gripping device for moving the respective gripping device along its respective path. At least one programmable controller for operating the motors is provided to adjust the positions of the gripping devices along their respective paths to one of a plurality of predetermined positions established by the controller for gripping the article and to position the end of arm tool adjacent the article so that at least one of the gripping devices grips the article.