Abstract: In accordance with aspects of the invention, a method of forming a metal-insulator-metal stack is provided. The method includes forming a first conducting layer, forming a resistivity-switching carbon-based material above the first conducting layer, and forming a second conducting layer above the carbon-based material, wherein the carbon-based material has a thickness of not more than ten atomic layers. Other aspects are also described.
Type:
Grant
Filed:
January 17, 2012
Date of Patent:
September 17, 2013
Assignee:
SanDisk 3D LLC
Inventors:
Roy E. Scheuerlein, Alper Ilkbahar, April D. Schricker
Abstract: Methods for fabricating sublithographic, nanoscale microstructures in two-dimensional square and rectangular arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Abstract: Methods for fabricating sublithographic, nanoscale microstructures in two-dimensional square and rectangular arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Abstract: A method of making a uniform nanoparticle array, including performing diblock copolymer thin film self assembly over a first dielectric on silicon, creating a porous polymer film, transferring a pattern into the first dielectric, selectively growing epitaxial silicon off a silicon substrate from within pores to create a silicon nanoparticle array.
Type:
Grant
Filed:
April 27, 2011
Date of Patent:
August 21, 2012
Assignee:
International Business Machines Corporation
Inventors:
Charles T. Black, Kathryn Wilder Guarini
Abstract: In accordance with aspects of the invention, a method of forming a memory cell is provided, the method including forming a steering element above a substrate, and forming a memory element coupled to the steering element, wherein the memory element comprises a carbon-based material having a thickness of not more than ten atomic layers. The memory element may be formed by repeatedly performing the following steps: forming a layer of a carbon-based material, the layer having a thickness of about one monolayer, and subjecting the layer of carbon-based material to a thermal anneal. Other aspects are also described.
Type:
Grant
Filed:
April 6, 2009
Date of Patent:
February 7, 2012
Assignee:
SanDisk 3D LLC
Inventors:
Roy E. Scheuerlein, Alper Ilkbahar, April D. Shricker
Abstract: Methods for fabricating sublithographic, nanoscale microstructures in one-dimensional arrays utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.
Abstract: A hetero-crystalline device structure and a method of making the same include a first layer and a nanostructure integral to a crystallite in the first layer. The first layer is a non-single crystalline material. The nanostructure is a single crystalline material. The nanostructure is grown on the first layer integral to the crystallite using epitaxial growth.
Type:
Grant
Filed:
September 8, 2009
Date of Patent:
January 25, 2011
Assignee:
Hewlett-Packard Development Company, L.P.
Abstract: Disclosed herein are heterostructure semiconductor nanowires. The heterostructure semiconductor nanowires comprise semiconductor nanocrystal seeds and semiconductor nanocrystal wires grown in a selected direction from the surface of the semiconductor nanocrystal seeds wherein the semiconductor nanocrystal seeds have a composition different from that of the semiconductor nanocrystal wires. Further disclosed is a method for producing the heterostructure semiconductor nanowires.
Abstract: A hetero-crystalline device structure and a method of making the same include a first layer and a nanostructure integral to a crystallite in the first layer. The first layer is a non-single crystalline material. The nanostructure is a single crystalline material. The nanostructure is grown on the first layer integral to the crystallite using epitaxial growth.
Type:
Grant
Filed:
March 1, 2007
Date of Patent:
October 27, 2009
Assignee:
Hewlett-Packard Development Company, L.P.