Scanning Thermal Probe Patents (Class 977/867)
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Patent number: 11509283Abstract: A resonance device with improved precision of temperature control. The resonance device includes a platform; a resonator including a vibrator and one or more holding arms that connect the vibrator and the platform to each other such that a first groove is provided around the vibrator. Moreover, the resonance device includes a sensor with a measurement portion that measures temperature and a heater formed on the platform. A second groove is provided between the measurement portion and the heater.Type: GrantFiled: June 10, 2019Date of Patent: November 22, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Toshihiko Unami, Toshio Nishimura
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Patent number: 8689361Abstract: A probe for atomic force microscopy may be provided by depositing a thin film onto a wafer substrate and etching the substrate to leave the thin film behind in the form of a handle, a cantilever, and a probe tip in the cantilever. In some embodiments, a thin film substrate for the probe may be accomplished by forming the probe mold on a first wafer, bonding a second wafer onto the first wafer, and patterning out the second wafer to define the substrate for the probe on the first wafer. The thin film may be deposited onto the exposed portions of the first wafer. Thereafter, portions of the first and second wafers may be removed to leave behind the probe.Type: GrantFiled: February 5, 2013Date of Patent: April 1, 2014Assignee: Oicmicro, LLCInventor: Salleh Ismail
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Patent number: 8595861Abstract: A thermal probe includes a support element, a conductive pattern and a tip. The conductive pattern is disposed at the support element and has plural bending portions. The tip has a base and a pinpoint. The base has a first surface and a second surface which is opposite to the first surface. The pinpoint is disposed at the first surface. The second surface is connected with the conductive pattern. The bending portions are contacted with the first surface. The tip of the thermal probe is replaceable, and the user can choose the optimum combination of the tip, conductive pattern and support element according to their needs.Type: GrantFiled: May 18, 2012Date of Patent: November 26, 2013Assignee: National Cheng Kung UniversityInventors: Bernard HaoChih Liu, Fang-Yi Liao, Jian-Hong Chen
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Patent number: 7514678Abstract: A probe for a scanning thermal microscope includes a cantilever beam, an insulating layer, a conductive layer and a carbon nanotube. The cantilever beam includes a microtip at a distal end thereof, and the microtip has a conductive exterior portion with a pointed part. The insulating layer is formed on a part of the conductive exterior portion other than the pointed part thereof. The conductive layer is formed on the insulating layer and has a coupling portion in contact with the pointed part of the conductive exterior portion of the microtip, the coupling portion of the conductive layer and the pointed part of the conductive exterior portion thereby cooperatively form a thermocouple junction. The carbon nanotube has one end arranged on the thermocouple junction. The probe for a scanning thermal microscope increases spatial resolution of scanning thermal microscope and can prevent excessive current leakage.Type: GrantFiled: June 7, 2006Date of Patent: April 7, 2009Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yuan Yao, Chang-Hong Liu, Shou-Shan Fan
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Patent number: 7073937Abstract: A heat emitting probe including a conductive nanotube probe needle with its base end fastened to a holder and its tip end protruded, a heat emitting body formed on the probe needle, a conductive nanotube lead wire fastened to the heat emitting body, and an electric current supply that causes an electric current to pass through the conductive nanotube lead wire and both ends of the probe needle. The tip end of the probe needle is thus heated by an electric current flowing through the heat emitting body. A heat emitting probe apparatus includes the above-described heat emitting probe, a scanning mechanism that allows the heat emitting probe to scan over a thermal recording medium, and a control circuit that causes the tip end of the probe needle to emit heat, thus recording extremely small hole patterns in the surface of a thermal recording medium.Type: GrantFiled: February 13, 2002Date of Patent: July 11, 2006Assignees: Yoshikaza Nakayama, Daiken Chemical Co., Ltd.Inventors: Yoshikazu Nakayama, Akio Harada