Contact wafer

- SAMTEC, INC.
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Description

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a top, back, and left side perspective view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a back elevation view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The Dash-Dash broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design. The Dash-Dot broken lines in the drawing views are included to show claim boundaries that form no part of the claimed design.

Claims

The ornamental design for a contact wafer, as shown and described.

Referenced Cited
U.S. Patent Documents
D516521 March 7, 2006 Yao
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D706224 June 3, 2014 Kimura
D717736 November 18, 2014 Kimura
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D725600 March 31, 2015 Fujikata
D732481 June 23, 2015 Chang
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D758973 June 14, 2016 Fujikata
D771571 November 15, 2016 Miyamoto
D776621 January 17, 2017 Miyamoto
D823814 July 24, 2018 Buck
D847762 May 7, 2019 Miyamoto
D879724 March 31, 2020 Buck
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D909312 February 2, 2021 Liao
D910579 February 16, 2021 Miyamoto
D941780 January 25, 2022 Buck
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D973600 December 27, 2022 Musser
D1028904 May 28, 2024 Faith
D1041426 September 10, 2024 Buck
D1054386 December 17, 2024 Musser
D1056855 January 7, 2025 Faith
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Foreign Patent Documents
D130799 September 2009 TW
D132453 December 2009 TW
D159828 April 2014 TW
D163315 October 2014 TW
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D168328 June 2015 TW
D172197 December 2015 TW
Other references
  • Buck et al., “Contact Wafer”, U.S. Appl. No. 29/647,260, filed May 11, 2018.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304340D01 mailed on Sep. 26, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304341D01 mailed on Sep. 25, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304337D02 mailed on Sep. 25, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304336D01 mailed on Sep. 30, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D02 mailed on Sep. 25, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D01, mailed on Sep. 26, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 109301707, mailed on Oct. 30, 2020.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/841,152, filed Jun. 3, 2022.
  • Buck et al., “Electrical Connector”, U.S. Appl. No. 29/952,038, filed Jul. 12, 2024.
Patent History
Patent number: D1069730
Type: Grant
Filed: Feb 26, 2020
Date of Patent: Apr 8, 2025
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Bryan N. Melvin
Application Number: 29/725,670
Classifications
Current U.S. Class: Element Or Attachment (D13/154)