Abstract: A method for manufacturing an antenna for an RFID device includes providing a conductive material on a substrate and performing a first cutting process on the conductive material to define an initial antenna. Additional cutting processes are performed on the initial antenna to define a final antenna, with the first and any subsequent cutting processes being different. The subsequent cutting processes are capable of more finely defining regions of the antenna, such as in some embodiments when the first cutting process is a die cutting process and a second cutting process is a laser cutting process. While the subsequent cutting processes are capable of more finely defining regions of the antenna than the first cutting process. By combining multiple cutting processes, a final antenna equivalent to one made using only one or more of the subsequent cutting processes may be created at a lower cost.
Type:
Grant
Filed:
March 12, 2020
Date of Patent:
April 29, 2025
Assignee:
Avery Dennison Retail Information Services LLC