Abstract: Embodiments of process kits are provided herein. In some embodiments, a process kit, includes: a deposition ring configured to be disposed on a substrate support, the deposition ring comprising: an annular band having an upper surface and a lower surface, the lower surface including a step between a radially inner portion and a radially outer portion, the step extending downward from the radially inner portion to the radially outer portion; an inner lip extending upwards from the upper surface of the annular band and adjacent an inner surface of the annular band, and wherein an outer surface of the inner lip extends radially outward and downward from an upper surface of the inner lip to the upper surface of the annular band; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
Type:
Grant
Filed:
June 18, 2021
Date of Patent:
February 14, 2023
Assignee:
APPLIED MATERIALS, INC.
Inventors:
David Gunther, Siew Kit Hoi, Kirankumar Neelasandra Savandaiah
Inventors:
Yao-Hung Yang, Eric Ruhland, Saurabh M. Chaudhari, Dien-Yeh Wu, Philip Wayne Nagle, Aniruddha Pal, Sudhir R. Gondhalekar, Siamak Salimian, Scott Lin, Boon Sen Chan