Composite seal for semiconductor manufacturing device

Description

1. Composite seal for semiconductor manufacturing device

1.1 : Perspective

1.2 : Top

1.3 : Front

1.4 : Cross section taken along line 1.4-1.4 in view 1.2

1.5 : Enlarged portion view taken from encircled portion labeled, “1.5,” in view 1.4

1.6 : Right

1.7 : Bottom

1.8 : Back

1.9 : Left

The dot-dashed lines show the boundary of the enlarged view of 1.5 in views 1.4 and 1.5 and form no part of the claimed design.

Claims

The ornamental design for a composite seal for semiconductor manufacturing device as shown and described.