Abstract: A frame-less epoxy-resin encapsulated solar power panel, in which an optically-transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a support sheet of phenolic resin, and supported in a layer of adhesive coating applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The optically-transparent epoxy-resin coating, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the frame-less epoxy-resin encapsulated solar power panel.
Abstract: A frame-less epoxy-resin encapsulated solar panel construction, in which an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a sheet of phenolic resin, and supported in a layer of adhesive coating applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness, after which the epoxy-resin coating is applied over the array of PV solar cell modules and the cured layer of adhesive coating so to reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the sheet of phenolic resin.
Abstract: A frame-less epoxy-resin encapsulated solar power panel, in which an optically-transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a support sheet of phenolic resin, and supported in a layer of adhesive coating applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The optically-transparent epoxy-resin coating, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the frame-less epoxy-resin encapsulated solar power panel.
Abstract: A frame-less epoxy-resin encapsulated solar panel construction, in which an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a sheet of phenolic resin, and supported in a layer of adhesive coating applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness, after which the epoxy-resin coating is applied over the array of PV solar cell modules and the cured layer of adhesive coating so to reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the sheet of phenolic resin.
Abstract: A frame-less epoxy-resin encapsulated solar power panel, in which an optically-transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a support sheet of phenolic resin, and supported in a layer of adhesive coating applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The optically-transparent epoxy-resin coating, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the frame-less epoxy-resin encapsulated solar power panel.
Abstract: A solar panel factory system and process for manufacturing a frame-less epoxy-resin encapsulated solar panel by encapsulating solar cell modules within optically-transparent epoxy-resin material coating phenolic resin support sheets. During solar panel manufacture, an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a sheet of phenolic resin, and supported in a layer of adhesive coating is applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The epoxy-resin coating applied over the array of PV solar cell modules, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the sheet of phenolic resin.
Abstract: A solar panel factory system and process for manufacturing a frame-less epoxy-resin encapsulated solar power panel by encapsulating solar cell modules on a phenolic resin sheet beneath a polycarbonate panel using an optically-transparent epoxy-resin material. During solar panel manufacture, an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on the sheet of phenolic resin, and supported in a layer of adhesive coating is applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The epoxy-resin coating applied over the array of PV solar cell modules, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the frame-less epoxy-resin encapsulated solar power panel.
Abstract: A solar panel factory system and process for manufacturing a frame-less epoxy-resin encapsulated solar panel by encapsulating solar cell modules within optically-transparent epoxy-resin material coating phenolic resin support sheets. During solar panel manufacture, an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on a sheet of phenolic resin, and supported in a layer of adhesive coating is applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The epoxy-resin coating applied over the array of PV solar cell modules, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the sheet of phenolic resin.
Abstract: A solar panel factory system and process for manufacturing a frame-less epoxy-resin encapsulated solar power panel by encapsulating solar cell modules on a phenolic resin sheet beneath a polycarbonate panel using an optically-transparent epoxy-resin material. During solar panel manufacture, an optically transparent epoxy-resin coating is applied over an array of photo-voltaic (PV) solar cell modules mounted on the sheet of phenolic resin, and supported in a layer of adhesive coating is applied as a liquid with a viscosity and a thickness such that the thickness of the layer of adhesive coating is substantially equal to the thickness of the PV solar cell modules, and cured to a sufficient hardness. The epoxy-resin coating applied over the array of PV solar cell modules, and the cured layer of adhesive coating, reinforce the strength of the sheet of phenolic resin, particularly around the perimeter of the frame-less epoxy-resin encapsulated solar power panel.
Abstract: A method of using additives with silica-based slurries to enhance metal selectivity in polishing metallic materials utilizing a chemical-mechanical polishing (CMP) process. Additives are used with silica-based slurries to passivate a dielectric surface, such as a silicon dioxide (SiO.sub.2) surface, of a semiconductor wafer so that dielectric removal rate is reduced when CMP is applied. The additive is comprised of at least a polar component and an apolar component. The additive interacts with the surface silanol group of the SiO.sub.2 surface to inhibit particles of the silica-based slurry from interacting with hydroxyl molecules of the surface silanol group. By applying a surface passivation layer on the SiO.sub.2 surface, erosion of the SiO.sub.2 surface is reduced. However, the metallic surface is not influenced significantly by the additive, so that the selectivity of metal removal over oxide removal is enhanced.
Type:
Grant
Filed:
June 6, 1995
Date of Patent:
March 25, 1997
Assignees:
Sematech, Inc., Intel Corporation, National Semiconductor Corp., Digital Equipment Corp.
Inventors:
Janos Farkas, Rahul Jairath, Matt Stell, Sing-Mo Tzeng