Abstract: A field effect transistor (FET) structure suitable for MOS and CMOS IC fabrication processes includes spaced apart alternating source and drain regions distributed in a rectangular checkerboard pattern of horizontal and vertical rows. A first grid of intersecting horizontal and vertical conductive gate lines overlaps adjacent source and drain regions of the array and is dielectrically isolated from the source and drain regions by an insulating layer. The horizontal and vertical gate lines provide a single gate element distributed across the array which reduces FET channel length and channel resistance. A second grid comprising a set of parallel diagonal alternating source lead lines and drain lead lines is dielectrically isolated from the first grid. The source lead lines are electrically coupled to source regions and drain lead lines to drain regions.

Abstract: An integrated circuit structure comprises a plurality of islands of semiconductor material (16-1 through 16-5) each island being separated from adjacent islands by a groove formed in annular shape around said island to laterally define the dimensions of each such island, an oxide (12, 14) formed over the surface of said grooves (13-1 through 13-6) and said islands and a selected glass (15) deposited on said oxide (14) in the grooves and over the top surface of said device, said glass having the property that it flows at a temperature beneath the temperature at which dopants in the islands of semiconductor material substantially redistribute, said selected glass (15) having a substantially flat top surface thereby to give said structure a substantially flat top surface.

Abstract: Apparatus and methods for the flow analysis of multiphase fluids including a liquid phase in a tubular conduit use Stoneley waves by exciting and detecting sonic wave energy in the tubular conduit. Information about the Stoneley mode component is obtained in one approach by using techniques that excite only the Stoneley mode together with certain other well behaved wave types, and then compensating for the latter. Alternatively the Stoneley arrival is specifically identified in the detected waveforms. Embodiments are described for: determining the flow rate of a liquid; detecting the presence or absence of gas in a liquid; determining the composition by volume of the dispersed phases in a multiphase fluid; determining the size distribution of bubbles in a multiphase fluid; and determining the velocity of slugs in a multiphase fluid.

Abstract: A bipolar memory cell is fabricated by forming diodes 60 and 65 on top of the transistors Q1 and Q2 formed in the underlying substrate 10. Metal silicide 30 overlies strips 34 and 35 of doped polycrystalline silicon 25, 28, 37, and 38 to cross-couple the bases and collectors of the two transistors Q1 and Q2 forming the memory cell. The metal silicide 30 shorts PN junctions 29 in polycrystalline 23. Two further strips 50 and 52, each comprising a sandwich of P type polycrystalline silicon 42, metal silicide 45, and N conductivity type polycrystalline silicon 47, are formed to couple the cross-coupled bases and collectors to respective diodes 60 and 65. The diodes 60 and 65 are formed by depositing metal 62 and 64 in electrical contact with the underlying N type polycrystalline silicon 47.

Abstract: An oxide-isolated RAM and PROM process is disclosed wherein a RAM circuit includes a lateral PNP transistor formed in the same island of silicon material as a vertical NPN device and further wherein contact is made to the base of the lateral PNP and to the collector of the vertical NPN through a buried contact region accessed through a sink region formed in an adjacent island of semiconductor material. A field implantation beneath the isolation oxide avoids implanting impurity along the sidewalls of the semiconductor material adjacent the field oxidation and therefore provides both vertical and lateral isolation from one silicon island to another. Substantial reductions in sink sizes and cell sizes are obtained by elminating the field diffusions from the sidewalls of the semiconductor islands. The lateral PNP transistor serves as an active load for a memory circuit constructed using the structure of this invention. The process also can be used to manufacutre PROMS from vertical NPN transistors. An LV.sub.

Abstract: A static bipolar random access memory cell includes first and second transistors formed in epitaxial silicon pockets 41 and 42 in a substrate. The collectors 19 and 19' and bases 15 and 15' of the transistors are interconnected with polycrystalline silicon 21 doped to match the conductivity types of the regions contacted. Undesired PN junctions 40 and 40' created thereby are shorted using an overlying layer of a metal silicide 25. In a region overlying the N conductivity type polycrystalline silicon 23 or 23', the metal silicide is removed and a PH junction 37 or 37' created by depositing P conductivity type polycrystalline silicon 35c or 35c'. If desired additional P type polycrystalline silicon 35a and 35b may be deposited across the surface of the epitaxial layer where the base regions of the two transistors are formed to reduce the base series resistance.

Abstract: A method for forming a substantially planar inorganic dielectric layer over a predetermined pattern of electrical interconnects comprises the steps of reacting phosphoric acid and a trivalent metallic halide compound with an aliphatic solvent to form a coating fluid. The coating fluid is then spun onto the semiconductor device to form a layer over the electrical interconnect. The resultant device is then baked at a first temperature to drive off the solvent and then baked at a second, higher temperature, in order to promote the glass forming reaction. This process is repeated as required to form a coating layer having a thickness which exhibits levelling characteristics of such high quality that fine topography can be carried out on succeeding layers of metal in order to form additional interconnect layers with precision.

Abstract: A method of introducing a controlled flow of vapor from a high pressure sublimation chamber into a low pressure vapor deposition reactor, said vapor being derived from solid source material preferably, but not necessarily, having a vapor pressure above about one (1) Torr at a temperature not exceeding about 350.degree. C. The method comprises controllably heating the source material to a temperature sufficient to produce vapor therefrom at a desired pressure, and then controllably transferring the vapor through vapor transmission means to the vapor deposition reactor. During such transfer, the transmission means is maintained at a temperature sufficient to prevent condensation of the vapor therein during transfer. The vapor is delivered to the reactor in a pure state and is not mixed with any carrier medium.

Abstract: The two transistors of a bipolar flip-flop structure are interconnected by using a polycrystalline silicon/metal silicide sandwich structure. The polycrystalline silicon is doped to correspond to the underlying regions of the transistor structures, and undesired PN junctions created thereby are eliminated by depositing refractory metal silicide on the upper surface of the polycrystalline silicon.

Abstract: A process for fabricating self-aligned regions of metal silicide on bipolar integrated circuits having self-aligned polycrystalline silicon emitters and base contacts includes the steps of depositing a layer of polycrystalline silicon across the surface of the structure, patterning the polycrystalline silicon to define the emitters and base contacts as well as resistors and diodes, heating the structure to transfer desired conductivity dopants from the polycrystalline silicon into the underlying structure, forming a protective layer over those regions of the structure where metal silicide is not desired, depositing a layer of refractory metal across the entire structure, and reacting the refractory metal with the underlying silicon to form metal silicide.

Abstract: Pressure sensing diaphragms comprise a cylindrical or spherical crystalline member in which an internal cylindrical or spherical chamber is provided. In the internally loaded embodiments, a fluid is introduced into the chamber and the pressure exerted by the fluid causes generally tensile stress in the region of the diaphragm generally about the chamber. In the externally loaded embodiments, the diaphragm is immersed within the fluid and the pressure exerted by the fluid causes generally compressive stress in the region of the diaphragm generally about the chamber. For each of the embodiments, the stresses arising cause certain mechanical and electrical properties of the crystalline material to change. The change in these properties is detected by observing the frequency behavior of one or more oscillators whose frequencies of operation are controlled by respective surface acoustic wave devices provided in the regions of elastic deformation.

Abstract: A static RAM cell (11) is constructed utilizing low resistivity positive and negative power supply leads (13,14), thus eliminating the problem of instability of the data stored within the cell. The negative power supply lead is formed of a first layer of low resistivity polycrystalline silicon/tantalum silicide, and the positive power supply lead is formed of a second layer of polycrystalline silicon. The use of a low resistivity negative power supply lead causes the voltage drop on the negative power supply lead to be substantially reduced as compared with prior art devices, thereby providing during the read operation substantially equal voltages to the gates of the two bistable transistors of each cell, thus eliminating the problem of instability during reading.Depletion load devices (11,12) are formed utilizing the layer of polycrystalline silicon as the source, drain and channel and the layer of polycrystalline silicon/tantalum silicide as the gate.

Abstract: An argon-fluorine (ArF) excimer laser is used to selectively heat various Si.sub.3 N.sub.4 materials used in the manufacture of semiconductor devices to elevated temperatures while maintaining active device regions and electrical interconnects at relatively low temperatures, to, for example, anneal the structural layer, induce compositional changes or densification and/or flow of the silicon nitride-based material to round off sharp edges and stops, all without damaging or appreciably affecting the active regions and electrical interconnects of a semiconductor device.

Abstract: An electromagnetic logging apparatus for investigating properties of an earth formation surrounding a borehole comprises an electromagnetic energy transmitter and four receivers supported by a support member, a measurement channel, and a multiplexer for selectively coupling the measurement channel to the receivers. The measurement channel comprises an amplitude processing channel including a highly gain-stabilized amplifier and gain control circuit; a phase processing channel including a highly phase-stabilized amplifier; and a circuit for measuring the amplitude and phase. The gain of the gain-stabilized amplifier is controlled by the gain control circuit in a closed loop feedback arrangement, while the gain of the phase-stabilized amplifier is controlled by the same gain control circuit without the closed loop arrangement.

Abstract: A lateral transistor structure having a self-aligned base and base contact is provided, together with a method for fabricating such a structure in which the base width is controlled by lateral diffusion of an impurity through a polycrystalline silicon layer. The resulting zone of impurity changes the etching characteristics of the layer and permits use of a selective etchant to remove all of the layer except the doped portion. The doped portion may then be used as a mask to define the base electrical contact, which in turn is used to provide a self-aligned base for the transistor. Dopants introduced on opposite sides of the base electrical contact create the emitter and collector.

Abstract: A method and apparatus for measuring an earth formation characteristic from inside a borehole penetrating earth formations is described. A tool carrying a sonic transmitter and an array of receivers is moved along the borehole and waveform signals from the receiver array are generated from repetetive operations of the transmitter. Sub-arrays of particularly related waveform signals relevant to a selected depth interval that is less in length than the aperture of the array are identified. Each sub-array of signals is then converted to a domain of signals composed of values of a coherence as a function of a range of values of a characteristic such as slowness. The converted signals are then combined so as to provide combined coherence values as a function of different values of the characteristic. One or several peaks of the combined coherence values are detected and determine the value of the characteristic for the selected depth interval. Similar processing is continued for other depth intervals.

Abstract: A bipolar memory cell is fabricated by forming diodes 60 and 65 on top of the transistors Q1 and Q2 formed in the underlying substrate 10. Metal silicide 30 overlies strips 34 and 35 of doped polycrystalline silicon 25, 28, 37, and 38 to cross-couple the bases and collectors of the two transistors Q1 and Q2 forming the memory cell. The metal silicide 30 shorts PN junctions 29 in polycrystalline 23. Two further strips 50 and 52, each comprising a sandwich of P type polycrystalline silicon 42, metal silicide 45, and N conductivity type polycrystalline silicon 47, are formed to couple the cross-coupled bases and collectors to respective diodes 60 and 65. The diodes 60 and 65 are formed by depositing metal 62 and 64 in electrical contact with the underlying N type polycrystalline silicon 47.

Abstract: A tunable CO.sub.2 gas laser is used to selectively heat various SiO.sub.2 -based materials to elevated temperatures while maintaining an active device region at relatively low temperatures, to, for example, induce densification and/or flow of the SiO.sub.2 -based material to round off sharp edges and stops.

Abstract: A digital and linear dynamic ignition control apparatus comprising a burn-time counter, a pre-dwell counter, a current limit counter, engine speed detection apparatus, a biasing circuit and an excess current limit circuit is provided for controlling the start of a dwell in each ignition period. In operation, a current limit adjust window is established for each period. The time of the termination of a dwell in the period relative to the current limit adjust window established for the period starts the dwell in the next period relative to the beginning of the next period at a time calculated to optimize engine performance and minimize energy losses. In general, rapid acceleration in a period starts the dwell earlier in the next period to insure adequate charging of the ignition coil. Conversely, rapid deceleration in a period starts the dwell later in the next period to minimize energy losses.

Abstract: Decoding apparatus for an integrated circuit memory having normal rows of memory cells 10 and at least one selectively connectable redundant second row of memory cells 31 for being connected in place of one of the first rows 10 includes a redundant decoder (transistors 32, 33. . . n) connected to each of the redundant rows 31, the redundant decoder including a plurality of selectable connections (F.sub.1, F.sub.2 . . . F.sub.n) for creating an address for each of the at least one redundant rows 31; a control signal generating circuit (gates 45, 46, and 47) for generating a control signal of a first state until an address is supplied to the memory and of a second state if any of the redundant rows 31 are selected by the address, and another decoder (transistors 23 and 39) connected to receive control signal .phi..sub.C from the generating circuit for controlling normal rows 10 and the redundant row 31 in response thereto.