Abstract: A new solid state device based on mesoscopic phenomena is described. A structure of the mesoscopic device includes phase altering scattering sites at various energy levels disposed in proximity to a conductive channel. The carries in the channel, being isolated by a potential barrier, are not in substantial scattering interaction with the phase altering scattering sites in the absence of a sufficiently large voltage at the gate of the mesoscopic device. Increasing the potential at the gate, imposes a localized electric field along the channel, increases the energy levels of the carriers in the channel, and allows the carriers to interact with the phase altering scattering sites, thereby controllably varying the conductance of the channel.

Abstract: A compact complementary transistor switch (CTS) memory cell structure utilizing both vertical PNP and vertical NPN transistors in gallium arsenide technology is described. The base region of the vertical PNP transistor merges with the collector region of the vertical NPN transistor. The collector region of the vertical PNP transistor merges with the base region of the vertical NPN transistor. The emitter of the vertical PNP transistor is at the top, and the emitter of the vertical NPN transistor is at the bottom in relation to the emitter of the vertical PNP transistor. This structure leads to improvements in memory density, performance and wireability of a memory array comprising many such cells. A novel yet simple process for making such compact CTS memory cells is also disclosed.

Abstract: An integrated circuit bipolar transistor is described wherein the relative semiconductor electrode areas are established by an electrode pedestal that includes a base contact positioning feature and wiring constraints are relaxed by a base pedestal that facilitates the positioning of contact wiring that is independent of contact location. A heterojunction bipolar transistor having a base area less than twice as large as the emitter area is described.

Abstract: A method and circuitry for testing in situ the components mounted on a circuit board. First, a component is removed from the board. A testing circuit is then installed in place of the removed component. The testing circuit allows test patterns to be applied to a selected component on the board from the board I/O pins. The selected component responses are collected by the testing circuit and applied to the board output pins. In this manner, individual components on the board can be tested in situ from pins on the board.

Abstract: A planar process for fabricating an optoelectronic integrated circuit device is described. The process includes the in situ formation of laser diode mirror facets comprising the steps of providing a semi-insulating gallium arsenide substrate having thereon layers of n-doped gallium arsenide, n-doped aluminum gallium arsenide, and undoped gallium arsenide; patterning and etching the undoped gallium arsenide layer into a mandrel having substantially vertical walls; establishing insulator sidewalls on the vertical walls; removing the mandrel, thereby exposing the inner walls of the insulator sidewalls and leaving the insulator sidewalls self-standing; removing the aluminum gallium arsenide using the insulator sidewall as a mask; and forming a laser diode within the region between the insulator sidewalls and creating the mirror facets with the inner walls of the insulator sidewalls. Mirror facets formed in accordance with this process are substantially free of contaminants.

Abstract: An infrared touch input system is taught. Briefly stated, the system comprises a four-sided frame having an infrared transparent bezel along the inside thereof and having infrared emitters along the top and one side of the frame with infrared detectors along the sides opposite the emitters. Darlington transitor arrays are used as source and sink drivers for driving the LED's in an array. The I/O lines of a microprocessor in conjunction with the source and sink drivers are used to selectively energize each LED. Additional I/O lines of the microprocessor in conjunction with BCD decoders are used to selectively energize corresponding infrared detecting phototransistors before, during and after LED turn-on. A host computer supplies a clocking signal for the microprocessor with programming in the microprocessor thereby automatically performing the selection and deselection of emitters and detectors.

Abstract: A method and device for compliantly interconnecting a surface mount device or the like to a circuit board is taught. Briefly stated, an interposer having interconnect areas is placed between the circuit board and the device to be surface mounted with interconnect areas disposed between conductive strips on the circuit board and pads contained on the surface mount device. The interconnect area has disposed therein a plurality of fine wires having flux and solder disposed thereon.

Abstract: A manner of precisely mounting a surface mounting connector to a substrate is taught. Briefly stated, after soldering of the contacts of a connector to the substrate, a radially wound steel roll pin is positioned in the mounting holes of the connector housing and is then urged downwards so as to cut through the substrate. The radial forces of the roll pin are used to retain the roll pin in position in the connector housing and in the substrate, thereby rigidly holding the connector housing to the substrate upon which it is mounted.

Abstract: A device for producing a hermetically sealed chip carrier is taught. Briefly stated, a sealing or perimeter ring is formed on a substrate with an appropriate lead pattern and IC chip contained within this ring. Vias or ducts are disposed in the substrate with metal lead pedestals contained therein which provide electrical connection through the substrate and therefore between the lead pattern contained inside the sealing ring and the lead patterns on the outside of the sealing ring. This therefore allows for a continuous sealing ring such that a cap may be placed on top of the sealing ring and bonded by methods such as welding so as to form a hermetically sealed enclosure.

Abstract: An electrical connector assembly for terminating flat shielded electrical cable comprises two matable connectors one comprising a housing carrying signal and ground contacts for connection to respective conductors of the cable, and the other comprising a housing carrying contacts for mating with the signal contacts of the one connector, the signal contacts being separated by shielding plates matable with the ground contacts of the one connector.

Abstract: A modular connector housing of relatively short length and having a coupling feature, such as a tab at one end and a recess at the other end, is connected with other similar connector housings. A filler material having a melting point lower than that of the particular soldering method chosen is then inserted into that portion where two housings are joined thereby forming a relatively rigid long connector housing. A hot-melt adhesive preform is then placed on the bottom of the connector housing with the entire connector housing assembly aligned with and attached to a printed circuit board. The hot-melt adhesive bonds the connector housing to the substrate while the filler material melts away from the filler openings, allowing the short incremental housing lengths to move relatively free with respect to each other.

Abstract: A chip carrier socket and contact which provides high contact mating forces and short circuit path length is taught. Briefly stated, a chip carrier socket housing is comprised of a base portion having contacts disposed therein with a retainer portion being placed thereon. A chip carrier having conductive leads is placed between the base and the retainer. The retainer has a spring carrier piece contained therein with the spring carrier acting on fingers which are part of the retainer. The retainer fingers urge the conductive leads of the chip carrier into electrical contact with the contact thereby utilizing the contacts as points of electrical communication only and not for exerting contact mating force.

Abstract: A device for connecting leadless integrated circuit packages to a chip carrier housing or socket and then to a printed circuit board is taught. Briefly stated, a mask is selectively disposed on a printed circuit board. Locating ribs are correspondently disposed on a chip carrier housing so as to cooperatively engage the slots created by the absence of the mask on the printed circuit board. Additionally, barriers for separating contacts contained in the chip carrier housing are maintained at the interior and the exterior portion of the chip carrier housing walls with no material disposed therebetween thereby minimizing capacitive as well as inductive effects which may come about.

Abstract: An electrical contact for use with high density, high frequency electrical signals is taught. Briefly stated, an electrical contact which is generally "U"-shaped having at the end of one leg an outer beam portion perpendicularly attached at the end thereof. A second generally "U"-shaped bent portion is perpendicularly disposed at the end of the other leg in overlapping relationship with the outer beam with the free leg of the second "U"-shaped portion resiliently biased against the lower portion of the outer beam.

Abstract: A polarized ribbon cable connector which facilitates the placement of electrical or circuit components therein is taught. Briefly stated, a housing lower assembly is profiled to receive a carrier strip therein. The carrier strip has bent up portions which provide for insulation displacement connection with electrical wires. An intermediate assembly is disposed on top of the carrier strip with a channel therein to receive a ribbon cable. A housing top assembly is disposed on top of the ribbon cable and has latches which mate with tabs contained on the lower assembly thereby interlocking various components together. The carrier strip also has contact legs disposed therein which allow for electrical contact to be made with pads contained in an insertable logic package. Knockout pin apertures disposed in the lower assembly allow portions of the carrier strip to be electrically isolated from the contact legs.

Abstract: A high speed socket housing having a relatively simple manner of contact inspection and/or replacement is taught. Briefly stated, the device includes a chip carrier housing having a portion which is removable therefrom and which thereby exposes the contacts contained in slots or partitions in the housing. Thereby, upon removal of a portion of the housing an inspection, replacement, and/or testing of individual contacts may be accomplished without disturbing the remainder of the contacts or removal of the entire chip carrier housing from a printed circuit board.

Abstract: A low profile chip carrier housing contact having a very short electrical contact path is taught. Briefly stated, the device includes a frame having contacts arranged on each of the sides of the frame. The contact members are uniquely shaped so as to exert optimum forces of contact mating values between a leadless integrated circuit chip carrier package and a printed circuit board.

Abstract: Apparatus is disclosed for fabricating an electrical crossover wire harness, the apparatus including, a wire holder, a known wire shuttle for feeding wires to the wire holder, a pressure plate for guiding and inserting the wires into the wire holder, a carriage for mounting and transporting an electrical connector relative to the wire holder a wire stuffer for transferring selected wires into selected wire positions of the connector assembly, and the wire holder holding wires elevated from the connector assembly and the wires previously transferred thereto.

Abstract: Strip feeding apparatus comprises a feed screw having a feeding thread on its surface. The thread is received in notches in one edge of the strip so that rotation of the screw advances the strip. Guides are provided for guiding the strip along the feed path and maintaining the strip in engagement with the thread. The thread may have a portion of each turn which causes no feeding during each revolution so that strip is fed intermittently. The feeding apparatus may be used under a wide variety of circumstances and is disclosed in conjunction with a stamping and forming or similar machine.

Abstract: A high density circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing comprised of two parts have contained therein a cylindrical contact carrier being held in the housing by resiliently deformable spring steel members with the contact carrier having a series of slots therein by which a contact is fitted to. The contact is semi-circular in shape conforming to the configuration of the contact carrier. A camming device which is generally triangular in shape resides in one corner of the contact housing and through lateral movement parallel to the axis of the contact carrier urges the contact carrier and hence the contacts downwardly and outwardly while movement of the cam in the reverse lateral direction allows the spring steel members to urge the contact carrier and hence the contacts inwardly and upwardly.