Abstract: The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO3, SrTiO3 and Ta2O5 produce the most effective results.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.

Abstract: A semiconductor package in which a memory module (a SIMM or DIMM, for example) is mounted edgewise on a ceramic substrate. In another embodiment, a semiconductor package in which a chip scale package is mounted edgewise on a ceramic substrate.

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Abstract: A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

Abstract: A carousel for a probe card assembly which includes opposed planar rings supported and spaced apart by flexible supports. The flexible supports, while supporting the planar rings, also allow the planar rings to rotate with respect to each other. Also included are a plurality of connecting means which pass through perforations in the planar rings so as to thereby make interconnection between a probe card and an interface card in a semiconductor test system.

Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials.This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

Abstract: An unsintered aluminum nitride body including:(a) 1 to 5 weight percent of a vitreous solid of boria, alumina, and calcia in the proportions of (1) boria between 3 and 25 weight percent, (2) alumina between 10 and 50 weight percent, and (3) calcia between 40 and 80 weight percent; and(b) aluminum nitride powder as the balance of the aluminum nitride body.The invention further relates to a method of forming the unsintered aluminum nitride body and then sintering it at a temperature between 1550 and 1650 degrees Centrigrade so as to form a dense, thermally conductive aluminum nitride body.

Abstract: A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.

Abstract: A process of forming an aperture in a metallic sheet including the steps of:a) defining at least one feature in a sheet of metallic material;b) laser drilling the at least one feature but not entirely removing it from the metallic sheet, the at least one feature being partially filled by metallic material which has melted and resolidified; and thenc) chemically etching the metallic sheet and the melted and resolidified metallic material wherein the etchant attacks and at least partially dissolves the melted and resolidified metallic material, weakening the bond of the melted and resolidified metallic material to the metallic sheet.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the underlying layer of nonconducting material. The exposed underlying layer of material is contacted with a metallic salt solution. A key part of the present invention is the layer of nonconducting material which catalyzes the deposition of a seed layer from the metallic salt solution. Then, additional metallization may be easily electrolessly plated on the seed layer.

Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

Abstract: An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically connected to the capture pad. The bonding pad and the second layer of polymeric material are at the same height so that the bonding pad is level with the second layer of polymeric material. Finally, there is a cap of electrically conducting metallization on the bonding pad and extending beyond the second layer of polymeric material. The cap is of a different composition than the bonding pad.

Abstract: A laser array for a large number of lasers which are manufactured on a single metal level is taught. Briefly stated the cavity length of the lasers are shortened so as to provide for metal lands or traces to be disposed adjacent to rear facets of the laser for eventual interconnection with pads. The diminution in cavity length does not degrade laser performance or characteristics, while performance and characteristics amongst adjacent lasers is similar.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: Disclosed is a method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method including the steps of:(a) applying a quantity of solder to the solder column or I/O pad;(b) aligning the solder column with the I/O pad such that there is a quantity of solder between them;(c) heating the structure to cause the solder to melt and bond the column to the I/O pad; and(d) planarizing the solder column to a predetermined height.Also disclosed is the electronic interconnection structure made by the method according to the invention.

Abstract: A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

Abstract: Disclosed is a method of controlling the densification behavior of a metallic feature in a ceramic material, the method including the steps of:obtaining an unsintered ceramic material having at least one metallic feature therein;providing at least the metallic feature with a predetermined amount of carbonaceous material;heating the ceramic material and metallic feature to a predetermined temperature sufficient to cause sintering of the ceramic material, the metallic feature being at least partially inhibited from densifying at the predetermined temperature by the presence of the carbonaceous material.key aspect of the invention is subsequently removing with an oxidizing ambient some or, all of the carbonaceous residue at a predetermined temperature for the optimization of the physical characterization of the fired metallic component in ceramic material without adversely affecting distortion and alignment of the metallic feature.

Abstract: Disclosed is a multilayer ceramic substrate for electronic applications including:(a) at least one internal layer having vias at least partially filled with a metallic material;(b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer; and(c) a cap of material interposed between the aligned vias.Also disclosed is a method of forming the multilayer ceramic substrate.