Abstract: A method of fabricating a semiconductor device on a semiconductor wafer of the type having a plurality of active layers that includes the steps forming a layout for at least one of the active layers where the layout contains a plurality of active region segments and a plurality of inactive regions. The layout is then modified by adding a plurality of dummy active segments in the inactive regions. The layout is further modified by removing a plurality of sub-regions from the active regions to form a plurality of sub-inactive regions. The semiconductor wafer is then processed using the modified layout to provide an environment during the processing of the active layer wherein the relative area of the active to the inactive regions is substantially equal across the wafer.

Abstract: A method for forming contacts on an integrated circuit that are self-aligned with the wiring patterns of the integrated circuit. In the method a thicker lower layer of a first material and a thinner upper layer of a second material are formed on a substrate. The features of the metal wiring is patterned first on the upper layer. The wiring pattern trenches are etched through the thinner surface layer, and partially through the second, thicker layer. After the wiring pattern is etched, the contacts for the wiring layer are printed as line/space patterns which intersect the wiring pattern. The contact pattern is etched into the lower, thicker layer with an etch process that is selective to the upper thinner layer. The contact is only formed at the intersection point of the wiring image with the contact image, therefore the contact is self-aligned to the metal.

Abstract: A method for fabricating a connector structure for interconnecting integrated circuit chips. The method includes the steps of patterning, masking and etching a substrate to form protrusions on the top and/or bottom surfaces of the substrate. Then the protrusions are preferentially etched to form truncated protrusions. An integrated circuit chip having pads on its surface is then joined to the top and/or bottom sides of the substrate. The protrusions and pads are coated with an electrically conductive metal. The substrate and the integrated circuit chips are joined and aligned together such that the truncated protrusions mate with the pads. Metal-coated vias are formed through the substrate to electrically connect the integrated circuit chips on the surfaces of the substrate.

Abstract: A semiconductor circuit for providing decoupling capacitance to an integrated circuit voltage supply that includes a decoupling capacitance comprised of an array of memory cells connected in series at a node and a source of biasing voltage connected to the array of memory cells at the node for maintaining the voltage level at the node lower than the voltage level of the voltage supply.

Abstract: Circuits with SOI devices are coupled to a body bias voltage via a switch for selectively connecting the body bias voltage signals to the SOI device body. NMOS or PMOS SOI devices are used for the switched body SOI device and a FET is used for the switch and the gate terminal of the SOI device is connected to the FET device. The gate of the SOI device controls the FET switch connection of the body bias voltage signals to the SOI device to adjust the threshold value of the SOI device. Logic circuits incorporating the SOI devices are also disclosed, and the fabrication process for the SOI devices as well.

Abstract: Apparatus and process are disclosed by which to disable a computer's access to all or a part of the computer's memory system or associated peripherals, so as to protect the computer from accidental or malicious damage of data files or programs that may result from the activity of computer users or computer viruses. This result is achieved by providing the authorized user with a token whereby the user can configure the security gateway to completely or partially disable the peripheral device without disrupting the operation of the computer or other peripherals. The principal hardware component of one embodiment of the invention is the security gateway which in a typical configuration simply adds new security functions to the programmable controllers that are typically used for an I/O controller or hard drive controller, although this is not always necessary.

Abstract: A semiconductor circuit for providing decoupling capacitance to an integrated circuit voltage supply that includes a decoupling capacitance comprised of an array of memory cells connected in series at a node and a source of biasing voltage connected to the array of memory cells at the node for maintaining the voltage level at the node lower than the voltage level of the voltage supply.

Abstract: Apparatus and methods are described for reducing power consumption in a processor. The processor includes a source of microcode instructions, a microcode instruction decode circuit, control register latches and a clock gate control circuit that is coupled to the source of microcode instructions. The clock gate control circuit searches and picks groups of clock gate control signals for the latches that are the same value (state) as control signals form a previous cycle.

Abstract: An off-chip driver circuit with compensated current source including a reference current amplifier and an output driver with a pull-up section. The reference current amplifier includes an input voltage Vcmn from an on chip current reference source. A reference current is established in the reference current amplifier by choosing the Beta of transistor in a current path. A feature of the circuit is that an output current is produced in the output lead of the driver circuit that is proportional to the current in the reference current amplifier, but with adjustments made for the supply voltage level and effective transistor channel length, Leff. Another feature of the circuit is that a reference current-voltage is established on the output lead of the reference current amplifier that is primarily determined by a multiple of the reference current but is reduced by a function of the supply voltage. In the circuit the output current of the driver is reduced linearly and predictably with the supply voltage.

Abstract: An off-chip driver circuit including an enhancement PFET, a depletion PFET, a depletion NFET and an enhancement NFET connected in series. The large enhancement PFET and large enhancement NFET turn off the OCD in tri-state and to turn off the unused half of the OCD to prevent overlap current when driving a ‘0’ or a ‘1’. A first gate signal is applied to the gate of the enhancement PFET and a second gate signal is applied to the enhancement NFET. A fixed voltage is connected to the gate of the depletion NFET and ground to gate of the depletion PFET. An output signal is obtained from a node between the depletion PFET and depletion NFET devices. In another embodiment, a reflection/overshoot sensor 60 is added. The output of sensor is connected to the body of a depletion PFET and an NFET. The feedback from sensor is such that the threshold voltage of the depletion devices are made more positive if the sensor detects that the output is being over-driven.

Abstract: A first, “known good” reference off-chip driver circuit actuated by an initial logic program (IPL) input signal has an output lead connected as one of the inputs to a comparator circuit for providing a reference off-chip driver output signal. A second off-chip driver circuit including a plurality of “n” separate driver circuit paths connected to input signal and produces output signals connected to a common node to provide output driver signals to the common node. The common node is connected to the second input of the comparator circuit for comparison with the reference off-chip driver output signal from the first off-chip driver circuit to determine the operating state of the second off-chip driver circuit with respect to the operating state of the first off-chip driver circuit.

Abstract: A processor with a memory send/received control circuit including a bus drive circuit and a detector circuit connected via control bus line to the control input of the memory. A data input line, or output line, or data input/output line is connected between the processor and the memory. A transmission line stub having a length that is incrementally variable is connected to the memory control input side of the control line 14. The impedance Z0 of the transmission line stub is equal to that of the control line and is open circuited at the end which results in voltage doubling to achieve high speed synchronization between control signals and data signals and to ensure valid data at high clock rates.

Abstract: An integrated circuit and fabrication method for an antifuse structure that includes a shallow trench oxide isolation region disposed in a silicon substrate, the oxide in the trench having a top surface recessed below the surface of the substrate to form sharp corners at each side of the trench. The substrate includes diffusion regions adjacent to the sharp corners, electrical insulation layers over the diffusion regions, and an electrical conductor is disposed over the recessed oxide in the trench. When voltage is applied on the electrical conductor, a high field point is produced at the sharp corners causing the electrical insulation layer at the corners to break down and create a short circuit between the electrical conductor and the diffusions, thus providing a fuse function.

Abstract: A method for fabricating an interconnected multiple circuit chip structure by etching a first substrate to form protrusions on its surface. Then the protrusions are preferentially etched to produce a selected shape such as a tetragonal protrusion and an integrated circuit is then fabricated on the substrate. A second substrate is preferentially etched to form recesses having a selected shape that is the complement of the selected shape of the protrusions of the first substrate and then an integrated circuit is fabricated on the second substrate. The protrusions and recesses are coated with an electrically conductive metal such as aluminum. The first and second substrates are joined and aligned together such that the protrusions mate with the recesses and the structure is annealed such that the metal coatings thereon come into contact to electrically connect the integrated circuits on the substrates. The method can also be used to electrically connect multiple chips mounted back to front.

Abstract: A dual stage voltage level predrive circuit for an integrated circuit chip including two level shifter stages in series. The voltage level shifting circuit uses single dielectric layer devices and three bias supply circuits each providing a different DC bias voltage for distributing bias voltages among the devices such that dielectric voltage stress across single dielectric layers is reduced. The first stage of the level shifting circuit receives a first input signal having a first voltage swing, converts the first voltage swing to a second voltage swing and provides a first output signal corresponding to the first input signal and having the second voltage swing. The second stage of the level shifting circuit receives the first output signal from the first stage, converts the second voltage swing to a third voltage swing and provides a final output signal having the third voltage swing.

Abstract: A multiplexer circuit that provides output data signal transitions only for valid input data signals. The multiplexer includes pass gate devices and latches responsive to valid input data signals. A logic circuit responsive to a first, slow select binary input signal and a second, fast select binary input signal provides an output gating signal when the first and second binary input signals are present in the same binary state. Each pass gate device is connected to a separate input data signal from a data signal source. The pass gate devices are also connected to the output gating signal from the logic circuit such that the pass gate devices are gated and pass the input data signals in response to an output gating signal from the logic circuit upon the occurrence of the first and second binary input signals being in the same binary state.

Abstract: A method and apparatus for conditioning an integrated circuit to always enter a desired operating state when actuated by permanently altering at least one component device. An integrated circuit is provided with at least one component transistor wherein a constant high voltage is applied only once to the drain electrode of the transistor for one predetermined period of time while concurrently a constant voltage lower than the high voltage is applied only once to the gate electrode of the transistor, thus causing a permanent channel hot-electron alteration of a gate oxide of the transistor. The integrated circuit may include a plurality of programmable circuits, each capable of assuming a plurality of readable data states when powered up, and each including a plurality of programmable devices for permanently biasing its corresponding programmable circuit to assume one of the readable states upon subsequent power ups.

Abstract: A method for forming a multilayer structure having a dimension at most substantially equal to the minimum printable image wherein a substrate structure including a lithographic feature having a first minimum printable image dimension has a layer of hybrid photoresist disposed thereon above the lithographic feature of the substrate. A mask is provided over the hybrid photoresist layer with the mask having an edge aligned with the lithographic feature to within the tolerance of the semiconductor processing technology. The hybrid photoresist layer is exposed through the mask and developed to provide a window opening in the photoresist layer which is at most substantially equal to the minimum printable image.

Abstract: Off-chip driver and receiver circuits for multiple level memory applications including a voltage sensing circuit that provides an output voltage adjust signal having different voltage levels corresponding to different external voltage levels of the memory circuit. The off-chip driver circuit is connected to the voltage adjust signal and has an output signal transition slew rate that varies in response to the voltage level of the voltage adjust signal. The circuit is also connected to the voltage adjust signal and includes a filter circuit having a time constant that adjusts the noise immunity of the receiver in response to the voltage level of the voltage adjust signal.

Abstract: A mask and a fabrication method therefor that incorporates a patterned radiation blocking layer such as a second patterned high-reflectivity dielectric coating on the back surface of the mask which also includes a first patterned reflective coating on the front. This second high-reflective dielectric coating referred to as a premask, eliminates most of the laser energy directed onto the mask that leads only to substrate heating without effecting the laser energy transmitted through the open area of the mask. The open areas of the premask are sufficiently larger than those in the mask so not to interfere with the illumination geometry (i.e. forms a greater angle than the illumination numerical aperture).