Abstract: A holder apparatus acts in frictional cooperation with books, notebooks, folders, and other hand held rigid or semi-rigid binders containing reading material. The bolder allows one-handed manipulation of the book, notebook, folder, or binder free of accidental dropping or slipping. A strap having inelastic and elastic portions, and fasteners on each free end, allows the strap to encircle the book, notebook, folder or binder. A strap having a single inelastic or elastic portion, and fasteners, allows the strap to encircle the book, notebook, folder or binder. The fasteners releasably attach the strap to the book, notebook, folder or binder. A hand piece attached to the strap is adapted to receive a person's hand and allows easy manipulation and holding of the book, notebook, folder or binder. The hand piece is adjustable to accommodate both large and small hands of a user.

Abstract: Composite bond pad structure and geometry increases bond pad density and reduces lift-off problems. Bond pad density is increased by laying out certain non-square bond pads which are shaped, sized and oriented such that each bond pad closely conforms to the shape of the contact footprint made therewith by a bond wire or lead frame lead and aligns to the approach angle of the conductive line to which it is connected. Alternating, interleaved, complementary wedge-shaped bond pads are discussed. Bond pad liftoff is reduced by providing an upper bond pad, a lower bond pad and an insulating component between the upper and lower bond pads. At least one opening is provided through the insulating component, extending from the bottom bond pad to the upper bond pad. The at least one opening is aligned with a peripheral region of the bottom bond pad and is filled with conductive material.

Abstract: Methods of polishing, particularly chem-mech polishing a semiconductor substrate to planarize a layer, to remove excess material from atop a layer, and to strip back a defective layer are disclosed. Aluminum oxide particles having a small, well controlled size, and substantially in the alpha phase provide beneficial results when polishing.

Abstract: Serial high speed interconnect devices are integrated with semiconductor devices to reduce the number of input-output pins required for communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices transfer the data serially at a rate fast enough to replace large parallel data and address buses that require one conductive path per bit of data. Eliminating large parallel data and address buses allows the integrated circuit assembly containing the semiconductor device to be smaller, simpler and lower in cost. The subsequent reduction in the size of the integrated circuits improves the layout density of electronic systems and reduces crosstalk and other undesirable signal transfer anomalies. The serial high speed interconnection devices are implemented with a low cost serial interface logic technology that may be easily implemented on a semiconductor die in conjunction with the main logic circuits.

Abstract: A planar substrate is attached to a face of a semiconductor die. The semiconductor die is electrically connected to a printed wiring board and encapsulation material covers the peripheral edges of the planar substrate, semiconductor die, and means for interconnecting the die and printed wiring board. An exterior face of the planar substrate remains exposed and may be utilized in pick and place automatic assembly. The exterior face of the planar substrate may also be utilized for attachment of an external heat sink for improved heat transfer from the semiconductor device. The planar substrate may be comprised of silicon, ceramic, metal or any other stiff material so long as the temperature coefficient of expansion is similar to that of the semiconductor die. A flip-chip semiconductor die may also be utilized without a planar substrate wherein the nonactive face of the die is exposed.

Abstract: A multiple match detection circuit including an array of N and P-channel pull-up and pull-down devices receiving a corresponding array of hit line signals for developing complementary bit line signals, which are provided to the respective inputs of a differential amplifier. Respective buffers drive the bit line signals to a maximum voltage differential in normal mode. For each hit line asserted, the pull-up and pull-down devices modify the voltage of the corresponding bit line by an incremental amount, thereby decreasing the bit line differential. The differential amplifier switches to indicate an error when the polarity of the differential voltage between the bit lines is reversed relative to the normal state. Any given single hit line does not cause enough of a voltage change to reverse the polarity of the differential voltage of the bit lines.

Abstract: A fast memory system including one or more asymmetrical sense amplifiers precharged to a first logic state and optimized to slew very fast towards the first logic state. Each sense amplifier is coupled to a corresponding pair of complementary bit lines, which are preferably precharged. When enabled, each sense amplifier tends towards an opposite, default logic state opposite the first logic state when sensing the precharged bit lines. Control logic enables a corresponding precharge amplifier to precharge the bit lines, and then enables the sense amplifier after the assertion of a clock signal. Also, the control logic enables a corresponding pull-up device to precharge the output of each sense amplifier. Thus, the sense amplifier begins in the first, precharged logic state and slews towards the opposite, default logic state. The control logic then asserts a word line select signal to a corresponding memory cell, which drives a voltage differential on the bit lines to assert a data bit.

Abstract: A word line decoder gate including a plurality of parallel-coupled devices coupled to a common node for receiving and decoding an address upon assertion of a clock signal, where each parallel device receives a corresponding address signal or its inverted counterpart depending upon the particular address being decoded. A precharge device is coupled to the common node for keeping it at a first voltage level until the clock signal is asserted, and two series coupled charge devices are coupled between a source voltage and the common node, which charge devices attempt to charge the common node to a second voltage level during a time period while the clock signal is asserted and a delayed clock signal remains deasserted. A delay device receives the clock signal and asserts the delayed clock signal. However, any one or more of the parallel devices, if activated, provides a current path from said common node to override the two charge devices to keep the common node substantially at the first voltage level.

Abstract: A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed on one surface of a printed wring board and is divided into electrically insulated conductive segments. Each of the conductive segments is connected to an external connection, and includes one or more interconnects that can be directly connected to a semiconductor die. The conductive segments are surrounded by an array of bond fingers which serve to connect the semiconductor die to further external connections, such as signal connections. The present invention is especially advantageous in the fabrication of pin grid array (PGA) and ball grid array (BGA) type integrated circuit packages.

Abstract: A self-timed memory control system including a dummy row and column of memory cells along adjacent edges of a core memory array. Control logic receives an external clock signal and initiates address decoding, and also asserts a sense enable signal for activating the sense amplifiers. A dummy driver receives the enable signal and asserts a select signal on a dummy select line, which causes a memory access to occur in the dummy portion simultaneously with each access of the core memory array. A fixed memory cell in the dummy path always asserts a logic zero to a dummy sense amplifier, which senses the logic zero and respondingly asserts a timing signal. The dummy sense amplifier is biased with a voltage offset to favor a logic one, so that the timing signal is preferably delayed until after the output data of the core memory array has stabilized.

Abstract: A dambar-less leadframe is sandwiched between two printed circuit boards (PCBs). The PCBs form a major portion of the package body, and isolate the leadframe leads from plastic molding compound. In one embodiment, an upper PCB (substrate) is formed as a ring, having an opening containing a heat sink element. A lower PCB is also formed as a ring, and has a smaller opening for receiving a die. The back face of the die is mounted to the heat sink. The exposed front face of the die is wire bonded to inner ends of conductive traces on the exposed face of the lower PCB. The outer ends of the traces are electrically connected to the leadframe leads by plated-through vias extending through the two PCBs. The plated-through vias additionally secure the sandwich structure together. Plastic molding compound is injection/transfer molded over the front face of the die and the bond wires, forming a partially-molded package. In another embodiment, the upper PCB is a solid planar element.

Abstract: An engine which employs a cam follower mechanism to reduce wear and reduce the size of an assembled engine. The cam follower mechanism utilizes guide rails located to reduce side thrust on the valve stem. The engine employs a high speed quill shaft to synchronize independent cam shafts existing in each of a plurality of interconnected engines. The engine is assembled using a single size fastener to provide a uniform stress gradient within the engine. The engines are interconnected utilizing O-ring seals. The engine provides a piston crown utilizing a connecting rod directly connected to the bottom surface of the piston crown. The piston crown is stabilized along the longitudinal cylinder axis by a rail guide. Connecting rods are provided which require less than one hundred eighty degrees (180.degree.) circumference of a crankshaft pin for support so that a plurality of connecting rods can be associated with a single crankshaft pin.

Abstract: The present invention relates to a method for generating a low pressure plasma circulating in a planar direction within a process enclosure. The invention generates plasma having substantially uniform density characteristics across a planar axis. The invention achieves improved uniformity of the plasma density by delivering more radio frequency power toward the periphery of the circulating plasma than toward the center of the plasma. Increasing the periphery power to the circulating plasma compensates for increased plasma losses due to interaction with the side walls of the process containment enclosure.

Abstract: A semiconductor device assembly utilizing a grid array of conductive epoxy for connecting it to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.

Abstract: The present invention relates to a method of and system for reducing the drive requirements for the input and output pads of an integrated circuit die. An intermediate structure is added between the output connection pad and substrate to reduce the amount of electron charge required to charge the output pad capacitance to a substantially negligible amount. In addition, an intermediate structure my be added between an input connection pad and substrate to reduce the amount of electron charge required to charge the input pad capacitance to a substantially negligible amount. The present invention connects a transistor amplifier driver to the intermediate structure between the output pad and substrate to charge the capacitance that exists between the intermediate structure and substrate so that the voltage potential of the intermediate structure is substantially the same value as the output pad voltage value.

Abstract: A low-cost high-performance technique for providing bit-mapped graphics display controllers is described whereby video frame buffer memory and video controller functions are integrated together on a single chip, permitting very wide video memory formats without the usual penalties of high pin count, package count, and wiring complexity. The wide video memory format relaxes timing requirements on the video frame buffer memory and provides greater accessibility of the video frame buffer memory for pixel data accesses other than display refresh accesses.

Abstract: An efficient technique or providing ROM memory on a microprocessor local bus is described whereby a ROM and all necessary address decoding and control circuitry is incorporated in a single integrated circuit. By doing this, only one chip is required to add ROM to a microprocessor local bus, saving considerable space and power over discrete implementations. The ROM is implemented in a wide memory format, matching the bus width of the microprocessor to which it is connected. This permits full-speed access to the local bus ROM, and eliminates any need for such techniques as ROM "shadowing".

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A semiconductor die having raised conductive bumps on its surface for connecting to other devices or systems is disposed on a face of a preformed planar structure (interposer) having through holes. Solder joints with conductive bumps on an underlying substrate are formed in the through holes. In one embodiment, the interposer is dissolvable. In another embodiment, the through holes are at least partially filled with a conductive material for electrically connecting to the die. In another embodiment, the through holes are angled so that the interposer acts as a pitch spreader or adapter. In another embodiment, ball bumps are disposed on a side of the interposer away from the die. Various other embodiments are directed to multi-tier flip-chip arrays employing preformed planar structures between tiers.

Abstract: A technique for reducing thermally-induced mechanical stresses on bond pads in semiconductor device assemblies is accomplished by grouping (laying out) the bond pads in two parallel rows, approximately centered about a central axis of the die. Further, the bond pads of one row are axially offset from the bond pads of the other row, thereby forming a two-row zig-zag linear configuration of bond pads. The "axis" is a line preferably passing through a thermal centroid of the die. By keeping the bond pad layout close to the axis, lateral thermally-induced displacements of the bond pads relative to the axis can be minimized and controlled. Longitudinal (axial) displacements of the bond pads are accommodated by flexing, rather than compression, of conductive lines (such as leadframe fingers) connecting to the bond pads and entering the die perpendicular to the axis.