Abstract: An anisotropic conductive material contains low melting point electrically conductive particles in a thermosetting resin. The low melting point particles have a solidus temperature of at least 125° C., a peak temperature of at most 200° C., and a temperature difference between the solidus temperature and the peak temperature of at least 15° C. The maximum particle diameter of the low melting point particles is smaller than ¼ of the spacing between adjoining conductors atop which the anisotropic conductive material is to be disposed.

Abstract: A conventional low-temperature solder containing Pb or Cd had problems with respect to environmental pollution. A conventional low-temperature lead-free solder had a liquidus temperature which was too high for low heat resistance parts having a heat resistance temperature of 130° C., or it was brittle or had low mechanical strength. A lead-free low-temperature solder according to the present invention comprises 48-52.5 mass % of In and a balance of Bi, and most of the structure is constituted by a BiIn2 intermetallic compound which is not brittle. Zn or La can be added in order to further improve solderability, and a small amount of P can be added to prevent corrosion at high temperatures and high humidities.

Abstract: A submersible aerator has an impeller which includes blades having partition walls which separate liquid passages and air passages and which is accommodated within a guide casing for rotation between a lower surface of an intermediate plate having an air suction opening and an upper surface of a suction cover having a liquid suction opening. The liquid passages and the air passages meet through communication portions at radially outer ends of rear-side blade partition walls. Intermediate blades are provided at radially outer ends of the liquid passages. A conical space is defined between the blade lower end surfaces and the suction cover upper surface such that the space, which is wide at a portion adjacent to the liquid suction opening, becomes narrower toward a radially outward region including guide vane tongues. A plurality of support legs and a plurality of straining projections are integrally formed on the lower surface of a peripheral portion of a bottom wall of the guide casing.

Abstract: A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Abstract: An inexpensive lead-free solder which prevents the occurrence of tin pest at extremely low temperatures and which has good wettability and impact resistance has a composition consisting essentially of, in mass %, Cu: 0.5-0.8%, Bi: at least 0.1% and less than 1%, Ni: 0.02-0.04%, and a remainder of Sn.

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one of Ag and Sb in a total amount of at most 4 wt %, and/or at least one of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: A clamping apparatus includes a frame and a pair of opposing clamping arms mounted on the frame for movement towards and away from each other to grasp or release a load. In one embodiment, each clamping arm is guided for movement with respect to the frame by an adjustable bushing which can be rotated to adjust the position of the bushing with respect to the clamping arm. In another embodiment, each clamping arm defines a four-bar linkage which controls the angle with respect to the vertical of a contact portion of the clamping arm. The clamping apparatus may be mounted on a lift truck or other support member by a connector which permits the angle of the clamping apparatus with respect to the horizontal to be adjusted and which enables the clamping apparatus to pivot about an axis between a position in which it is disposed outboard of the axis and a position in which is it disposed forward of the axis.

Abstract: In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded. In a wave soldering bath according to the present invention, a cylinder is disposed at one end of a duct, a spiral pump is installed in the cylinder, and the width of a nozzle opening is made narrower than the width of the duct.

Abstract: The suction ports of a hot air blowing heater are arranged in a zigzag shape crossing the direction of travel of a printed circuit board, and hot air discharge nozzles project from inside or alongside the suction ports. Accordingly, in the reflow furnace according to the present invention, hot air discharged from the hot air discharge nozzles does not collide with hot air sucked into the suction ports, and turbulence does not take place.

Abstract: A clamping apparatus includes a frame and a pair of opposing clamping arms mounted on the frame for movement towards and away from each other to grasp or release a load. In one embodiment, each clamping arm is guided for movement with respect to the frame by an adjustable bushing which can be rotated to adjust the position of the bushing with respect to the clamping arm. In another embodiment, each clamping arm defines a four-bar linkage which controls the angle with respect to the vertical of a contact portion of the clamping arm. The clamping apparatus may be mounted on a lift truck or other support member by a connector which permits the angle of the clamping apparatus with respect to the horizontal to be adjusted and which enables the clamping apparatus to pivot about an axis between a position in which it is disposed outboard of the axis and a position in which is it disposed forward of the axis.

Abstract: A lift truck includes a guide member secured to a mast of the lift truck and a guided member secured to a carriage vertically movable along the mast. The guided member engages with the guide member to resist twisting moments acting on the carriage and enable the carriage to move smoothly along the mast. A lift truck attachment for mounting on a lift truck includes a latching member which can restrict movement of the attachment with respect to the lift truck in a fore-and-aft direction of the lift truck.

Abstract: A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing ?t and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of a conventional heater for blowing hot air. In a reflow furnace according to the present invention, the total area per unit area of discharge holes formed in a perforated plate in a heater for blowing hot air installed in a main heating zone is 1.5-5 times the total area per unit area of the discharge holes formed in a perforated plate of a heater for blowing hot air installed in a preheating zone. A heater for blowing hot air has a body divided into three chambers by partitions.

Abstract: In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.

Abstract: In a solder paste which is a mixture of a flux and low melting point metal particles, low melting point metal fine particles manufactured by a conventional method or apparatus therefor include particles having widely varying particle diameters. Accordingly, the solder paste could not completely fill the minute holes in a mask for application to minute solder portions by printing, or mask removability was poor. According to the present invention, a mixture of a heat resistant continuous phase liquid and coarse metal particles in molten state is passed through a porous membrane to form the coarse low melting point metal particles into fine particles with a predetermined diameter. An apparatus according to the present invention comprise a porous membrane between a heating and dispersing mechanism and a cooling mechanism, and a pressure vessel connected to the heating and dispersing mechanism for applying a high pressure to the heating and dispersing mechanism.

Abstract: In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.

Abstract: In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-containing gas discharged from a furnace at a temperature of at least the liquefication temperature of the fumes until the gas reaches a removal device so that fume solids do not adhere to the inside of piping. A removal device installed on a reflow furnace according to the present invention comprises an elongated-hole filter and a labyrinth filter, and fumes are completely removed by both filters.

Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.

Abstract: A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tank 1 has a tank body 1a which houses molten solder S, a discharge pump 5 which pumps molten solder S, a discharge nozzle 4 which spouts molten solder S which was sent to it by the discharge pump 5 upwards, a duct 2 having the discharge pump 5 installed at one of its ends and the discharge nozzle 4 installed at its other end, an oxidation preventing member 22 which has a prescribed size and which floats on the surface of the molten solder S, and an engaging means 13 which controls rotation of the oxidation preventing member 22 in a horizontal plane.

Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.