Abstract: A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.

Abstract: Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn and a remainder of Cu to at least the melting point of Cu without the pieces contacting each other to give them a spherical shape and cooling the resulting spheres to form solid balls. The minute copper balls which are obtained comprises 0.01-0.5 wt % of Zn and a remainder of Cu and have a spherical shape with a diameter in the range of 50-1000 &mgr;m.

Abstract: The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An electroplated coating is applied to a portion to be soldered of a difficult to solder material, the difficult to solder material is then passed through molten solder to which ultrasonic waves are applied, and a large amount of solder is adhered only to solder plated portions.

Abstract: A lead-free solder paste comprises an Sn—Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).

Abstract: A module for a modular conveyor belt has a plurality of projections on its top surface for supporting objects. The module may include drainage openings through which fluids can drain from objects disposed on the projections. The projections can be used to prevent objects from adhering to the top surface of the module and/or to immobilize the objects during movement of a conveyor belt including the module.

Abstract: Discarded printed circuit boards are sorted according to the alloying elements in solder used on the printed circuit boards. After sorting, the printed circuit boards are heated to melt the solder, and the molten solder is collected.

Abstract: A lead-free journal bearing includes a cylindrical ferrous backing and a bearing alloy layer comprising a bearing alloy powder consisting essentially of 7-13 mass percent of Sn, 0.7-2 mass percent of Ag, optionally at most 0.5 mass percent of molybdenum disulfide, optionally at most 2 mass percent of graphite, and a remainder of Cu sintered to an inner surface of the backing. The bearing is particularly suitable for use in construction equipment.

Abstract: A chamber has a lid that permits opening and closing of the chamber for inserting or removing a cell culture from the chamber while the chamber is in a stack of chambers without removing any of the chambers from the stack. The lid of the chamber may have one or more ports which enable substances to be introduced into or removed from the chamber when the chamber is sealed by the lid. In one embodiment, the lid is a side wall of a rectangular chamber in a stack of rectangular chambers. Spacers may be provided between the chambers of the stack to provide space between the chambers and restrict horizontal movement of the chambers relative to each other. A flexible container containing an atmosphere may be connected to a port of the chamber, and the atmosphere may be transferred to the chamber by compressing the flexible container. After a cell culture is introduced into the chamber, the stack of chambers may be placed into an incubator.

Abstract: A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2-1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts.

Abstract: A frame for eyeglasses has a clip for grasping a shirt pocket mounted on a lateral surface of one or both temple pieces of the frame. The clip may open and close by flexing, or by pivoting of the clip with respect to the temple piece on which it is mounted.

Abstract: A lead-free solder alloy which has a relatively low melting temperature and which is suitable for soldering electronic devices consists essentially of from 5 to 9 mass % of Zn, from 2 to 15 mass % of Bi, optionally from 0.001 to 1 mass % of P or from 0.001 to 0.1 mass % of Ge, and a balance of Sn. The solder alloy has a liquidus temperature of at most 220° C.

Abstract: A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 &mgr;m Ra and then fine finished by polishing to a roughness of at most 0.1 &mgr;Ra.

Abstract: A guide system for a forklift includes a single guide rail extending along a path and rollers mounted on the forklift for engagement with opposite sides of the rail. The rollers can move down the rail as the wheels on the forklift become worn.

Abstract: A plated lead for electrical devices is plated with a Sn-based lead-free alloy containing 0.001-0.1 weight percent of Ga. The formation of oxides in a hot dipping bath can be suppressed by the presence of 0.001-0.1 weight percent of P in the alloy.

Abstract: Members to be soldered, such as printed circuit boards having electronic parts mounted thereon, are subjected to flow soldering in a solder bath with a Cu-containing lead-free solder. When the molten solder in the solder bath falls below a prescribed level, the molten solder is replenished with a material having a lower Cu content than the initial composition of the solder bath. Flow soldering can be continued for long periods with the Cu content of the solder bath being maintained substantially constant.

Abstract: A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.

Abstract: A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150° C., and cleaning after soldering is no longer necessary.

Abstract: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

Abstract: A cylindrical container with a bottom has an opening in which a projection is installed, the projection having a shape which will not deform solder balls when inserted into a packed layer of solder balls within the container. Its shape is such that its cross section has a streamlined or inverted conical shape, or it is cylindrical with a tip having a semi-spherical or inverted conical shape. Blackening, electrical charging, and deformation of solder balls packed in the container can be prevented during transport.

Abstract: A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10° C./second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength.