Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.

Abstract: The present invention relates to a pitch-variable battery fixture and a battery cell formation apparatus having the same. A pitch of clamping plates of a plurality of clamping blocks is increased by a slide actuator of the pitch-variable battery fixture, and then the clamping plates are inserted into a plurality of compartments of a battery tray. The clamping plates are urged to clamp batteries by the slide actuator. The battery tray is provided for placement of the batteries, and a compressing force is exerted for shaping the batteries during a battery cell formation. The pitch-variable battery fixture is provided for clamping batteries having different thicknesses. According to the actual thickness of each battery, the thickness of the formed battery can be shaped.

Abstract: A temperature control system and method for devices under test and an image sensor-testing apparatus having the system are provided. The temperature control method for devices under test mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

Abstract: Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing.

Abstract: Systems and methods for switching between a power supply mode and an electronic load mode are disclosed. For switching from the power supply mode to the electronic load mode, the method comprises the steps of: deactivating a power element; activating a current control module and a phase-locked loop to obtain a voltage phase of a device under test; calculating a turn-on amount of the power element according to a current setting value and the voltage phase; and causing the power element to generate a load current for the device under test. For switching from the electronic load mode to the power supply mode, the method comprises the steps of: deactivating the power element; activating a voltage control module; calculating the turn-on amount of the power element according to a voltage setting value; and causing the power element to input a corresponding voltage to the device under test.

Abstract: The present invention relates to a chip transfer device capable of floatingly positioning a chip and a method for floatingly positioning a chip. When a chip is placed in a chip socket, a control unit controls an air pressure switching valve to allow at least one vent hole to be communicated with a positive air pressure source. An air flow from the positive air pressure source blows a lower surface of the chip through the vent hole, so that the at least one chip is air-floated. Accordingly, when the chip socket is communicated with the positive air pressure source, the air flow blows the lower surface of the chip in the chip socket through the vent hole, so that the chip is air-floated in the chip socket to reduce the error displacement of the chip offset.

Abstract: Herein disclosed are a surface topography measuring system and a method thereof. The method comprises the following steps: dividing a test beam into a first sub-beam, entering a reflecting mirror along a first axis, and a second sub-beam, entering an object surface along a second axis; moving the reflecting mirror for reflecting the first sub-beam at different positions on the first axis to generate N reflected beams; generating an object reflected beam, related to the second sub-beam, reflected from the object surface; generating N images, related to the N reflected beams and the object reflected beam, and each of the N images having a plurality of interference fringes; analyzing the interference fringes in each of the N images to calculate N curve formulas; calculating a surface topography of the object surface from the N curve formulas.

Abstract: A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

Abstract: Herein disclosed is an optoelectronic unit measuring device comprising an objective lens, an imaging lens, a photographing lens, and a focus adjustment module disposed in a first light path. The objective lens receives a first testing light and converts the first testing into a second testing light. The imaging lens receives the second testing light and converts the second testing light into a third testing light. The photographing lens receives the third testing light and measures beam characteristic. The focus adjustment module selectively provides a first light transmitting member in the first light path, and adjusts the third testing light to focus at a first focus position or a second focus position. Wherein the focus adjustment module comprises a first carrier plate having a first area with the first light transmitting member, and moves the first carrier plate to selectively align the first area with the first light path.

Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

Abstract: The present disclosure relates to an electronic load apparatus. An embodiment of the present disclosure includes an electronic load apparatus including: a measurement resistor, a reference circuit, a transistor, and a feedback circuit. The measurement resistor includes a first contact, a second contact, a third contact, and a fourth contact. The first contact and the second contact are located at a first end of the measurement resistor. The third contact and the fourth contact are located at a second end of the measurement resistor. A reference power (or a reference voltage) electrically connects to the reference circuit. The reference circuit and the first contact of the measurement resistor are electrically connected. The transistor includes a drain, a gate, and a source. The reference circuit and the gate of the transistor are electrically connected. One of the source and the drain of the transistor electrically connects to the second contact of the measurement resistor.

Abstract: The present application discloses a motor controller, a motor control method and a computer program product for vehicle assist control. An assist torque command for a motor device to perform vehicle assist control is generated according to an execution command of a vehicle assist determination unit and a rotor position signal and a rotor speed signal of a motor device. An original position signal of the motor device and the rotor position signal are calculated, and a position ratio calculation is performed to generate a front-order torque command. A torque damping command is generated according to the speed ratio calculation based on the rotor speed signal, and is calculated with the front-order torque command to generate an assist torque command. Thus, position information of the rotor of the motor device can be directly used in the calculation and speed information is at the same time used for an assist calculation, thereby preventing an error and solving the issue of sliding during parking.

Abstract: Herein disclosed is a voltage isolation circuit coupled to power supplies. The voltage isolation circuit comprises a series switch group controlled by a first control signal, a parallel switch group controlled by a second control signal, and a first high impedance element. The series switch group comprises a transistor arranged in a first current loop and having two channels connected to one of the power supplies respectively. The first high impedance element, coupled to the transistor in parallel, has a measurement terminal and two ends, connected to one of the power supplies respectively. When the series switch group is conducted, the power supplies are coupled in series in the first current loop. When the parallel switch group is conducted, the power supplies are coupled in parallel in a second current loop. Impedance values measured from the measurement terminal to each end of the first high impedance element are identical.

Abstract: The invention provides an optical measurement device for measuring light to be inspected. The optical measurement device comprises a light receiving module, a light splitting module, and a plurality of color filters. The light receiving module is used for converting the light to be inspected into a first parallel light. The light splitting module is used for splitting the first parallel light into a plurality of parallel lights to be inspected. Each color filter receives at least one of the plurality of parallel lights to be inspected. The plurality of parallel lights to be inspected filtered by the plurality of color filters are used to calculate tristimulus values in the CIE color space.

Abstract: The present invention relates to a low-thermal resistance pressing device for a socket, which mainly comprises a housing, an inner collar, a heat conductive pressing block, a bearing collar and a locking member. The locking member on the housing is used to lock the socket. The inner collar is threadedly engaged with the housing. The bearing collar is located between the inner collar and the heat conductive pressing block. In the case of rotating the inner collar in the housing, the bearing collar drives the heat conductive pressing block to move axially so as to exert an axial force to a device to be tested. Because the heat conductive pressing block protrudes from the upper and lower surfaces of the housing, one end thereof can be in contact with a temperature control module, and the other end thereof can be in contact with the device to be tested.

Abstract: The present invention is related to a clipped testing device, comprising a first clamping member, a second clamping member, a shaft, and a conducting member. The first clamping member has a first pin joint member and a first substrate, the second clamping member has a second pin joint member and a second substrate. The shaft detachably pivoted to a first pin joint member and a second pin joint member. The conducting member is disposed on the first clamping member and is located between the first substrate and the second substrate. The conducting member has an upper surface and a lower surface. The lower surface of the conducting member faces toward the first substrate, and at least a part of the conducting member is wavy-shaped and has a first scraping structure on the upper surface thereof.

Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

Abstract: The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.

Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

Abstract: Herein disclosed are a method and a test probe for testing an electrical component. The electrical component comprises at least a first electrode and a second electrode. The method comprises the following steps: covering the first electrode with a first conducting flexible layer; driving a first electrode contact to electrically connect a first end of the first electrode contact with the first electrode via the first conducting flexible layer; covering the second electrode with a second conducting flexible layer; and driving a second electrode contact to electrically connect a second end of the second electrode contact with the second electrode via the second conducting flexible layer. The first conducting flexible layer is an anisotropic conductive film.