Abstract: A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

Abstract: The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.

Abstract: The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

Abstract: Herein disclosed are a method and a test probe for testing an electrical component. The electrical component comprises at least a first electrode and a second electrode. The method comprises the following steps: covering the first electrode with a first conducting flexible layer; driving a first electrode contact to electrically connect a first end of the first electrode contact with the first electrode via the first conducting flexible layer; covering the second electrode with a second conducting flexible layer; and driving a second electrode contact to electrically connect a second end of the second electrode contact with the second electrode via the second conducting flexible layer. The first conducting flexible layer is an anisotropic conductive film.

Abstract: Herein disclosed is an optoelectronic measuring device. The optoelectronic measuring device comprises an objective lens, an imaging lens, a camera, and an optical path adjusting module which are disposed at the first light path. The objective lens receives a first testing light, and transforms the first testing light into a second testing light. The imaging lens receives the second testing light, and transforms the second testing light into a third testing light. The camera measures a beam characteristic of the third testing light. The optical path adjusting module, disposed between the imaging lens and the camera, comprises a mirror, the mirror moves relatively to the imaging lens according to a test command, and adjusts the distance between the imaging lens and the camera at the first light path to be a first optical distance or a second optical distance. Wherein the mirror reflects the third testing light vertically.

Abstract: A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

Abstract: An automatic mounting and demounting device and system for a motor testing platform, adapted to enable a control host to control automatic mounting and demounting between an axle of a motor under test and an axle of a testing apparatus, includes a mobile platform and a positional information sensing member. The control host controls the mobile platform according to positional information generated by the positional information sensing member, such that a carrier for carrying the motor under test is automatically driven to a corresponding position to thereby effect alignment and connection or separation of the axle of the motor under test and the axle of the testing apparatus. Therefore, preparation for the motor dynamics testing is automatically carried out effectively and correctly, thereby reducing the time and manpower required for testing-related preparation.

Abstract: The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.

Abstract: An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.

Abstract: A condensing system is used to generate a condensing layer on a surface of a test object. The condensing system includes airflow generating device and a passage device. The airflow generating device is used to generate condensing airflow. The condensing airflow has a dew point higher than a temperature of the surface of the test object. The passage device is connected to the airflow generating device, and the condensing airflow flows from the airflow generating device into the passage device. The passage device includes a flow-uniforming module. The flow-uniforming module includes at least one uniforming board. Each of the at least one uniforming board has at least a first hole.

Abstract: A separate microscopy system, applied to observe a specimen positioned on a stage and further to image the specimen on an imaging device, includes an ocular-lens unit, an adjustment unit and an objective-lens unit. The ocular-lens unit has an ocular-lens optical axis, and is manipulated to make the ocular-lens optical axis perpendicular to the stage. The adjustment unit is assembled to a side of the ocular-lens unit close to the stage. The objective-lens unit has an objective-lens optical axis, and is assembled to a side of the adjustment unit close to the stage. The objective-lens unit is manipulated to be adjusted by the adjustment unit to make the ocular-lens optical axis, the objective-lens optical axis and the imaging device co-axially and perpendicular to the stage, such that the specimen can be imaged at an imaging center position of the imaging device. In addition, an adjusting method thereof is also provided.

Abstract: An optical detecting device includes an image capturing device and a processor. The processor is coupled to a light source and an image capturing device. The processor is configured to adjust a light intensity of the light source for irradiating a correction object in order that a gray value of at least one image block, captured by the image capturing device, of the correction object matches a target correction value, and record a target light intensity while the target light intensity matches the target correction value; control the light source to irradiate light on a testing object with the target light intensity, and control the image capturing device to capture a testing object image of the testing object; and calculate ratios of a target gray value to the gray value of a plurality of pixels of the testing object image to obtain a mapping table.

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

Abstract: Herein disclosed is a device for testing batteries as subjects and a method thereof. The battery testing device comprises a power supply module and a short-circuit sensing module. The power supply module is configured to provide a first testing voltage or a first testing current. The short-circuit sensing module, coupled with the power supply module, is configured to integrate the first testing voltage or current during a first testing period, thereby calculating a first output energy provided by the power supply module. The short-circuit sensing module also determines whether the first output energy exceeds a predetermined energy range; when the range is exceeded, the same module generates an error signal. Wherein the short-circuit sensing module generates an error count by calculating during a second testing period the number of times the short-circuit sensing module generates the error signal.

Abstract: A rotating buffer station for a chip mainly comprises an upper cover plate, a rotatable plate, a movable jaw member and a lower base. The upper cover plate is arranged on the lower base and formed with a guide slot. The rotatable plate is located between the lower base and the upper cover plate and formed with a cam slot. The rotatable plate is pivotally coupled to the lower base. The movable jaw member is slidably engaged with the cam slot and the guide slot. When the rotatable plate is rotated, the cam slot forces the movable jaw member to move radially along the guide slot so as to form a chip socket. Accordingly, with rotation of the rotatable plate, the cam slot forces the movable jaw member to move radially along the guide slot so that the chip socket can be resized to hold various differently-sized chips.

Abstract: An image inspection method includes capturing a target object image, which the target object image comprises a plurality of graphical features; choosing a block image comprising a specific graphical feature of the plurality of graphical features from the target object image; capturing all the graphical features of the block image to obtain a region of interest (ROI); executing a filtering process or a recovering process on the ROI to obtain a pre-processed region; and inspecting, according to the pre-processed region, the target object image to determine whether the target object image has defects.

Abstract: An electronic load apparatus is provided and adapted to allow an enhanced driving circuit to be disposed between a voltage-dividing circuit and power components to ensure the driving capability of the power components not coupled to a control circuit to thereby adjust a response voltage quickly, shorten a response time period and thus increase overall response speed, suppress transient voltage variation and thus preclude a signal delay otherwise arising from a load circuit, allow the power components series-connected in an electronic load apparatus to be driven quickly, reduce the risk of damaging the power components, and enhance the stability and reliability of the electronic load apparatus.

Abstract: An apparatus and a method provide a high temperature test and a low temperature test. The apparatus mainly includes a depressing head and a test base, wherein the depressing head includes a cooling module, a heating module, and a heat dissipation module therein, the heat dissipation module includes a finned heat sink and a heat conduction member, and the heat conduction member is thermally coupled to the heating module and the finned heat sink. When the low temperature test is performed, an electronic component is cooled by filling liquid nitrogen into the cooling module of the depressing head. When the high temperature test is performed, the electronic component is heated by the heating module. If the temperature of the electronic device is higher than a predetermined high temperature, the electronic device is cooled by the heat dissipation module.

Abstract: An automatic fluorescence detection system includes a base and an optical assembly. The base has a detecting region. The optical assembly includes a fluorescent image-capturing device, an illumination device and a field lens. The illumination device includes a first annular illumination module and a second annular illumination module surrounding a center axis of the fluorescent image-capturing device. Lights emitted by the first annular illumination module and the second annular illumination module travel along a light-traveling path to project onto the detecting region. A distance between the first annular illumination module and the center axis is smaller than that between the second annular illumination module and the center axis. The field lens is disposed in correspondence with the detecting region. Spacing between the field lens and the detecting region is ranged from 15.0 cm to 30.0 cm.

Abstract: A fixture assembly for testing a surface emitting laser diode and a testing apparatus having the same are provided. The fixture assembly comprises a base, an upper cover and a latch mechanism. The base includes at least one pocket, and at least one electrical contact interface disposed in the pocket. The upper cover includes a body, an abutting block and a pressing member disposed in the body. The abutting block is engageable with the body for slidable movement with respect to the body. The latch mechanism is disposed on the base and the upper cover, and is configured to selectively connect or disconnect the base to or from the upper cover. When the latch mechanism is operated to connect the base to the upper cover, the pocket and an opening of the abutting block form into a through cavity through which the laser diode emits the laser beam.