Abstract: Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.

Abstract: A composition is capable of curing via condensation reaction. The composition uses a new condensation reaction catalyst. The new condensation reaction catalyst is used to replace conventional tin catalysts. The composition can react to form a gum, gel, rubber, or resin.

Abstract: The present disclosure relates to cosmetic compositions comprising an organosilane (A) having the formula: (R1)n(R2O)(3-n)SiR3O(CH2CH2O)a(C3H6O)bR4 where n is 1, 2, or 3, a?1, b may vary from 0 to 30, with the proviso a?b, R1 is a hydrocarbon group containing 1 to 12 carbon atoms, R2 is hydrogen or an alkyl group containing 1 to 6 carbon atoms, R3 is a divalent hydrocarbon group containing 2 to 12 carbon atoms, R4 is hydrogen, R1, or an acetyl group; and a cosmetic ingredient (B), and optionally in a cosmetically acceptable medium.

Abstract: A hydrosilylation process is used to prepare a polyorganosiloxane having clustered functional groups at the polyorganosiloxane chain terminals. The ingredients used in the process include a) a polyorganosiloxane having an average of at least 2 aliphatically unsaturated organic groups per molecule, b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule and at least 4 silicon bonded hydrogen atoms for each aliphatically unsaturated organic group in ingredient a), c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more curable groups; and d) a hydrosilylation catalyst. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

Abstract: A method for decreasing the vapour permeability of a water and air barrier treated substrate that includes treating the substrate with a liquid applied, vapour permeable air and water barrier coating composition comprising a cross-linked polysiloxane dispersion composition.

Abstract: Provided in various embodiments are surface-modified hydrogels and hydrogel microparticles, methods for their preparation, and uses thereof for delivery of personal care and healthcare active ingredients, and agricultural active ingredients. In some embodiments, such hydrogels and hydrogel microparticles comprise surface coatings that are resistant to solvent washing and can act as barriers for the migration of water and/or water-compatible alcohols and actives soluble therein.

Abstract: A curable phenylorganosiloxane polymer composition comprising: (a) 100 parts by weight of a phenylorganosiloxane having a viscosity of at least 10000 mPa·s at 25° C. and at least two reactive groups per molecule selected from (i) —OH or hydrolysable groups and (ii) unsaturated groups; (c) 0 to 500 parts by weight of fillers per 100 parts by weight of (a); (d) a suitable cure package comprising a cross-linker and a catalyst the suitable cure package being selected from a silane or polyorganosiloxane and a condensation catalyst when (a) is (a) (i) or a hydrosilylation catalyst when (a) is (a) (ii); and (b) 0.1 to 300 parts by weight of at least one phenyl siloxane resin per 100 parts by weight of (a). The compositions are especially useful in sealants (particularly in sealants for insulating glass units (IGUs), due to their low gas permeability), in conformal coatings and for corrosion protection.

Abstract: In a process for separating a solid material from a suspension of the solid material in water, an organopolysiloxane polyalkylene oxide copolymer comprising a branched organopolysiloxane structure is added to the suspension of solid material in water and the suspension is drained. The organopolysiloxane polyalkylene oxide copolymer comprising a branched organopolysiloxane structure increases the rate of drainage of the suspension.

Abstract: A release coating composition is prepared comprising a polyorganosiloxane (A) having alkenyl groups, a crosslinking agent (B) having organohydrogensiloxane groups, a catalyst for the hydrosilylation reaction between (A) and (B), and an anchorage additive for enhancing the adhesion of the composition to a polymer film substrate. The anchorage additive is the reaction product of a fluid polyorganosiloxane (C) containing at least one alkenyl group and at least one silanol group with a hydrolysable silane (D) containing at least one epoxide group. The curable silicone release coating composition can be applied to a substrate known as a ‘liner’ retaining a label, which liner can for example be paper or a polymer film, and cured.

Abstract: Chemical processes comprise selectively synthesizing diisopropylamino-disilanes and reduction of chloride in amin-osilanes, and the compositions comprise the diisopropylamino-disilanes and at least one reaction by-product prepared thereby. The diisopropylamino-disilanes are diisopropylamino-pentachlorodisilane and diisopropylamino-disilane.

Abstract: An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each —O—Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.

Abstract: An aryl group-containing siloxane composition is formed by introducing an alkaline earth-metal as a part of the reaction product of an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule in the presence of a hydrosilylation catalyst, wherein at least one of the organopolysiloxanes includes an aryl group. The alkaline earth metal may be introduced via a heat stability composition or may alternatively be pre-reacted with the organopolysiloxane having at least two alkenyl groups per molecule. The aryl group-containing siloxane compositions may be utilized as an encapsulating layer for a light emitting device.

Abstract: A hydrophobic article includes a substrate and a nanoparticle layer disposed on the substrate and including nanoparticle agglomerates wherein the nanoparticle agglomerates have an average volume based size of at least 100 nanometers as determined using light scattering via ISO 13320. The hydrophobic article also includes a binder layer disposed on and in direct contact with the nanoparticle layer and including an oxidatively cured product of a silicon-based resin and an outermost layer that is disposed opposite the substrate and on and in direct contact with the binder layer. The hydrophobic article has a water contact angle of greater than or equal to 90 degrees as measured on the outermost layer of the hydrophobic article and determined using modified ASTM D5946-04.

Abstract: A composition contains (A) a hydrosilylation reaction catalyst and (B) an aliphatically unsaturated compound having an average, per molecule, of one or more aliphatically unsaturated organic groups capable of undergoing hydrosilylation reaction. The composition is capable of reacting via hydrosilylation reaction to form a reaction product, such as a silane, a gum, a gel, a rubber, or a resin. Ingredient (A) contains a metal-ligand complex that can be prepared by a method including reacting a metal precursor and a ligand.

Abstract: An emulsion includes a liquid continuous phase and a dispersed phase including a cross-linked aminosiloxane polymer. The cross-linked aminosiloxane polymer includes a first siloxane backbone, a second siloxane backbone, and at least one intramolecular structure cross-linking a silicon atom of the first siloxane backbone and a silicon atom of the second siloxane backbone. The intramolecular structure has the chemical structure: (Formula (I)) wherein X is chosen from the following groups; (Formula (II); (Formula (III)); or (Formula (IV)) wherein each R is independently a C-1-C-10 hydrocarbon group, each R1 is independently a C-1-C-10 hydrocarbon group, each R2 is independently a hydrogen atom, OH, a C-1-C-12 hydrocarbon group, a phenyl group, R?(OR?)m wherein m is 1 to 3, or R?OH, wherein each of R? and R? is independently an alkyl group, and wherein a is 0 or 1. This disclosure also provides a method of forming the emulsion.

Abstract: A curable composition comprises (A) a polyfunctional acrylate; (B) a fluoro-substituted compound having an aliphatic unsaturated bond; (C) an organopolysiloxane having at least one acrylate group; and (D) a reinforcing filler. A cured product formed by curing the curable composition is also disclosed. A method of forming the cured product comprises applying the curable composition on a substrate. The method further comprises curing the curable composition on the substrate so as to form the cured product on the substrate.

Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Abstract: A silicone emulsion comprises: (A) a silicone compound comprising an anchorage additive for enhancing the adhesion to a polymer film substrate; (B) at least one surfactant; and (C) water. The anchorage additive is the reaction product of (A1) a fluid polyorganosiloxane containing at least one alkenyl group and at least one silanol group with (A2) a hydrolysable silane containing at least one epoxide group. A water-based anchorage additive comprises the silicone emulsion. A silicone release coating composition comprises: (X1) the silicone emulsion; and (X2) at least one curable silicone composition, e.g. a water-based silicone release coating composition. The curable silicone release coating composition may be applied to a sheet-form substrate and cured to form a release-coated layer having good release property and improved rub-off resistance on the substrate.

Abstract: A process for the production of a polymer composition is disclosed. The polymer composition comprises an organopolysiloxane dispersed in a thermoplastic organic polymer liable to thermo-radical degradation or cross-linking when subjected to a high compounding energy at a temperature above its melting point. In a first step (I), a thermoplastic organic polymer and an organopolysiloxane are mixed at a temperature at which both the thermoplastic organic polymer and the organopolysiloxane are in liquid phases to form a masterbatch. In a second step (II), the masterbatch is mixed with further thermoplastic organic polymer to form a polymer composition having a lower concentration of organopolysiloxane than that in the masterbatch. In the first step (I), the thermoplastic organic polymer and the organopolysiloxane are mixed in the presence of an additive capable of inhibiting the thermo-radical degradation or cross-linking of the thermoplastic organic polymer.