Abstract: An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper.

Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

Abstract: When mounting semiconductor chips, the semiconductor chips are presented on a wafer table where they are picked one after the other by a pick and place system, transported and placed onto a substrate that rests on a supporting surface of a substrate table. The wafer table is aligned diagonally to the supporting surface of the substrate table whereby part of the wafer table is located under the substrate table. The pick and place system comprises a shuttle with a swivel arm carrying a bondhead. The swivel arm is swivelled back and forth between two predetermined swivel positions whereby in the first swivel position a longitudinal axis of the swivel arm embraces the angle ? with the perpendicular to the supporting surface of the substrate table and whereby in the second swivel position the longitudinal axis of the swivel arm runs orthogonally to the supporting surface of the substrate table.

Abstract: An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.

Abstract: A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial distance D. The Wire Bonder has a device with a body with an optical marking and with two stop faces that enable the vectorial distance D to be recalibrated at any time. The control program of the Wire Bonder is set up on the one hand to move the capillary towards the first stop face and to determine a first co-ordinate xC of the position of the bondhead as soon as the capillary touches the first stop face and then to move the capillary towards the second stop face and to determine a second co-ordinate yC of the position of the bondhead as soon as the capillary touches the second stop face.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop. Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, and Determining the maximum of the measured signal.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.

Abstract: A clamping element for the transport of a substrate in a predefined transport direction comprises a first and a second leg with a first and second clamping jaw for clamping a substrate. Each of the two clamping jaws has a clamping plate which is movable in transport direction relative to the corresponding leg. A sensor measures the deflection of the first clamping plate relative to the first leg. As soon as the measured deflection exceeds a predefined threshold value, the clamping element is opened.

Abstract: A device for the metered delivery of a viscous liquid has a pump body with a drill hole accommodating two pistons which connects a first chamber serving as an intake chamber and a second chamber serving as a discharge chamber. Two swivel arms driven by two cam discs are foreseen as the drive mechanism for the back and forth movement of the two pistons. For the metered delivery of an adhesive which contains flakes of silver the drill hole is designed such that it serves for guiding the pistons as well as for sealing the pump path.

Abstract: A device for measuring the oscillation amplitude of the tip of a capillary by means of a light beam comprises a light source and an opto-receiver and two apertured diaphragms that are arranged between the light source and the opto-receiver and which lie on a common axis. The apertured diaphragms are preferably formed by means of drill holes arranged on a common axis in side walls of a channel formed in a body. The two apertured diaphragms define the diameter of the light beam.

Abstract: A method for finding optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.

Abstract: An apparatus for mounting semiconductor chips comprises a loading station for the presentation of substrates, a first transport system and a second transport system. The first transport system removes one substrate after the other from the loading station and passes them on to the second transport system which transports the substrates in steps to a dispensing or soldering station and to a bonding station. A sensor with two coils arranged at a distance to one another is arranged in such a way that one end of the substrate transported by the first transport system travels through a gap formed between the two coils. The signal delivered by the sensor is used to determine a control signal which indicates whether or not the first transport system should pass the substrate on to the second transport system.

Abstract: To determine the vectorial distance D between the tip of a capillary and an optical axis of an image recognition system of a Wire Bonder, a glass fibre supplied with light is used as a reference point and as a sensor. On the one hand, the glass fibre serves as a reference point with which the position of the optical axis of the image recognition system can be determined. On the other hand, the glass fibre serves as a sensor with which the position of the tip of the capillary can be determined in that it is determined at which position of the bondhead the intensity of the light which is reflected back into the glass fibre by a wire ball formed at the tip of the capillary is at a maximum.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop. Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, and Determining the maximum of the measured signal.

Abstract: An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.

Abstract: A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps:

Abstract: The bondhead of a Wire Bonder, that serves to produce a wire connection between two connection points by means of a capillary guiding a wire, is formed as a pantograph mechanism. The pantograph mechanism comprises a first swivel arm driven by a first motor, a second swivel arm driven by a second motor and two connecting arms. With this pantograph mechanism, the movement of the capillary takes place by means of rotary movements.

Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.