Abstract: For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.

Abstract: On measurement of a component Ay of the amplitude of the oscillations of the tip of a capillary which is clamped to a horn to which ultrasonics can be applied from an ultrasonic transducer, whereby measurement is based on the shading of a light beam by the capillary and whereby the intensity of the light beam is measured by means of an opto-receiver, the capillary is placed at one side of the light beam without it shading the light beam and ultrasonics is applied to it. The capillary is then moved in steps through the light beam whereby, for each of the i=1 to n steps, the direct voltage portion UDC(yi) and the alternating voltage portion UAC(yi) of the output signal of the opto-receiver are determined as well as a co-ordinate yi whereby the co-ordinate yi designates the position of the capillary in relation to a co-ordinate axis y running vertically to the light beam. The amplitude Ay is then calculated from the values measured.

Abstract: In order that, on wire bonding by means of a Wire Bonder, optimum bonding results can be achieved after a capillary change it is suggested that, after a change from a first capillary to a second capillary, the ultrasonic transducer which applies ultrasonics to the horn which guides the capillary is controlled with a parameter P2 which results from the parameter P1 before the capillary change as P2=g(k1, k2)*P1 or P2=g(k1, k2, A1, A2)*P1 or P2=g(k1, k2, A1, A2, H1, H2)*P1, whereby the quantities k1 and k2 designate the estimated values for the flexural strength, the quantities A1 and A2 the amplitudes of the freely oscillating capillary and H1 and H2 the diameters in the narrowest part of the longitudinal drill hole of the first or second capillary and whereby the function g is a predetermined function.

Abstract: Optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a Wire Bonder can be determined by means of a method with the following steps:

Abstract: A clamping element for a flat work piece, with a first clamping jaw with a first clamping surface and a second clamping jaw with a second clamping surface has an optical sensor for the measurement of the distance between the two clamping surfaces. The optical sensor is partially integrated into the clamping jaws. The optical sensor comprises an opto-transmitter, a first light guide and a second light guide and at least one photosensor. The first clamping jaw has a drill hole which accommodates an end of the first light guide and the second clamping jaw has a drill hole which accommodates an end of the second light guide.

Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

Abstract: With a pick-up tool with a suction organ made of elastically deformable material, a surface for picking the semiconductor chip is formed convex. On placing the semiconductor chip onto an already mounted semiconductor chip the centre of the semiconductor chip impacts first. The convex surface is increasingly deformed as a result of the pressure build-up until it and the picked semiconductor chip are flat. The pressure builds up from the centre of the suction organ outwards. In doing so, the semiconductor chip is rolled onto the lower semiconductor chip, whereby the air can continuously escape.

Abstract: A pressure sensor for measuring a pressure p contains a membrane with a front and a rear clamped into a body. The pressure p can be applied to the rear of the membrane. The front of the membrane is actively linked to a piston. In addition, a force transmitter is present with which a predetermined force can be applied to the piston. For the purpose of re-calibration, the membrane of the pressure sensor can be deformed by the force transmitter under precisely defined conditions and the output signal re-calibrated. A positioner can also be foreseen instead of the force transmitter.

Abstract: An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper.

Abstract: A linear guide comprises a support element and a carriage sliding on the support element. The carriage has two hollow cylinders sliding on an air bearing on the support element and a body arranged between them. The support element and the two hollow cylinders of the carriage are separated by a gap to which compressed air can be applied. A linear motor formed from a u-shaped stator and an armature is foreseen as drive mechanism for the carriage. During operation, heat dissipation occurs in the armature which heats the carriage. In order to maintain changes in the thickness of the gap within predetermined limits, the support element and/or those parts of the carriage whose temperature influence the thickness of the gap are heated to a predetermined temperature.

Abstract: An apparatus for mounting a flipchip onto a work piece comprises a pick-up station for presentation of the flipchip, a transport mechanism, at least one pick-up tool arranged on the transport mechanism for pick-up and transport of the flipchip from the pick-up station to the work piece and a position acquisitioning device arranged on the transport mechanism for determining the position of the picked up flipchip. The position acquisitioning device comprises a slide and a single line camera secured to the slide, a guide element for guiding the slide, a drive mechanism for driving the slide and a measuring device for determining the position of the slide.

Abstract: An apparatus for mounting semiconductor chips on a substrate with which the semiconductor chips are presented on a foil clamped in a frame at a first location A comprises a chip gripper for the transport of the semiconductor chip presented at the first location A to a second location located on the substrate, a movable table for accepting the frame, a chip ejector arranged underneath the foil at the first location A the upper surface of which facing towards the foil has holes connected to a vacuum source, as well as a measuring camera directed at the first location A for establishing the position of the presented semiconductor chip. Correction of a possible position deviation of the presented semiconductor chip from its set position takes place in accordance with the invention in that the foil is secured by the chip ejector by means of vacuum and then at least the upper surface of the chip ejector facing towards the foil is moved in the plane running parallel to the under side of the foil.

Abstract: An apparatus for making wire connections between a first connection area and a second connection area by means of a capillary. The apparatus contains an image recognition system which is designed so that the tip of the capillary enters the image area of the image recognition system immediately before impacting on the respective connection area. In this way, the position of the desired point of impact of the capillary on the connection area as well as the position of the tip of the capillary can be determined with the same measuring system, evaluated and used for the precise control of the movement of the capillary.

Abstract: An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order to move the substrates in transport direction as well as resiliently mounted elements which press against the substrates.

Abstract: A device for the metered delivery of a viscous liquid has a pump body with a drill hole accommodating two pistons which connects a first chamber serving as an intake chamber and a second chamber serving as a discharge chamber. Two swivel arms driven by two cam discs are foreseen as the drive mechanism for the back and forth movement of the two pistons.

Abstract: A pressure sensor for measuring a pressure p contains a membrane with a front and a rear clamped into a body. The pressure p can be applied to the rear of the membrane. The front of the membrane is actively linked to a piston. In addition, a force transmitter is present with which a predetermined force can be applied to the piston. For the purpose of re-calibration, the membrane of the pressure sensor can be deformed by the force transmitter under precisely defined conditions and the output signal re-calibrated. A positioner can also be foreseen instead of the force transmitter.

Abstract: A pressure transducer for the production of a controlled under or overpressure comprises a valve to which compressed air can be applied, a motor for adjusting the position of the valve block, a sensor for measuring the pressure to be controlled and an electronic controller. The valve comprises a valve block working together with a valve seat. The rotational movement of the shaft of the motor is converted into a longitudinal movement of the valve block by means of a coupling. Between the shaft of the motor and the valve block, a spring is inserted which applies a mechanical load to the motor so that the motor does not reach the set speed given by the controller but turns slower. The load on the motor is dependent on the position of the valve block. For the controller, this is equivalent to a linearization of the characteristic curve of the regulated system.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longitudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

Abstract: With the mounting of semiconductor chips on a substrate having a solder portion a semiconductor chip held by a gripper spring mounted on a bondhead is lowered onto the substrate. In doing so, the gripper is deflected towards the bondhead. Subsequently, the semiconductor chip is raised by a predetermined distance and then released. Optionally, the semiconductor chip is moved up and down before being released. With this method, the semiconductor chip is under mechanical control until the solder has taken up a stable form and the semiconductor chip has achieved its final position.