Abstract: A Wire Bonder contains a bondhead which comprises a slide, a rotary beam rotatable on a vertical axis and a rocker mounted on the rotary beam. The slide is movable back and forth in a predetermined horizontal direction and moves the rotary beam with it. The slide preferably bears on a horizontally arranged glide plate by means of an air bearing charged with vacuum. The rotary beam also preferably bears on the glide plate by means of a further air bearing charged with vacuum. A drive arranged on the slide is preferably foreseen for the rotating movement of the rotary beam.

Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.

Abstract: The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.

Abstract: A device for the application of a liquid substance has a baseplate, in which at least one cavity is recessed, and a container. In operation, the container and the baseplate are moved relative to each other in such a way that during the relative movement the container passes from one side of the cavity to the other side of the cavity. Such a device is particularly suitable for the application of flux, electrically conducting epoxy or soldering paste onto the bumps of a semiconductor chip.