Abstract: There are provided a polishing composition capable of improving the polishing removal rate of a TEOS film, a method for manufacturing the polishing composition, and a polishing method. A polishing composition contains cationized colloidal silica chemically surface-modified with an amino silane coupling agent and an anionic surfactant, in which the pH value is larger than 3 and smaller than 6.
Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria. The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.
Abstract: Provided is a polishing composition having excellent capability of reducing haze on the surface of an object to be polished. The polishing composition provided by the present invention includes an abrasive, a basic compound, a water-soluble polymer, and water. The water-soluble polymer includes at least a water-soluble polymer P1 and a water-soluble polymer P2. Here, the water-soluble polymer P1 is an acetalized polyvinyl alcohol-based polymer, and the water-soluble polymer P2 is a water-soluble polymer other than the acetalized polyvinyl alcohol-based polymer.
Abstract: There are provided a filler capable of increasing the thermal conductivity of a molded body of a resin composition obtained by being blended in resins, such as plastics, curable resins, or rubbers, and a molded body and a heat dissipating material having high thermal conductivity. A resin composition containing a filler and a resin is molded to give a molded body, and a heat dissipating material is obtained from the molded body. The filler contains secondary particles which are sintered bodies of powder containing primary particles of ceramic. The filler has a specific surface area measured by the BET method of 0.25 m2/g or less and granule strength measured by a microcompression test of 45 MPa or more.
Abstract: The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step Pf.
Abstract: Provided is a thermal spraying material capable of forming a thermally sprayed coating film having improved plasma erosion resistance. The invention disclosed here provides a thermal spraying material. This thermal spraying material comprises composite particles in which a plurality of yttrium fluoride microparticles are integrated. In addition, the compressive strength of the composite particles is 5 MPa or more.
Abstract: The titanium phosphate powder of the present invention includes plate-shaped crystalline particles of titanium phosphate, an average thickness of the plate-shaped crystalline particles is 0.01 ?m or more and less than 0.10 ?m, and an aspect ratio, which is a value obtained by dividing an average primary particle diameter of the plate-shaped crystalline particles by the average thickness, is 5 or more. In the method for producing a titanium phosphate powder of the present invention, a raw material containing titanium and phosphorus is caused to react by a hydrothermal synthesis method, and when the titanium phosphate powder including plate-shaped crystalline particles of titanium phosphate is produced, a mixture of titanium sulfate and phosphoric acid is used as the raw material.
Abstract: The polishing composition provided by the present invention contains an abrasive, a polyvinyl alcohol polymer as a water-soluble polymer, a basic compound, and water, and further contains a trivalent or higher polyvalent organic acid (salt).
Abstract: The present invention provides means capable of improving an effect of inhibiting polishing of silicon nitride. The present invention relates to a polishing composition containing a cationically modified silica particles, a non-aromatic crosslinked cyclic compound having an organic acid group or a group of a salt thereof, and water.
Abstract: The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.
Abstract: The titanium phosphate powder of the present invention includes plate-shaped crystalline particles of titanium phosphate, an average thickness of the plate-shaped crystalline particles is 0.01 ?m or more and less than 0.10 ?m, and an aspect ratio, which is a value obtained by dividing an average primary particle diameter of the plate-shaped crystalline particles by the average thickness, is 5 or more. In the method for producing a titanium phosphate powder of the present invention, a raw material containing titanium and phosphorus is caused to react by a hydrothermal synthesis method, and when the titanium phosphate powder including plate-shaped crystalline particles of titanium phosphate is produced, a mixture of titanium sulfate and phosphoric acid is used as the raw material.
Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.
Abstract: The present invention provides a thermal spraying material capable of forming a thermally sprayed coating film having improved plasma erosion resistance. This thermal spraying material contains composite particles in which a plurality of yttrium fluoride microparticles are integrated. This thermal spraying material has a lightness L of 91 or less in the Lab color space. This lightness L is more preferably 5 or more.
Abstract: Provided is a thermal spraying material capable of forming a thermally sprayed coating film having improved plasma erosion resistance. The invention disclosed here provides a thermal spraying material. This thermal spraying material comprises composite particles in which a plurality of yttrium fluoride microparticles are integrated. In addition, the compressive strength of the composite particles is 5 MPa or more.
Abstract: The present technology generally relates to liquid compositions for cleaning post-CMP semiconductor surfaces, and methods of cleaning a semiconductor surface having ceria (CeO2) particles thereon.
Abstract: Provided is a means capable of sufficiently removing organic residues on the surface of an object to be polished after polishing. A surface treatment composition includes a polymer having a building block represented by Formula (1) in [Chemical Formula 1], a chelating agent, and water and is used to treat the surface of an object to be polished after polishing, and the chelating agent has at least one of a phosphonic acid group and a carboxylic acid group. In Formula (1), R1 is a hydrocarbon group having 1 to 5 carbon atoms; and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
Abstract: The present invention provides a means capable of improving a residue removing effect and improving storage stability in a composition for surface treatment which is used for reducing residues on a surface of an object to be polished after being polished chemical mechanical polishing. The present invention relates to a composition for surface treatment, wherein the composition contains a solvent and a dissolved gas, a concentration of the dissolved gas is 0.01 mg/L or more and 10 mg/L or less with respect to a total volume of the composition and the composition is used for reducing residues on a surface of an object to be polished after being polished by chemical mechanical polishing.
Abstract: Provided is a polishing composition that can effectively improve a polishing removal rate. According to the present invention, a polishing composition for polishing a polishing target material is provided. The polishing composition contains water, an oxidant, and a polishing removal accelerator, and does not contain abrasive. At least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt is contained as the polishing removal accelerator.
Abstract: A thermal spray material that enables a thermal sprayed coating, which is capable of exhibiting the same performances as those of the related art, to be obtained more easily than the related art, and a method for forming a thermal sprayed coating using the thermal spray material are provided. A thermal spray material which for forming a thermal sprayed coating containing a rare-earth oxyhalide includes a rare-earth halide powder and a rare-earth oxide powder.
Abstract: The present invention provides a polishing composition for use in polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing composition comprises an alumina abrasive and water. The alumina abrasive has an isoelectric point that is below 8.0 and is lower than the pH of the polishing composition.