Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

Abstract: Provided is an optical module including a circuit board and an optical transceiver device. The circuit board is provided with a mounting hole and a data processor. The optical transceiver device is mounted on the circuit board and is electrically connected to the data processor. The optical transceiver device includes a mounting shell, a first cover member, a light emission component and a light reception component. The first cover member is disposed on the front surface of the circuit board. A laser assembly and a translation prism assembly of the light emission component are located on the mounting shell and are exposed to the front surface of the circuit board through the mounting hole, and a light exiting direction of a light processing assembly of the light emission component forms a first preset angle with a light entering direction thereof in a plane parallel to the circuit board.

Abstract: An optical sub-module includes a base body having a first base surface and a second base surface that are opposite to each other, a plurality of pins each penetrating through the second base surface and the first base surface, a heat sink disposed on the first base surface and having a groove facing the plurality of pins, a temperature regulator disposed in the groove, and a light emitter disposed on the temperature regulator. The temperature regulator includes a first heat exchange surface and a second heat exchange surface that are opposite to each other, the first heat exchange surface is in contact with an inner wall of the groove, and the light emitter is disposed at the second heat exchange surface so as to perform heat transfer with the temperature regulator.

Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.

Abstract: An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

Abstract: An optical module includes a shell, a circuit board, a light source and a silicon optical chip. The silicon optical chip includes a modulator. The circuit board includes a first sampling circuit configured to generate a first sampling signal, a second sampling circuit configured to generate a second sampling signal, and a processing circuit. The first sampling circuit is connected in series with the second sampling circuit, and a connection terminal of the first sampling circuit and the second sampling circuit is located between a first photodetector of the first sampling circuit and a second photodetector of the second sampling circuit. The processing circuit is configured to send a driving signal to the modulator according to a signal transmitted at the connection terminal of the first sampling circuit and the second sampling circuit, so as to control heating of the modulator or change phase of light in the modulator.

Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a fixing frame, a light source emitter, a first optical fiber, a modulation chip, and a circuit sub-board. The lower shell is covered with the upper shell to form a mounting cavity. The circuit board is disposed in the mounting cavity. The light source emitter is fixedly connected to the fixing frame and configured to emit a light beam. The modulation chip is connected to the light source emitter through the first optical fiber and configured to load a signal into the light beam emitted by the light source emitter to form an optical signal. The circuit sub-board is disposed on a side of the circuit board proximate to the upper shell and fixedly connected to the fixing frame. The circuit sub-board is electrically connected to the circuit board and the light source emitter.

Abstract: An optical module includes an upper shell, a lower shell, a circuit board, and a light-emitting device. The circuit board includes a mounting hole running through a front surface and a back surface of the circuit board. The light-emitting device includes a base, a laser assembly, a translation prism, and an optical fiber coupler. The base is installed on the front surface and has an installation surface facing towards the front surface. The laser assembly and the translation prism are installed on the installation surface. The laser assembly passes through the mounting hole. The translation prism is configured to translate a laser beam located at the back side of the circuit board emitted by the laser assembly to the front side of the circuit board. The optical fiber coupler is configured to transmit the translated laser beam to outside of the optical module.

Abstract: An optical module includes a circuit board, a circuit sub-board, a signal processing chip, a first light transceiver assembly, and a second light transceiver assembly. The circuit board is configured to be electrically connected to an outside of the optical module. The circuit sub-board is disposed on the circuit board and electrically connected to the circuit board. The circuit sub-board includes a first body and a connecting hole. The connecting hole runs through an upper surface and a lower surface of the first body. The signal processing chip is disposed on the circuit sub-board. The first light transceiver assembly is disposed on the circuit board and located in the connecting hole. The second light transceiver assembly is disposed on the circuit board and located outside the connecting hole.

Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The laser assembly and the silicon optical chip are located on the base. The laser assembly includes an upper box, conductive substrates, laser chips and a light transmitting member. The upper box and the base are combined to provide a cavity. The cavity has an opening and a slot. The laser chips are located on the conductive substrates which are at least partially located in the cavity. The light transmitting member is disposed between the upper box and the base, and is configured to enclose the opening. Light exit surfaces of the laser chips are parallel to a light incident surface of the light transmitting member, and the light incident surface and a light exit surface of the light transmitting member are not parallel.

Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly and a silicon optical chip. The circuit board is disposed between an upper shell and a lower shell of the shell. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly and the silicon optical chip are located on the base. An upper box of the laser assembly and the base are combined to provide a cavity. Conductive substrates of the laser assembly are at least partially located in the cavity. Laser chips of the laser assembly are located on the conductive substrates. An opening of the cavity is located in an optical path where light emitted by the laser chips is emitted to the silicon optical chip, and a slot of the cavity allows the conductive substrates or wires to extend out of the cavity.

Abstract: An optical module includes a shell, a circuit board, a base, a laser assembly, a silicon optical chip and a protective cover. The laser assembly and the silicon optical chip are located on the base. The protective cover covers on the circuit board. The laser assembly and a wiring region of the laser assembly and/or the silicon optical chip and a wiring region of the silicon optical chip are encapsulated between the protective cover and the circuit board. The shell includes at least one heat conduction column, the at least one heat conduction column is disposed on an inner wall of the shell and is in thermal conductive connection with the laser assembly and/or the silicon optical chip. The protective cover includes at least one escape opening that allow the at least one heat conduction column to pass and enter an inside of the protective cover.

Abstract: The present disclosure provides an optical module, including: an upper shell including an upper optical-port part, where a first fixing groove is disposed on top of the upper optical-port part; a lower shell including a lower optical-port part, where the lower optical-port part fits and is connected to the upper optical-port part, and a second fixing groove is disposed on top of the lower optical-port part; and an optical-fiber connector with one side clamped in the first fixing groove and the other side clamped in the second fixing groove; where a first shielding strip is disposed on a junction of the upper optical-port part and the lower optical-port part, and extends in multiple directions. In the optical module provided in the present disclosure, electromagnetic shielding is implemented at an optical port of the optical module in multiple directions, thereby improving an electromagnetic shielding effect of the optical module.

Abstract: An optical module includes a circuit board, a light transmit-receive device and a data processor. The light transmit-receive device includes a first laser array, a first detector array and a first lens assembly. The first laser array is disposed on the circuit board, and is configured to emit a plurality of channels of optical signals driven by the plurality of channels of low-speed electrical signals. The first detector array is disposed on the circuit board, and is configured to receive the plurality of channels of optical signals from outside of the optical module, and convert the plurality of channels of optical signals into a plurality of channels of electrical signals. The first lens assembly covers the first laser array and the first detector array, and is configured to change a propagation direction of optical signals incident into inside of the first lens assembly.

Abstract: An optical module includes a circuit board, a light emitting device and a data processor. The data processor is disposed on the circuit board. The data processor includes a reverse gearbox and a gearbox. The reverse gearbox is connected to the light emitting device, and is configured to receive a high-speed electrical signal from the circuit board, and decode the high-speed electrical signal into a plurality of channels of low-speed electrical signals. The plurality of channels of low-speed electrical signals drive the light emitting device to emit the plurality of channels of optical signals. The gearbox is connected to the light receiving device, and is configured to receive a plurality of channels of low-speed electrical signals output by the light receiving device, encode the plurality of channels of low-speed electrical signals into a high-speed electrical signal, and transmit the high-speed electrical signal to the circuit board.

Abstract: An optical module includes a shell, a circuit board, a light source and a silicon optical chip. The light source is configured to emit light. The silicon optical chip includes a modulator, and the modulator is configured to receive the light emitted by the light source and modulate the light into an optical signal. The circuit board includes a first sampling circuit, a second sampling circuit and a processing circuit. The first sampling circuit is configured to generate a first sampling signal. The second sampling circuit is configured to generate a second sampling signal. The processing circuit is configured to receive the first sampling signal and the second sampling signal, and send a driving signal to the modulator according to a difference between an amplitude of the first sampling signal and an amplitude of the second sampling signal, so as to control an electric heating of the modulator.

Abstract: An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.

Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.

Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.

Abstract: Disclosed is an optical module, comprising: a light emitting component for generating and outputting signal light, including a laser; the laser includes: a laser chip for generating signal light; a substrate which is provided with a chip mounting groove in its top side, a circuit is laid on a top surface of the substrate, the laser chip is arranged in the chip mounting groove, with the laser chip being connected to the circuit via bonding wires.