Abstract: A light emission assembly including: a substrate; at least two channels including: a driving assembly including a driving chip; an EML laser assembly including an EML laser chip; a first magnetic bead; a second magnetic bead; a DC blocking capacitor; a driving multiplexing pad for electrically connecting a first end of the first magnetic bead with a signal pad of the driving chip and a first end of the DC blocking capacitor, a second end of the first magnetic bead being connected to a first supply voltage; an EML multiplexing pad for electrically connecting a first end of the second magnetic bead with the EML laser chip assembly and a second end of the DC blocking capacitor, a second end of the second magnetic bead being connected to a supply voltage of the EML laser chip. The present disclosure also provides an optical module including the light emission assembly.

Abstract: The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

Abstract: An optical module includes a circuit board and a light emitting assembly. The circuit board includes a first circuit board ground line, a second circuit board ground line and a circuit board signal line. The light emitting assembly is connected to the circuit board, and the light emitting assembly includes a spacer and a laser chip. The spacer includes a first spacer ground line, a second spacer ground line and a spacer signal line. The first spacer ground line is connected to the second spacer ground line through a fourth connection line; or the first spacer ground line is connected to the second circuit board ground line through a fifth connection line; or the second spacer ground line is connected to the first circuit board ground line through a sixth connection line; or the first circuit board ground line is connected to the second circuit board ground line through a seventh connection line.

Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.

Abstract: An optical module includes a shell, a circuit board, a light-emitting device, a sensor assembly and a processor. The circuit board is disposed in the shell. The light-emitting device is disposed in the shell, and includes a non-hermetically sealed cover, a laser chip and a thermo electric cooler. The thermo electric cooler is disposed in the cover and is configured to adjust a temperature of the heat exchange surface of the thermo electric cooler connected to the laser chip. The sensor assembly is disposed on the circuit board and is configured to detect ambient data inside the optical module, the ambient data including at least ambient humidity. The processor is disposed on the circuit board, and is configured to receive the ambient data detected by and sent from the sensor assembly, and control the thermo electric cooler to adjust the temperature of the heat exchange surface of the thermo electric cooler to a target temperature according to the ambient data.

Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.

Abstract: The present disclosure provides an optical module, including: an upper shell including an upper optical-port part, where a first fixing groove is disposed on top of the upper optical-port part; a lower shell including a lower optical-port part, where the lower optical-port part fits and is connected to the upper optical-port part, and a second fixing groove is disposed on top of the lower optical-port part; and an optical-fiber connector with one side clamped in the first fixing groove and the other side clamped in the second fixing groove; where a first shielding strip is disposed on a junction of the upper optical-port part and the lower optical-port part, and extends in multiple directions. In the optical module provided in the present disclosure, electromagnetic shielding is implemented at an optical port of the optical module in multiple directions, thereby improving an electromagnetic shielding effect of the optical module.

Abstract: An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.

Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.

Abstract: An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.

Abstract: An optical module includes a shell, a circuit board, a light-emitting chip, a lens assembly, an optical fiber ferrule assembly and a fastener. The fastener fixes the optical fiber ferrule assembly to the lens assembly. The fastener includes a fastening body, a first clamping portion and a second clamping portion. The first clamping portion is disposed at one end of the fastening body, and is clamped with the optical fiber ferrule assembly. The second clamping portion is disposed at the other end of the fastening body, and is clamped with the lens assembly.

Abstract: An optical module includes a shell, a circuit board, a light source and a silicon optical chip. The light source is configured to emit light. The silicon optical chip includes a modulator, and the modulator is configured to receive the light emitted by the light source and modulate the light into an optical signal. The circuit board includes a first sampling circuit, a second sampling circuit and a processing circuit. The first sampling circuit is configured to generate a first sampling signal. The second sampling circuit is configured to generate a second sampling signal. The processing circuit is configured to receive the first sampling signal and the second sampling signal, and send a driving signal to the modulator according to a difference between an amplitude of the first sampling signal and an amplitude of the second sampling signal, so as to control an electric heating of the modulator.

Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.

Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.

Abstract: An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.

Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.

Abstract: An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.