Patents Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
  • Publication number: 20200183107
    Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
    Type: Application
    Filed: January 17, 2020
    Publication date: June 11, 2020
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., HISENSE USA CORP., Hisense International Co., Ltd.
    Inventors: Wei Zhao, Xuxia Liu, Lin Yu
  • Patent number: 10678003
    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 9, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Xuxia Liu, Yongliang Huang, Qian Shao
  • Patent number: 10680399
    Abstract: The disclosure provides an optical module, including a laser, the laser including a light emitting region and a modulation region, and light emitted by the light emitting region emitting toward the modulation region; a first driver circuit, the first driver circuit being connected to the light emitting region, so that the light emitting region emits light with adjusted optical power; and a second driver circuit, the second driver circuit being connected to the modulation region, so that the modulation region changes the optical power of the light emitted from the light emitting region.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 9, 2020
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Qiang Zhang, Qisheng Zhao, Shihai Yang
  • Publication number: 20200145113
    Abstract: The present disclosure describes an optical device, a system including an optical receiver, and a system including an optical module. The optical device includes an Avalanche Photodiode (APD), a circuit board, a boost circuit disposed on the circuit board, a processor disposed on the circuit board and configured to control an output voltage of the boost circuit, and a probe point disposed on the circuit board. The boost circuit includes a control terminal electrically connecting to the processor. The boost circuit also includes an output terminal electrically connecting to the APD and the probe point respectively.
    Type: Application
    Filed: September 27, 2019
    Publication date: May 7, 2020
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Shixuan QIN, Rui HUANG, Dengshan XUE, Ming LI
  • Patent number: 10637577
    Abstract: An optical module includes a gold finger, a comparing unit and a voltage dividing unit. The gold finger includes a plurality of pins. A first pin of the plurality of pins is capable of being multiplexed. The comparing unit includes a first input, a second input and a first output. The first input is connected with the first pin. The second input is configured to receive a reference voltage. The first output is configured to output an output voltage. The voltage dividing unit includes a third input and a second output. The third input is configured to receive a voltage input. The second output is connected with the first pin and configured to regulate a voltage on the first pin, so that the first input of the comparing unit receives a regulated voltage. Voltages of different levels are output by the comparing unit based on a comparison result between an input voltage of the first input of the comparing unit and the reference voltage of the second input.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 28, 2020
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventor: Long Zheng
  • Patent number: 10624203
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 14, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.
    Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang
  • Patent number: 10587093
    Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 10, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP., HISENSE INTERNATIONAL CO., LTD.
    Inventors: Hao Wang, Hongwei Mu, YongLiang Huang, Shun Zhang
  • Patent number: 10578816
    Abstract: An optical module includes a housing, a circuit board, a connecting finger and a reflector. The circuit board is provided inside the housing. The connecting finger is provided on the circuit board. The reflector is provided between the circuit board and the housing, and is located between the connecting finger and an optical port of the optical module. The reflector is configured to reflect electromagnetic waves radiated onto a surface of the reflector.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 3, 2020
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORP, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Wei Zhao, Xuxia Liu, Lin Yu
  • Patent number: 10571639
    Abstract: The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 25, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Qiang Zhang, Qisheng Zhao
  • Patent number: 10575382
    Abstract: The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: February 25, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventor: Long Zheng
  • Publication number: 20200049873
    Abstract: The present disclosure describes an optical module. The optical module includes a housing comprising a first portion, a second portion, and protrusions, and the protrusions are configured to enclose the first portion to isolate the first portion from the second portion. The optical module includes a circuit board disposed inside the housing, the circuit board comprising a first area, a second area, and a metal strip attaching to the protrusions. The optical module further includes an indicator light configured to emit light and a laser driving chip. The first area of the circuit board is electrically connected to the indicator light to supply power to the indicator light. The second area of the circuit board is electrically connected to the laser driving chip. The metal strip encloses the first area to isolate the first area from the second area.
    Type: Application
    Filed: September 11, 2019
    Publication date: February 13, 2020
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventor: Long ZHENG
  • Publication number: 20190391331
    Abstract: An optical module includes a circuit board and a receiver disposed on the circuit board. The circuit board includes a groove disposed in a surface of the circuit board. The groove is recessive along a height direction of the circuit board. The receiver includes an arrayed waveguide grating. The arrayed waveguide grating is configured to receive optical signal from an optical fiber. The arrayed waveguide grating is arranged above the groove and opposite to the groove.
    Type: Application
    Filed: September 6, 2019
    Publication date: December 26, 2019
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Yifan XIE, Qinhao FU, Weiwei LIU, Mengbo FU
  • Patent number: 10516484
    Abstract: Some embodiments of the present application provide an optical module, including: a master control chip and a laser receiver; the laser receiver being connected to the master control chip; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; and the lens being coated with an antireflection film; where the optical module further includes a bracket and a claw, where the laser receiver is fixed between a housing of the optical module and the bracket by the claw.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: December 24, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Yaqian Dong, Long Zheng, Hua Zhang
  • Publication number: 20190384023
    Abstract: Embodiments of the present disclosure relates to an optical module, including a bracket, and a handle and a plate both of which are connected to the bracket, where the plate is rotationally connected to the bracket, and a first end of the plate is provided with a buckle, and a second end of the plate abuts against a driving portion disposed on the handle, the driving portion is configured to: while the handle is moving along a length direction of the bracket, drive the second end of the plate that abuts against the driving portion to move, resulting in rotation of the buckle provided at the first end of the plate. On this basis, a lateral unlocking of the optical module is achieved along its length direction with a high unlocking reliability.
    Type: Application
    Filed: March 15, 2019
    Publication date: December 19, 2019
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Benzheng Dong, Jinlei Chen, Hongchao Pan
  • Patent number: 10465894
    Abstract: An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: November 5, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Peng He, Haiqiang Xu, Sigeng Yang, Shuai Zhang
  • Patent number: 10459180
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 29, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
  • Patent number: 10440799
    Abstract: The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 8, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventor: Long Zheng
  • Patent number: 10432314
    Abstract: The application discloses a method and apparatus for starting an optical module. The method includes: adjusting temperature of a laser device of the optical module to a first temperature higher than a normal operating temperature of the laser device of the optical module; powering up the laser device of the optical module using a first current lower than a normal operating current of the laser device; and adjusting the temperature of the laser device of the optical module from the first temperature to the normal operating temperature according to a second temperature corresponding to each adjustment, and adjusting the current of the laser device of the optical module from the first current to the normal operating current according to a second current corresponding to each adjustment, for a preset times of adjustment.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 1, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.
    Inventors: Shaobo Li, Ping Zhao
  • Patent number: 10393971
    Abstract: Some embodiments of the present disclosure disclose a pluggable optical module, comprising a housing and an electromagnetic interference shielding clip clamped on the housing; a conductive member is provided between the housing and the electromagnetic interference shielding clip; and when the pluggable optical module is inserted into an optical module cage, the conductive member can block a gap between the housing and the electromagnetic interference shielding clip.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: August 27, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Wei Zhao, Hongchao Pan, Yinlong Liu, Wei Cui, Lin Yu
  • Patent number: 10390409
    Abstract: This application discloses an optical module, including a circuit board, a lens assembly, a laser driver, and a limiting amplifier. Heat dissipation layers are disposed on the upper and lower surfaces of the circuit board. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface. Via holes are provided in projection regions of the laser driver and the limiting amplifier on the circuit board. Via holes penetrate the circuit board and are connected to the heat dissipation layers. Via holes are filled with a heat conductor, and the heat conductor is connected to the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module disclosed in this application effectively dissipates heat generated by the laser driver and the limiting amplifier, thereby reducing the temperature in the optical module.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: August 20, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventor: Long Zheng