Patents Assigned to Infineon Technologies
  • Patent number: 11965909
    Abstract: A magnetic sensor system includes a toothed wheel configured to rotate about a rotation axis that extends in an axial direction, wherein the toothed wheel includes a plurality of teeth and a plurality of notches arranged that define a circumferential perimeter, wherein the toothed wheel further includes an interior cavity arranged within the circumferential perimeter; a front-bias magnet arranged within the interior cavity of the toothed wheel, wherein the front-bias magnet is rotationally fixed and is magnetized with a magnetization direction that extends along a radial axis of the toothed wheel; and a magnetic sensor arranged exterior to the toothed wheel, wherein the magnetic sensor includes a sensor element arranged on the radial axis that coincides with the magnetization direction of the front-bias magnet and the first sensor element is sensitive to a magnetic field of the front-bias magnet that is aligned with the radial axis.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: April 23, 2024
    Assignee: Infineon Technologies AG
    Inventors: Gernot Binder, Rocio Elisa De La Torre Rodriguez
  • Patent number: 11967562
    Abstract: A method for fabricating packaged semiconductor devices is disclosed. In one example the method comprises providing a plurality of semiconductor dies, the semiconductor dies being arranged in an array on a carrier such that a first side of the semiconductor dies faces the carrier and such that an empty space is arranged laterally besides each semiconductor die. A substrate comprising a plurality of conductive elements is arranged over the plurality of semiconductor dies such that a conductive element is arranged in the respective empty space besides each one of the semiconductor dies. The plurality of semiconductor dies are molded over to form a molded body, and singulating packaged semiconductor devices from the molded body by cutting through the molded body.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: April 23, 2024
    Assignee: Infineon Technologies AG
    Inventor: Horst Theuss
  • Patent number: 11965756
    Abstract: Implementations relate to a sensor assembly for determining rotation about an axis and linear movement parallel to the axis. The sensor assembly comprises a magnetic structure comprising a north pole radially displaced from the axis and a south pole radially displaced from the axis and opposite to the north pole. The north pole and the south pole of the magnet extend radially into the direction of the axis at an axial end of the sensor assembly. The sensor assembly further comprises at least one sensor element sensitive to magnetic fields radially between the north pole and the south pole.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: April 23, 2024
    Assignee: Infineon Technologies AG
    Inventors: Joo Il Park, Richard Heinz, Hyun Jeong Kim, Sehwan Kim, Stephan Leisenheimer, Severin Neuner
  • Patent number: 11962915
    Abstract: An imaging system includes an illumination element for emitting light and an imaging sensor having at least one photo-sensitive element that includes a first element with a modifiable first charge level and a second element with a modifiable second charge level. Control circuitry is configured to, during a first phase, control the illumination element to emit light towards a scene and drive the photo-sensitive element such that charge carriers generated in the photo-sensitive element by light received from the scene modify the first charge level. The control circuitry is configured to, during a second phase, control the illumination element to pause emission of the light and drive the photo-sensitive element such that charge carriers generated in the photo-sensitive element by light received modify the second charge level, and to generate a gray-scale image of the scene based on the first and second charge levels.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Caterina Nahler, Hannes Plank, Armin Josef Schoenlieb
  • Patent number: 11962249
    Abstract: According to some embodiments, an apparatus comprises a multi-level power converter configured to convert an input voltage to an output voltage, wherein the multi-level power converter comprises one or more switching groups, wherein a switching group of the one or more switching groups comprises a pair of switches and a flying capacitor, and a controller configured to determine a duty reference for the switching group, determine a duty correction factor for the switching group based upon a flying capacitor voltage error of the flying capacitor, determine a sign correction signal based on a flying capacitor ripple voltage, and determine a duty command for activating the pair of switches based on the duty reference, the duty correction factor, and the sign correction signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies Austria AG
    Inventors: Eslam Abdelhamid, Juan Sanchez
  • Patent number: 11963466
    Abstract: A switch device including a semiconductor substrate is provided. A trench is formed in the substrate, and a phase change material is provided at least partially in the trench. A heater for heating the phase change material is also provided.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Patent number: 11962973
    Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Christian Bretthauer, David Tumpold, Pradyumna Mishra, Daniel Neumaier
  • Patent number: 11962316
    Abstract: An analog-to-digital converter (ADC) includes a first controlled oscillator (CO) for generating at least one phase signal, and wherein the at least one phase signal generates a first output signal of the ADC; and at least one first frequency-controlled resistor (FDR) for receiving the at least one phase signal generated by the first CO, wherein the first CO and the at least one first FDR are coupled together at a first subtraction node of the ADC, and wherein the first subtraction node receives a first input signal.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 16, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Luis Hernandez, Ruben Garvi Jimenez-Ortiz, Andreas Wiesbauer
  • Patent number: 11960608
    Abstract: A method to secure boot an electronic device is disclosed according to some embodiments. The method includes receiving a request to initiate a boot sequence using memory content stored in a non-volatile memory circuit. A secure boot circuit receives verification data from the non-volatile memory circuit indicating the memory content. The verification data includes an error correction code for the memory content without including all of the memory content. A cryptographic hashing operation is performed to the error correction code in the secure boot circuit to obtain a digest of the error correction code. The digest is compared with a pre-stored reference digest to generate a verification signal. The verification signal is provided to the electronic device indicating whether the boot sequence passes the verification.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Atilla Bulmus, Jeffrey Todd Kelley, Chris Wunderlich
  • Patent number: 11961904
    Abstract: In an example, for manufacturing a semiconductor device, first dopants are implanted through a first surface section of a first surface of a silicon carbide body. A trench is formed that extends from the first surface into the silicon carbide body. The trench includes a first sidewall surface and an opposite second sidewall surface. A spacer mask is formed. The spacer mask covers at least the first sidewall surface. Second dopants are implanted through a portion of a bottom surface of the trench exposed by the spacer mask. The first dopants and the second dopants have a same conductivity type. The first dopants and the second dopants are activated. The first dopants form a doped top shielding region adjoining the second sidewall surface. The second dopants form a doped buried shielding region adjoining the bottom surface.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: April 16, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Siemieniec, Wolfgang Jantscher, David Kammerlander
  • Patent number: 11950895
    Abstract: In an embodiment, a method includes: generating a displacement signal indicative of a distension of a surface of a skin; determining a temperature of the skin using a temperature sensor; during a calibration time interval, collecting a plurality of distension values from the displacement signal, the plurality of distension values associated with a respective plurality of temperature values determined using the temperature sensor, the plurality of temperature values being indicative of a temperature change of the skin; determining compensation coefficients associated with the plurality of temperature values; and after the calibration time interval, collecting a first distension value from the displacement signal, determining a first temperature value using the temperature sensor, and determining a blood pressure based on the first distension value, the first temperature value, and the determined compensation coefficients.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Richard S. Sweet, Jr., Adrian Mikolajczak
  • Patent number: 11953676
    Abstract: A method of synchronizing a first oscillation about a first axis with a second oscillation about a second axis includes: generating a first position signal that indicates a position of the first oscillation about the first axis; generating a second position signal that indicates a position of the second oscillation about the first axis; determining a phase difference between the first and the second position signals; comparing the phase difference to a threshold value to generate a comparison result; generating a first reference signal having a first frequency and a second reference signal having a second frequency; synchronizing the first oscillation to the first frequency and synchronizing the second oscillation to the second frequency; monitoring the comparison result; and synchronously triggering a start of the first reference signal and the second reference signal responsive to the comparison result indicating that the phase difference is less than the threshold value.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Norbert Druml, Alberto Garcia Izquierdo
  • Patent number: 11955450
    Abstract: A method for producing a semiconductor arrangement includes: forming a first metallization layer on a first side of a dielectric insulation layer, the first metallization layer having at least two sections, each section being separated from a neighboring section by a recess; arranging a semiconductor body on one of the sections of the first metallization layer; and forming at least one indentation between a first side of the semiconductor body and a closest edge of the respective section of the first metallization layer. A distance between the first side and the closest edge of the section of the first metallization layer is between 0.5 mm and 5 mm.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventor: Olaf Hohlfeld
  • Patent number: 11953481
    Abstract: A method for determining a calibrated measurement value for a concentration of the target gas comprises obtaining a measurement signal based on the concentration of the target gas. The method further comprises determining the calibrated measurement value based on the measurement signal and based on a calibration model. The calibration model is based on calibration data of a plurality of test sensor units having the same type as the sensor unit.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: April 9, 2024
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Caterina Travan, Cecilia Carbonelli, Ulrich Krumbein
  • Patent number: 11953961
    Abstract: An electric switch-mode power converter comprises: a parameter predictor for predicting and updating at least one regulator parameter of a regulator controlling a switching device of the converter, a performance feedback signal generator for providing a performance feedback signal indicative of a performance of the conversion operation, wherein the parameter predictor is configured to predict an update of the regulator parameter based on the performance feedback signal and during update intervals, the intervals being during the power conversion operation and being separated by pauses without update.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies Austria AG
    Inventors: Salman Nazir, Benjamin L. Schwabe
  • Patent number: 11955974
    Abstract: This disclosure is directed to a dual gate metal oxide semiconductor field effect transistor (MOSFET) device formed in a semiconductor material, as well as circuits and techniques for using the dual gate MOSFET device. In some examples, the dual gate MOSFET device may comprise a first MOSFET formed in the semiconductor material, and a second MOSFET formed in the semiconductor material, wherein the first MOSFET and the second MOSFET are arranged in parallel in the semiconductor material, wherein the first MOSFET and the second MOSFET include a common drain node and a common source node, and wherein the first MOSFET and the second MOSFET define different transfer characteristics.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dirk Ahlers, Manuel Wilke, Benjamin Schmidt, Jonas Groenvall
  • Patent number: 11955407
    Abstract: An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies Austria AG
    Inventors: Edward Fuergut, Davide Chiola, Martin Gruber, Wolfram Hable
  • Patent number: 11956097
    Abstract: A method, in particular for a battery management system, is described. According to one exemplary embodiment, the method comprises providing a digital message which comprises a multiplicity of frames, wherein the multiplicity of frames comprises an ID frame, at least one data frame and a checksum frame. The checksum frame includes a checksum value which has been calculated based on the data included in the other frames. The method further comprises generating a CAN message, wherein the data included in the data frame(s) and the checksum frame are inserted into a data field of the CAN message and wherein an identifier included in the ID frame is inserted into an ID field of the CAN message. The method further comprises transmitting the CAN message via a CAN bus line and receiving the CAN message and reconstructing the digital message.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventor: Guenter Hofer
  • Patent number: 11956188
    Abstract: A controller may receive a message provided by a network node included in an in-vehicle communication network. The controller may identify one or more characteristics of the message, the one or more characteristics indicating at least one of a message type of the message, a security property of the message, or a secure zone (SZ) associated with the message. The controller may determine a priority of the message based at least in part on the one or more characteristics. The controller may provide the message to an output buffer based at least in part on the priority of the message, the output buffer being one of a plurality of output buffers.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Alexander Zeh, Anjana Ramamoorthy, Donjete Elshani Rama
  • Patent number: 11955957
    Abstract: In accordance with an embodiment, a circuit for driving an electronic switch includes a control circuit configured to trigger a switch-on and a switch-off of the electronic switch in accordance with an input signal, wherein the control circuit is further configured to trigger the switch-off of the electronic switch in response to an under-voltage signal signaling an under-voltage state; and an under-voltage detection circuit configured to signal the under-voltage state when a supply voltage received at a supply node is below an under-voltage threshold value, wherein the under-voltage threshold value depends on a load current passing through the electronic switch.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: April 9, 2024
    Assignee: Infineon Technologies AG
    Inventors: Christian Djelassi-Tscheck, Michael Asam, Mirko Bernardoni, David Jacquinod, Andre Mourrier, Mario Tripolt