Abstract: a reference voltage generating circuit that includes a bandgap reference voltage generating circuit main body (10) configured to generate a substantially constant reference voltage at room temperature, a high temperature correction circuit (30) configured to increase a reference voltage generated by the reference voltage generating circuit main body at a high temperature by supplying a high temperature correction current that increases as the temperature increases to the resistor, a low temperature correction circuit (40) configured to increase a reference voltage generated by the reference voltage generating circuit main body at a low temperature by supplying a low temperature correction current that increases as the temperature decreases to the resistor, and a bias circuit (20) configured to generate a bias voltage according to the temperature, so as to control the high temperature correction current and the low temperature correction current at the same time.

Abstract: An ultrasonic sensor in the invention includes an ultrasonic transmitter, an ultrasonic receiver, and a detector. The ultrasonic transmitter transmits pulse-shaped ultrasonic waves to a thin plate to excite the thin plate. The ultrasonic receiver receives direct waves and reflected waves among the ultrasonic waves propagating in the thin plate excited by the pulse-shaped ultrasonic waves, the direct waves propagating only in the thin plate, and the reflected waves radiating outward, then reflected by the object, and returning to the thin plate. The detector detects the object present near the thin plate on the basis of a difference between a time at which the ultrasonic receiver receives the direct waves and a time at which the ultrasonic receiver receives the reflected waves.

Abstract: One embodiment provides a switching regulator circuit having an overcurrent protection function that enables complete overcurrent protection though simple in configuration. The switching regulator circuit generates an output signal while boosting an input voltage by switching on/off a switching element using a PWM signal. The switching regulator circuit is equipped with a load switch which is connected to the switching element in series and is normally on. And, the switching regulator circuit is further equipped with an overcurrent protection circuit which keeps the load switch off if a current flowing through the switching element is an overcurrent.

Abstract: A metal member which allows a waveguide to extend inside a dielectric substrate and is adapted to hold a short-circuit metal layer at a potential same as a potential of the waveguide is made to remain along cross-sections of the two wide walls of the waveguide and is removed along cross-sections of two narrow walls of the waveguide so as to prevent an electromagnetic wave from unintendedly being radiated.

Abstract: An orthogonal separation device of the invention includes a demodulator that performs a demodulation process corresponding to each of a plural number N of antennas for each of a plural number P (=M×N) of pulse waves (R11 to R1M), . . . , (RN1 to RNM) which arrives at the plural number N of antennas by transmitting, at the same time, a plural number M of pulse waves having phases ?1 to ?M set as different arrays of known discrete values and that generates a plural number P of demodulated signals (R?11 to (R?1M), . . . (R?N1 to R?NM), and includes a phase adjuster that adjusts difference among the phases of a plural number P of demodulated signals (R?11 to R?1M), . . . , (R?11 to R?NM) according to the arrays of known discrete values and generates a plural number P of in-phase signals (r11 to r1M), . . . , (rN1 to rNM).

Abstract: a reference voltage generating circuit that includes a bandgap reference voltage generating circuit main body (10) configured to generate a substantially constant reference voltage at room temperature, a high temperature correction circuit (30) configured to increase a reference voltage generated by the reference voltage generating circuit main body at a high temperature by supplying a high temperature correction current that increases as the temperature increases to the resistor, a low temperature correction circuit (40) configured to increase a reference voltage generated by the reference voltage generating circuit main body at a low temperature by supplying a low temperature correction current that increases as the temperature decreases to the resistor, and a bias circuit (20) configured to generate a bias voltage according to the temperature, so as to control the high temperature correction current and the low temperature correction current at the same time.

Abstract: To achieve an opto-reflector in which a distance to a detection target is shortened to be able to detect the position of the closer detection target, and thereby contributing to the reduction of the arrangement space. The opto-reflector (10) includes a plate-shaped substrate (11); a light emitting element (13) and a light receiving element (14) mounted on the substrate (11); light transmitting resin layer (12) which seals the light emitting element (13) and the light receiving element (14); and a light shielding portion (21) provided between the light emitting element (13) and the light receiving element (14). The light shielding portion (21) is formed at a height such that a part of light beam can be directly transferred between the light emitting element (13) and the light receiving element (14) via the light transmitting resin layer (12).

Abstract: One embodiment provides an electric leakage detecting device for shutting off an AC electric circuit. A digital comparator generates a detection signal by comparing an output signal corresponding to output signals of a zero-phase current transformer with positive and negative thresholds, a control signal generator generates a control signal based on the detection signal, and a judging device generates a judgment signal if an electric leakage state is judged. In addition, a delay counter generates a final control signal if the judgment signal has been received continuously more than a first prescribed time, a reset counter resets every time the control signal is received, and resets the judging device and the delay counter if the control signal is not received in a second prescribed time, and a switch driving circuit shuts off the AC electric circuit based on the final control signal.

Abstract: A switching power supply device includes a switching transistor, a sense resistor connected to the switching transistor in series and on which a sense voltage generates when the switching transistor is turned on, a transformer including a first winding to which an input voltage is applied when the switching transistor is turned on and a second winding connected to a load, an optocoupler in which an optocoupler current is generated based on an output voltage on the second winding side, a load power detection circuit that generates a load power signal in accordance with a turn-on period of the switching transistor, a turn-on period control circuit, a turn-off period control circuit, and an SRFF circuit.

Abstract: A vehicle radar device provided with a transmission and reception unit for generating a beat signal from a transmission signal and a reception signal, a frequency analysis unit for generating a two-dimensional spectrum including a speed component and a distance component by applying prescribed frequency analysis processing to a signal sequence of the beat signal, and a speed determination unit for dividing the speed component of the two-dimensional spectrum into a plurality of blocks, carrying out constant false alarm rate (CFAR) processing on each of the plurality of blocks, and specifying the speed of the vehicle of the radar device on the basis of a threshold obtained through the CFAR processing.

Abstract: A two-port triplate-line/waveguide converter in one embodiment of this invention is provided with a rectangular waveguide and two probes that connect to central conductors of separate trip late lines via slits, said slits being formed separately on two opposing inside walls of the rectangular waveguide and lying on an imaginary straight line that is perpendicular to said inside walls. The two probes, the tips of which are bent inside the rectangular waveguide, constitute monopole antennas with the aforementioned inside walls functioning as the ground planes thereof.

Abstract: A feed line in the form of a trip late line that runs from a waveguide/triplate-line converter coupled to a radio to a plurality of patch antennas in a cluster pattern. The width and length of a section of said feed line between the waveguide/triplate-line converter and the branch point nearest thereto are set such that the impedance of said section directly matches the parallel combination of the impedances of branches beyond said branch point and the loss in said section is kept to or below a predetermined upper limit.

Abstract: One embodiment provides an analog front-end circuit. When a chopping signal has a first logical value, a non-inverting instrumentation preamplifier subtracts a second input voltage from a first input voltage and generates a first output voltage by amplifying a subtraction voltage while outputting the second input voltage as a second output voltage. When the chopping signal has a second logical value, the non-inverting instrumentation preamplifier subtracts the first input voltage from the second input voltage and generates the first output voltage by amplifying and then inverting the polarity of a subtraction voltage while outputting the second input voltage as the second output voltage.

Abstract: An orthogonal separation device of the invention includes a demodulator that performs a demodulation process corresponding to each of a plural number N of antennas for each of a plural number P (=M×N) of pulse waves (R11 to R1M), . . . , (RN1 to RNM) which arrives at the plural number N of antennas by transmitting, at the same time, a plural number M of pulse waves having phases ?1 to ?M set as different arrays of known discrete values and that generates a plural number P of demodulated signals (R?11 to (R?1M), . . . (R?N1 to R?NM), and includes a phase adjuster that adjusts difference among the phases of a plural number P of demodulated signals (R?11 to R?1M), . . . , (R?11 to R?NM) according to the arrays of known discrete values and generates a plural number P of in-phase signals (r11 to r1M), . . . , (rN1 to rNM).

Abstract: A surface acoustic wave sensor of the invention includes: a piezo element that propagates a surface acoustic wave; an electrode that carries out conversion of an electrical signal and a surface acoustic wave; and a porous base member into which liquid infiltrates and which comes into contact with the piezo element.

Abstract: One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.

Abstract: An object characteristics measurement apparatus of the invention includes a surface acoustic wave device. The surface acoustic wave device includes: an interdigitated electrode that is formed on a first surface on a piezoelectric substrate, excites an elastic wave, and receives reflection based on the elastic wave; a reflector that has a third surface and a fourth surface between the interdigitated electrode and a second surface orthogonal to the first surface in a propagation direction of the elastic wave; a reaction field that is formed between the interdigitated electrode and the reflector, in which the measured object is to be loaded; and a propagator that is formed between the reflector and the second surface.

Abstract: There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.

Abstract: A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.

Abstract: An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element 10, the titanium layer 20 and the aluminum layer 21 are formed as the electrode 15 on the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wire 16 to the aluminum layer 21 of the electrode 15 while applying ultrasonic wave, the copper-aluminum compound layer 23 (Al4Cu9, AlCu or the like) is formed between the copper wire 16 and the titanium layer 20.