Patents Assigned to Lintec Corporation
  • Publication number: 20240150629
    Abstract: Provided are an energy ray-crosslinkable pressure sensitive adhesive composition, a pressure sensitive adhesive sheet containing the composition, a crosslinked pressure sensitive adhesive obtained by crosslinking the composition using an energy ray, a method for producing the crosslinked pressure sensitive adhesive, a pressure sensitive adhesive sheet containing the crosslinked pressure sensitive adhesive, and a method for producing the pressure sensitive adhesive sheet. The energy ray-crosslinkable pressure sensitive adhesive composition contains: (A) a block copolymer of an aromatic vinyl compound and a diene compound, the block copolymer containing a vinyl group in a side chain; (B) a tackifier having a softening point of 80° C. or higher and 150° C. or lower; and (C) a photopolymerization initiator.
    Type: Application
    Filed: March 28, 2022
    Publication date: May 9, 2024
    Applicant: LINTEC CORPORATION
    Inventor: Kenta NISHIJIMA
  • Publication number: 20240150624
    Abstract: [Problem] A release liner and an adhesive sheet with which contact area of an adhesive layer on an adherend is reduced at positioning and adhesive force can excellently develop at the adhesive layer after positioning are provided. [Solution] A release liner 100 has a surface 101 at which concave portions 120 are formed. The concave portion narrows toward a deepest part 121, and a portion 110 between the concave portions has a convex sectional shape in a thickness direction D1 of the release liner. The convex sectional shape narrows at a continuous tilt from the deepest part to an apex 111 of the convex sectional shape, and in the convex sectional shape, a width w at a height of ½h, which is half of a height h, and the height h have a relation of w>h.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 9, 2024
    Applicant: LINTEC Corporation
    Inventors: Takuma OKUBO, Akihito YAMADA
  • Patent number: 11974504
    Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: April 30, 2024
    Assignee: LINTEC CORPORATION
    Inventors: Yuta Seki, Kunihisa Kato, Tsuyoshi Muto
  • Publication number: 20240117222
    Abstract: A pressure sensitive adhesive used in optical applications. The pressure sensitive adhesive contains a modified cyclodextrin having a degree of modification of more than 2.5 and 3.0 or less. The gel fraction of the pressure sensitive adhesive is 1.0% or more. Such a pressure sensitive adhesive is excellent in the durability even at high temperatures.
    Type: Application
    Filed: January 27, 2022
    Publication date: April 11, 2024
    Applicant: LINTEC CORPORATION
    Inventors: Sho KOSABA, Takayuki ARAI, Mikihiro KASHIO
  • Patent number: 11948865
    Abstract: A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: April 2, 2024
    Assignee: LINTEC CORPORATION
    Inventors: Takeshi Mori, Isao Ichikawa, Hidekazu Nakayama
  • Patent number: 11942353
    Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: March 26, 2024
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11940635
    Abstract: A light diffusion control body includes at least two light diffusion control layers each having a regular internal structure. The regular internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The at least two light diffusion control layers includes a first light diffusion control layer and a second light diffusion control layer each having a minimum value of a haze value of 35% or more. The haze value is measured when one surface of each of the first light diffusion control layer and the second light diffusion control layer is irradiated sequentially with a light ray at an incident angle of ?70° to 70° with respect to the normal direction of the surface being 0°.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: March 26, 2024
    Assignee: LINTEC CORPORATION
    Inventors: Baku Katagiri, Kentaro Kusama, Tatsuki Kuramoto
  • Publication number: 20240059091
    Abstract: An object is to provide an inkjet printing sheet that can suppress uneven printing by suppressing variation in the interference among dots in an ink-receiving layer surface. This object was achieved by a sheet for inkjet printing, the sheet having a multilayer structure including in this order an ink-receiving layer, a base material, a pressure sensitive adhesive layer, and a release liner, the release liner including a silicone-based release agent layer on a contact face with the pressure sensitive adhesive layer, the ink-receiving layer including a composition for forming ink-receiving layer containing a resin and a silicone-based leveling agent. A content of the silicone-based leveling agent is 0.005 parts by mass or greater and less than 0.30 parts by mass per 100 parts by mass of the resin.
    Type: Application
    Filed: January 7, 2021
    Publication date: February 22, 2024
    Applicant: LINTEC CORPORATION
    Inventors: Takuma OKUBO, Nana SUZUKI
  • Publication number: 20240052210
    Abstract: A pressure sensitive adhesive sheet having a pressure sensitive adhesive layer that includes at least one colored pressure sensitive adhesive layer, the colored pressure sensitive adhesive layer having a pressure sensitive adhesive that contains a colorant, the pressure sensitive adhesive layer having a lightness L* of 90 or less as defined by a CIE 1976 L*a*b* color system, the pressure sensitive adhesive layer having a total luminous transmittance of 3% or more and a thermal conductivity of 0.1 W/m·K or more.
    Type: Application
    Filed: October 29, 2021
    Publication date: February 15, 2024
    Applicant: LINTEC CORPORATION
    Inventors: Sho KOSABA, Yoichi TAKAHASHI
  • Publication number: 20240052209
    Abstract: A pressure sensitive adhesive sheet may include a base material and a hot-melt pressure sensitive adhesive layer which contains a softener, and further include a barrier layer disposed between the base material and the hot-melt pressure sensitive adhesive layer, the barrier layer containing at least one selected from the group consisting of a polyester-based resin, a polyurethane-based resin, and a polyolefin-based resin. The polyester-based resin may be at least one of a polyester resin or a modified polyester resin.
    Type: Application
    Filed: November 22, 2021
    Publication date: February 15, 2024
    Applicant: LINTEC CORPORATION
    Inventors: Toshiaki NAGASAWA, Ayaka SETO, Kenta YAMAZAKI, Shinya SUZUKI
  • Publication number: 20240044369
    Abstract: A device EA that manufactures a projection-bearing body having a structure in which projections CV are formed on a bearing sheet BS comprises: a material transfer unit 10 that executes a material transfer step of transferring a base material BM containing a plastic material PM; a material support unit 20 that executes a material support step of supporting the base material BM transferred by the material transfer unit 10, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; and a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material PM. In the base material BM, the plastic material PM is stacked on one surface of the bearing sheet BS.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 8, 2024
    Applicant: LINTEC CORPORATION
    Inventor: Yosuke KOMA
  • Patent number: 11891491
    Abstract: A writing feel improving sheet comprising a base material and a writing feel improving layer with which a touch pen is brought into contact, wherein when a touch pen having a pen tip of 0.5 mm diameter is used to bring the pen tip into contact with a surface of the writing feel improving layer with which the touch pen is brought into contact and the touch pen is then linearly slid at a speed of 1.6 mm/second while applying a load of 200 g to the touch pen and maintaining an angle formed between the touch pen and the surface at 45°, a difference between a maximum value and a minimum value of frictional force generated between the pen tip and the surface is 80 mN or more and 300 mN or less, wherein the frictional force is measured between a point at which a sliding distance is 10 mm and a point at which the sliding distance is 100 mm. The writing feel improving sheet makes it possible to well reproduce the writing feel experienced when writing on paper with a ballpoint pen.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: February 6, 2024
    Assignee: LINTEC CORPORATION
    Inventors: Hiroki Hoshino, Tomoo Orui
  • Patent number: 11895919
    Abstract: Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13).
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: February 6, 2024
    Assignee: LINTEC CORPORATION
    Inventors: Masaya Todaka, Kunihisa Kato, Tsuyoshi Muto, Yuma Katsuta
  • Patent number: 11882766
    Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 23, 2024
    Assignee: LINTEC Corporation
    Inventors: Wataru Morita, Kunihisa Kato, Yuta Seki
  • Publication number: 20240023441
    Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the
    Type: Application
    Filed: October 28, 2021
    Publication date: January 18, 2024
    Applicant: LINTEC CORPORATION
    Inventors: Yuta SEKI, Kunihisa KATO, Wataru MORITA, Mutsumi MASUMOTO
  • Publication number: 20240001625
    Abstract: A device EA that manufactures a projection-bearing body CB in which projections CV are formed comprises: a material support unit 20 that executes a material support step of supporting a base material BM, by a support member 22 having a support surface 22A in which recesses 22B corresponding to the projections CV are formed; a press unit 30 that executes a pressing step of pressing the base material BM in a direction toward the support surface 22A to fill the plastic material PM in the recesses 22B and forming the projections CV from the plastic material to form the projection-bearing body CB; and a separating unit 60 that executes a separating step of separating the projection-bearing body CB from the support member 22. The support member 22 has a structure dividable into a plurality of support members, and the separating unit 60 includes an individually separating unit 63 that separates the divided first and second support member 22?, 22? individually from the projection-bearing body CB.
    Type: Application
    Filed: September 12, 2023
    Publication date: January 4, 2024
    Applicant: LINTEC CORPORATION
    Inventor: Yosuke KOMA
  • Publication number: 20230417959
    Abstract: A viewing angle control film having an incident light diffusion angle region, wherein when the viewing angle control film is installed vertically to a ground surface, the incident light diffusion angle region in an up-down direction does not include a front face 0° in a horizontal direction with respect to the ground surface, and a total luminous transmittance at the front face 0° is 85% or more and 100% or less. The viewing angle control film preferably has a louver-shaped internal structure including a plurality of regions having a relatively high refractive index (plate-like high refractive index regions) in a region having a relatively low refractive index (low refractive index region).
    Type: Application
    Filed: March 29, 2023
    Publication date: December 28, 2023
    Applicant: LINTEC CORPORATION
    Inventors: Tatsuki KURAMOTO, Hiroki FUKUSHIMA, Baku KATAGIRI, Kentaro KUSAMA
  • Patent number: 11842916
    Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 12, 2023
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11840651
    Abstract: A pressure sensitive adhesive sheet for batteries that includes a base material, a vapor-deposition insulating film provided on one surface side of the base material, and a pressure sensitive adhesive layer provided on a surface side of the vapor-deposition insulating film opposite to the base material.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: December 12, 2023
    Assignee: LINTEC CORPORATION
    Inventors: Takeshi Ansai, Yuichi Kurata
  • Publication number: 20230380288
    Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric
    Type: Application
    Filed: October 28, 2021
    Publication date: November 23, 2023
    Applicant: LINTEC CORPORATION
    Inventors: Yuta SEKI, Kunihisa KATO, Wataru MORITA, Katsuhiko HORIGOME, Mutsumi MASUMOTO