Abstract: A reflective display body includes a light diffusion control layer and a reflective layer. The light diffusion control layer has a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The regions having the relatively high refractive index extend from one surface side toward the other surface side of the light diffusion control layer, and a straight line parallel to the extending direction is tilted with respect to the thickness direction of the light diffusion control layer. When a vector C is obtained by projecting a vector, which is parallel to the extending direction and directed from the surface side distal to the display surface of the reflective display body toward the display surface side, onto the display surface, the smallest angle among three angles between vector C and vectors D1 to D3 is more than 0° and 45° or less.

Abstract: A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1<B1<A1+200 seconds” and a relationship of “A1<2000 seconds”.

Abstract: A sheet pasting device EA which pastes an adhesive sheet AS on a work WK includes: a feeding unit 10 which feeds the adhesive sheet AS; a holding unit 20 which holds the adhesive sheet AS fed by the feeding unit 10, on a holding surface 21A of a holding member 21; a press unit 30 which moves the holding unit 20 holding the adhesive sheet AS and presses the adhesive sheet AS against an attachment surface WK1 of the work WK to paste the adhesive sheet AS; and an attachment surface posture detecting unit 40 which detects at least one of the direction and the position of the attachment surface WK1 of the work WK moving relative to the sheet pasting device EA.

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.

Abstract: A method for producing an intermediate for thermoelectric conversion modules may avoid a supporting substrate, enabling annealing of a thermoelectric semiconductor material in a form avoiding a joint to an electrode, and enabling annealing of a thermoelectric semiconductor material at an optimum temperature. Such methods may produce an intermediate for thermoelectric conversion modules containing a P-type thermoelectric and an N-type thermoelectric element layer of a thermoelectric semiconductor composition, and include (A) forming the P-type thermoelectric element layer and the N-type thermoelectric element layer on a substrate; (B) annealing the P-type and N-type thermoelectric element layer formed in (A); (C) forming a sealant layer containing a curable resin or a cured product thereof, on the P-type and N-type thermoelectric element layer annealed in (B); and (D) peeling the P-type and the N-type thermoelectric element layer and also the sealant layer formed in (B) and (C) from the substrate.

Abstract: A writing feel improving sheet comprising a base material and a writing feel improving layer with which a touch pen is brought into contact, wherein when a touch pen having a pen tip of 0.5 mm diameter is used to bring the pen tip into contact with a surface of the writing feel improving layer with which the touch pen is brought into contact and the touch pen is then linearly slid at a speed of 1.6 mm/second while applying a load of 200 g to the touch pen and maintaining an angle formed between the touch pen and the surface at 45°, a difference between a maximum value and a minimum value of frictional force generated between the pen tip and the surface is 80 mN or more and 300 mN or less, wherein the frictional force is measured between a point at which a sliding distance is 10 mm and a point at which the sliding distance is 100 mm. The writing feel improving sheet makes it possible to well reproduce the writing feel experienced when writing on paper with a ballpoint pen.

Abstract: A roll and a method for producing a roll which are capable of effectively preventing tunneling are provided. A roll includes a core having a tubular shape and a laminate wound around the core. The laminate includes a process film, a surface coat layer, a substrate layer, an adhesive layer, and a release liner, in this order, in a laminating direction. The process film is formed from at least one member selected from polyethylene terephthalate (PET), polyolefins, and polyvinyl chloride (PVC). The surface coat layer is formed from a fluorine resin. The release liner is formed from polyethylene terephthalate (PET). The core is formed from an acrylonitrile-butadiene-styrene copolymer resin (ABS) or polypropylene (PP).

Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.

Abstract: Provided are: a method for producing a chip of a thermoelectric conversion material that enables annealing treatment of a thermoelectric conversion material in the form not having a junction with an electrode, and enables annealing of a thermoelectric semiconductor material at an optimum annealing temperature; and a method for producing a thermoelectric conversion module using the chip (13).

Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.

Abstract: A drawing apparatus includes a support for supporting a part of the grown form and a drive unit for causing a relative movement of the support and the grown form. The support includes a plurality of support units arranged in a width direction of the grown form orthogonal to a drawing direction of a plurality of extended forms, the plurality of support drawing the plurality of extended forms from the single grown form.

Abstract: A release liner which makes it difficult for an adhesive layer to impair slidability and makes it easy to exhibit an adhesive force suitably, a method of producing a release liner, an adhesive sheet, and a method of producing an adhesive sheet. A release liner has a surface provided with a ridge portion extending linearly, and on the surface, a plurality of recesses having different depths are randomly formed in a surface direction and are continuously connected.

Abstract: Disclosed is an adhesive composition having components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst. Also provided is a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition and has a thermosetting property. Also disclosed is a sealed body obtained by sealing a seal subject with the sealing sheet. The adhesive composition has excellent adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer is excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.

Abstract: The present invention is to provide a method of producing a thermoelectric conversion device having a thermoelectric element layer with excellent shape controllability and capable of being highly integrated. The present invention relates to a method of producing a thermoelectric conversion device including a thermoelectric element layer formed of a thermoelectric semiconductor composition containing a thermoelectric semiconductor material on a substrate, the method including a step of providing a pattern frame having openings on a substrate; a step of filling the thermoelectric semiconductor composition in the openings; a step of drying the thermoelectric semiconductor composition filled in the openings, to form a thermoelectric element layer; and a step of releasing the pattern frame from the substrate.

Abstract: A laminate used under an environment irradiated with external light includes a light diffusion control film having an internal structure in the film. The internal structure includes a plurality of regions having a relatively high refractive index in a region having a relatively low refractive index. The laminate further includes an ultraviolet absorbing layer located further on the external light incident side than the light diffusion control film. The light diffusion control film has an indentation elastic modulus of 30 MPa or more as measured at a maximum load of 2 mN by a nanoindentation method.

Abstract: The invention relates to a peel detection label that is a laminate including a support, a pattern layer formed in a part of the surface of the support, and a pressure-sensitive adhesive laminate having at least a low modulus layer (X), a high modulus layer (Y) and a pressure-sensitive adhesive layer (Z) in that order, in which the low modulus layer (X) has a surface in contact with the support and the pattern layer and a surface in contact with the high modulus layer (Y), and satisfies the following requirement (1): Requirement (1): when the pressure-sensitive adhesive layer (Z) of the peel detection label is attached to an adherend and then the peel detection label is peeled off from the adherend, the maximum vertical tensile stress applied to an element of the low modulus layer (X) that is located closest to the support is 0.19 MPa or more when analyzed by a finite element method using Abaqus.

Abstract: The invention relates to a peel detection label that is a laminate including a support, a pattern layer formed in a part of the surface of the support, and a pressure-sensitive adhesive laminate having at least a low modulus layer (X), a high modulus layer (Y) and a pressure-sensitive adhesive layer (Z) in that order, in which the low modulus layer (X) has an n-layered structure (where n is an integer of 1 to 10) having a surface in contact with the support and the pattern layer and a surface in contact with the high modulus layer (Y), and the low modulus layer (X) satisfies a specific thickness-average shear storage elastic modulus.

Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.

Abstract: A method for producing a chip of a thermoelectric conversion material formed of a thermoelectric semiconductor composition, including a step of forming a sacrificial layer on a substrate, (B) a step of forming a thermoelectric conversion material layer of a thermoelectric semiconductor composition on the sacrificial layer, (C) a step of annealing the thermoelectric conversion material layer, (D) a step of transferring the annealed thermoelectric conversion material layer to a pressure-sensitive adhesive layer, (E) a step of individualizing the thermoelectric conversion material layer into individual chips of a thermoelectric conversion material, and (F) a step of peeling the individualized chips of a thermoelectric conversion material; and a method for producing a thermoelectric conversion module using the chip produced according to the production method.